JPCA Show / ラージエレクトロニクスショー / WIRE Japan Show /
マイクロエレクトロニクスショー / JISSO PROTEC / ものつくりフェスタ

2015年6月3日（水）～4日（木）　　東6ホール 特設会場　　有料・登録制　同時通訳有

6月3日（水）

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国際セミナー Session I

• 13:00–14:00

  PCB技術の最前線－ストレッチャブル・エレクトロニクスとスマート繊維
  Stretchable electronics and electronic textile, new frontiers for PCB technology

  Mr. Johan De Baets 氏

  Group manager, Center for Microsystems Technology
  Imec

   Profile

  Johan De Baets works at imec since 1995 as a senior research engineer, where he now heads the Centre for Microsystems Technology. He has been involved in a number of European and national research projects on advanced electronic interconnection technologies, stretchable interconnect and electronic textile. He is currently co-ordinating the EC FP7 project “PASTA”.

  Printed circuit board technology has been evolving ever since its beginning, from single-layer to complex multilayer boards, flexible printed circuits, microvia technology, and more recently, into large area circuits on foil, stretchable electronics and electronics on or in textile.
  In this presentation new large area electronic technologies will be presented, with a focus on stretchable interconnections. These stretchable interconnections, in combination with miniaturization of components and circuits, are leading to electronic systems that are flexible, stretchable, comfortable and - with a suited encapsulation - even washable. This technology will lead to the integration of electronics in textile or in molded plastics, with applications in automotive, clothing, housing, technical textiles, healthcare, lighting,...
  The stretchable interconnect technology is based on meander-shaped conductors (Cu, conductive ink) created on flexible material. This can easily be done with known volume-manufacturing processes. The presentation will highlight new processes, reliability test results and new applications of the technology. The work has been supported by the European FP7 projects “Pasta” and “Terasel”.

• 14:00–15:00

  デジタル時代におけるPCB製造方法の変化
  How will PB Manufacturing Change in a Digital Age

  Mr. Hikmat Chammas 氏

  Engineer Fellow, Advanced Manufacturing Engineering
  Honeywell Aerospace

   Profile

  Hikmat Chammas is the AME Electronics Processing and Fabrication Technology Fellow; who serves as the technology focal point for Card Assembly (CCA) manufacturing processes for the aerospace businesses. Hikmat has over 30 years experience in contract manufacturing for the Department of Defense (DoD), as well as, Communication Network Equipment (CNE), and Terminal Product (TP). He pioneered the Surface Mount Technology (SMT) at Hadco (presently known as Sanmina Corporation) and established 4 green fields operations during his career in Circuit Card Assembly (CCA), Backplane compliance technology and vertical integration. He spear headed the development of Design for Manufacturing (DFM) guidelines at Northrop Grumman, and ran training programs for the Hardware & CAD Engineering organizations. Hikmat has extensive experience in technology, including, Surface Mount Technology (BGA, CBGA, μBGA), New Product Development (NPD), Plated through hole (PTH), Press-fit compliance pins (VHDM), expert solder and reflow profiling, ultrasonic welding, plastic molding, sheet metal fabrication, as well as, supporting international and domestic technology processes. Hikmat has lead EPIC 500 Tiger Global Team that optimized the Thermal profile requirements that resulted in improvement of BGAs solderability by 100% and eliminated customer escape due to solder defects. He developed cost modeling and DFM tools for value engineering (VE) that resulted in achieving cost reduction of several million dollars for AOC, A350, A380, block III, EGI, GMLRS, EGPWS, and other systems utilizing DFx methodology. He completed the study on Embedded Passive Technology and presented several white papers on the subject. Hikmat was awarded by IPC the Distinguished committee Service Award in recognition of your outstanding contributions in me 5 - 18 G subcommittee in expediting the completion of IPC 7092, design and assembly process implementation for embedded components. Hikmat is well known in the engineering community as one of the pioneer in the Embedded Active and passive technologies. Hikmat has a Bachelors of Science in Electrical Engineering from State University College at Buffalo, New York. He also completed a manufacturing management program (MMP) studies through Honeywell. He is Design For Six Sigma (DFSS) green belt and Lean Manufacturing certified.

  Continuous demand for additional electrical/electronic functions while maintaining small real-estate has forced the industry toward miniaturization; embedded technology has been used to replace passive surface mounted components such as resistors and capacitor in several telecommunications, radio wave, Space applications. The embedded technology offer significant component placement reduction over the standard Surface Mount Devices (SMD), and improve the utilization of real-estate for additional functionality and improvement in DFM and reduction in COPQ.
  Miniaturization creates major challenges to Printed Board (PB) fabricators. HDI, Micro via, signal routing, trace space/width, aspect ratio, layer count, Impedance control, material and board thickness. These are some of the requirement that will be required to ensure quality and reliably are met in the defense and aerospace industries. Advanced PB Technology has a great potential for high frequency and high density applications.

• 15:00–16:00

  カーエレクトロニクスにおけるPCBへの要求特性と技術トレンド
  Automotive Electronics – Trends and Requirements for Printed Circuit Boards

  Mr. Joerg D. Schaefer 氏

  Head of PCB Technology Development HK
  Robert Bosch

   Profile

  Education

  1989/1995 Physical Metallurgy and Material Science at the University of Stuttgart,
         MS Engineering Degree (Dipl.-Ing.)

  Prof. Education & Career

  Max-Planck-Institute for Metals Research and the University of Stuttgart (D)
  1995 Diploma (MS) in Physical Metallurgy
  1996 Doctoral Graduation Course
  1993/95 Research Associate

  The University of Tokyo, Institute of Industrial Science (Japan)
  1998 Research Associate

  Tohoku National Industrial Research Institute, Sendai, (Japan)
  1998 DAAD Scholarship and Visiting Scientist

  IBM Germany GmbH
  1989 Associate at Failure Analysis Laboratory for Semiconductors, Multilayer Ceramics,
       Printed Circuit Boards and Chemistry.

  Analytics for Technology and Environment GmbH, (D), Spin-Off IBM FA Laboratory
  1998 Head of Physical Analysis and Metallographic Laboratory, Department Manager

  Robert Bosch GmbH (Germany)
  2000 Automotive Electronics, (Rt)Engineering Technology Materials Centre Ceramics;
       Foundation of Materials Centre Ceramics. Deputy Section Manager (AE/ECC)
  2005 Automotive Electronics, (Rt),Engineering Technology for Electronic Circuit Units,
       Sen. Project Manager, Low Temperature Co-Fired Ceramics. (AE/ETC1)
  2010 Automotive Electronics, (Si), Engineering for Assembly and Interconnect Technology.
       Project Manager, Development of Printed Circuit Board Technology, (AE/EAI1)

  Robert Bosch Co. Ltd (Hong Kong, SAR China)
  2012 Automotive Electronics, Head of PCB Technology Development APAC Sen. Manager, (AE/EAI-HK)

  Member of the Journal of Applied Physics, Review Board; American Institute of Physics
  Member of the German Society of Material Science (DGM e.V.)

  Robert Bosch GmbH as one of the largest automotive suppliers in the world is challenging sustainable mobility solutions for the future. One of the trends will be the electrification of the power train as well as an increased number of comfort functions and connected devices in vehicles and other applications.
  The technical requirements for Printed Circuit Board technologies and materials will be deployed from international megatrends, product, reliability and functional needs. Reliable designs have to be realized on each system level and a bottom up approach by a balanced mix of simulation and experimental verifications stimulate the time to market of engineering developments.

6月4日（木）

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国際セミナー Session II

• 10:30–11:00

  インダストリ4.0の時代、方正 ―Founderが考えるPCBの未来とは？

  Mr. Hu Yongshuan 氏

  President
  Zhuhai Founder PCB Development Co., Ltd.

   Profile

  1989年武漢大学大学院卒。化学修士。同年よりPCB業界で就職。PCB工場の管理に豊富な経験を有し、PCB技術も熟知。中国国内の重要刊行物に10点の論文を発表。
  国家、部・委員会の科学技術進歩賞を2度受賞。省・市科学技術進歩賞を3度受賞。

  方正―FounderのPCBの概要と技術レベルを簡単に紹介し、インダストリ4.0が中国のPCB工場にもたらす影響を重点的に分析します。従来のPCB工場を変え、レベルアップさせるための考え方と方向性を提起するとともに、未来のPCB工場を作るにあたっての基本要素を考察します。

• 11:00–11:30

  “興森快捷” ―Fastprint成長の歩み

  Mr. Qiu Xingya 氏

  Chairperson
  Shenzhen Fastprint Circuit Tech Co.,Ltd.

   Profile

  1989年～1991年：　無錫市建材機器機械工場総合計画課
  1991年～1995年：　広州普林回路有限公司経営計画部マネジャー
  1995年～1999年：　広州快捷PCB有限公司総経理
  1999年～2005年：　深圳市興森快捷回路技術有限公司総経理
  2005年～現在：　　  同社から体制転換した深圳市興森快捷回路科学技術股份有限公司（Fastprint）の
  　　　　　　　　　　 董事長（会長）、総経理（社長）

  1．会社成長の歩み：:設立から二十数年の成長を三段階に分け、各段階における重要イベント及び目標をご説明します。
  2．さらなる発展への未来戦略:会社の未来発展戦略の論理的フレームワーク、各業務分野の配置、鍵となる要素等をご説明します。
  3．データで見る成長の軌跡:データを用いて、経営の重点と努力目標をご紹介します。

• 11:30–12:30

  イノベーションドリブン、スマートなモデル転換
  ―“新常態”ニューノーマル時代の中国PCB産業発展の道

  Mr. You Lei 氏

  Chairperson
  CPCA

   Profile

  1969年生まれ。上海の同済大学卒、工商管理修士。研究員級高級工程師（エンジニア）。中・欧国際工商管理学院（上海とEUが創設したビジネススクール）EMBA。中国航空技術輸出入深圳公司企業戦略・管理部マネジャー、深南回路有限公司常務副総経理及び総経理、中国航空技術深圳有限公司（もと中国航空技術輸出入深圳公司）副総経理及び総経理を歴任。
  現在、中国航空技術国際ホールディング有限公司常務副総経理、社内党組織副書記、深南回路股份有限公司董事長（会長）、天馬マイクロエレクトロニクス股份有限公司董事長、成都亜光電子股份有限公司董事長、深圳航空標準部品有限公司董事長。
  この他、中国PCB産業協会理事長、中国航空学会第八期理事会理事、広東航空学会理事長、中国PCB標準委員会副会長、中日電子回路友好促進会会長、深圳市第五期人民代表大会代表会科学技術組組長を兼任。

  中国のPCB産業は長年の低成長期を経て、生産能力の過剰、最終需要の減少、コスト上昇に見舞われている。また、インターネット、インダストリ4.0等の荒波の中、成長が頭打ちとなっている。新たな情勢のもと、ビジネスモデルのイノベーション、産業のスマートなモデル転換が必要である。中日企業の交流を深め、協会・工業会の力によって産業の発展を図りたい。

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国際セミナー Session III

• 14:00–15:00

  欧州PCB産業のビジネス戦略
  Strategies for the printed circuit industry in Europe

  Dr. Udo Bechtloff 氏

  Chairman of the Managing Board
  KSG Leiterplatten GmbH

   Profile

  Mr Bechtloff, born in 1950, studied electronic technology at the University of Applied Sciences in Mittweida, Saxony and earned his doctorate in the field of ceramic metallization in 1977. Afterwards he worked in hybrid manufacturing at Robotron, the most important electronics manufacturer of the former GDR.

  From the mid 80s he was responsible for the set up of a production plant for scientific devices and was its technical manager until 1989.

  Between 1990 and 1996 he worked in several plants and different positions within the Fuba group, finally as the manager of R&D.

  Since January 1997 Mr Bechtloff has served as Chairman of the Managing Board of KSG Leiterplatten GmbH and since 2003 as co-partner as well. From May 2012 he has been holding the title “honorary professor in electronic materials” at the University of Applied Sciences in Mittweida, Saxony.

  Professor Bechtloff is the leader of the working group Printed Circuit Board within the German Electrical and Electronic Manufacturers’ Association ZVEI. Since 2002 he has been member of the Executive Board of the Organic Electronics Association at the German Engineering Foundation VDMA as well as the Steering Committee of the European Interconnect Technology Initiative and the industrial advisory board at the Electronics Packaging Laboratory of the Dresden University of Technology. Furthermore, Mr Bechtloff is spokesman of the advisory board of the Fraunhofer ENAS Chemnitz and is board member at the GMM within the VDE, the Association for Electrical, Electronic and Information Technologies.

  The European Union with its 28 member states and a population of more than 500 Mio. people still is one of the biggest and most important economic regions in the world.
  However, strategies to keep added value within the European Union are inevitable, otherwise the EU will - sooner or later - mutate from a superpower into a buyer´s nation.
  To mention here the electronic market which has become a critical economic factor over the (last) years. Not the entire market in principle, but the manufacturing sector of electronic components for the EU electronic market, the manufacturing of printed circuits included.
  In the 1980ies over 1.500 printed circuit manufacturers existed in Europe. Today only 265 are left over, of whom the majority is located in Germany. By numbers: 82 manufacturers or 31%.
  What are the reasons for this development and which measures have been taken by these European producers in order to counteract?
  This presentation will demonstrate possible solutions as well as positive and successful examples of how European producers operate with the objective of safeguarding the future of the electronic market in the EU.

• 

  15:00–16:00

  世界のPCB, 日本のPCB

  中原　捷雄 氏

  President
  NT Information, Ltd.

   Profile

  1937年、福岡市に生まれる。1938年から1946年まで中国河北省石家荘で育つ。1961年早稲田大学理工学部電工学科卒業。1961年から1963年まで安川電機に勤務。1963年渡米、シアトル市ワシントン大学に留学。1964年12月修士課程卒業。1966年ニューヨーク市コロンビア大学留学。1973年プリント基板の設計理論でコロンビア大学工学博士。1965年から1989年まで米国ニューヨーク州のPhotocircuits Corporation勤務。1990年にプリント基板コンサルティング会社、N.T. Information Ltdを創業、今日に至る。1965年からニューヨーク州ロングアイランド在住。1995年から「NTI-100, 世界のトッププリント基板メーカー」の調査を開始、毎年、秋に発表。

  世界のプリント基板産業の過去、現在、将来について、日本の業界と比較します。

  ※日本語講演・英語同時通訳なし