JPCA Show / Large Electronics Show / WIRE Japan Show / Microelectronics Show / JISSO PROTEC / Monotsukuri Fiesta

NPI Presentation (Exhibitor's seminar)

Wed., June 3 - Fri., June 5, 2015  D Room in East Hall 6 / E Room in East Hall 3  FREE

D Room   D Room   D Room  

10:50-11:20

The Cloud EDA “Quadcept”…The future of Electric CAD

Quadcept,Inc.

10:50-11:20

Presentation of the effective utilization of electrolysis water in the production of printed boards. (clear up for misunderstanding & questions of efficacy of the electrolysis water)

FUJI KIKO CO.,LTD

10:50-11:20

Presentation of the High Temperature Warpage Measurement System

TAKAOKA TOKO CO.,LTD.

11:30-12:00

The latest actual cases of X-ray Fluoroscopic/CT system use for R&D/failure analysis.

SHIMADZU CORPORATION

11:30-12:00

VPS reflow equipment with an void reduction

Techno Alpha Co.ltd.

11:30-12:00

「生産性向上」を実現する高減衰能ゴムカップリング: XGシリーズのご紹介

NabeyaBi-tech Kaisha

12:10-12:40

High reliability and actual results -Introduction of PCB technologies of CMK for “automotive use”

CMK CORPORATION

12:10-12:40 English

Smart Print Circuit Boad with Murata's MAGICSTRAP®

Murata Manufacturing Co., Ltd.

12:10-12:40

Organic Interposer for 2.1D and 2.5D Integration with L/S under 5/5

JCU CORPORATION

12:50-13:20

Proposal of next generation high performance PWB technology.

FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

12:50-13:20

Introduction to the case study of the controller METIS series

ISHIHARA CHEMICAL CO.,LTD.

12:50-13:20

Advanced technical report of flux-free reflow, solder bonding and metal bonding

Ayumi Industry Co., Ltd.

13:30-14:00

3μm thickness Positive DFR which can achieve 40μm pitch by subtractive method using general etching machine.

MICRO PROCESS INC.

13:30-14:00

これから基板設計を始める方の為のCADLUSアシスト機能と遠隔コミュニケーション機能

NISOUL CO.,LTD

13:30-14:00

Phtonic curing topic:Pulse shaping and pulse uniformity

NovaCentrix

14:10-14:40

Research Center for Three-Dimensional Semiconductors of efforts and infrastructure technology

Fukuoka Industry, Science & Technology Foundation Research Center for Three-Dimensional Semiconductors

14:10-14:40

Electroless copper plating process with nano silver catalyst NACE PROCESS

OKUNO CHEMICAL INDUSTRIES CO., LTD.

14:10-14:40

Direct Imaging System solutions that spread from the Ledia (Tentative title)

SCREEN Graphic and Precision Solutions Co., Ltd.

14:50-15:20

Smart Print Circuit Boad with Murata's MAGICSTRAP®

Murata Manufacturing Co., Ltd.

14:50-15:20

Discovering the new apprication for the X-ray radioscopy Fourth edition

BEAMSENSE CO.,LTD

14:50-15:20

Low Dk type adhisive film for High-speed transmission circuits

TOYOCHEM CO.,LTD

15:30-16:00

Material to reduce Solder Crack for automotive application

Hitachi Chemical Co., ltd.

15:30-16:00

Understanding S-parameter easily

Gardien Japan Co., Ltd

15:30-16:00

Introduction of “Low” Silver & Tempurature Solder Material available “Low” Cost Manufacturing

SENJU METAL INDUSTRY CO.,LTD.

16:10-16:40

Introduction of a new X-ray fluorescence film thickness analyzer to achieve high accuracy and high throughput

Hitachi High-tech Science Corporation

16:10-16:40

OKI launched the metal mask cleaning equipment (ACT100Lite).

Oki Communication Systems Co., Ltd.

E Room   E Room   E Room  

10:50-11:20

Copper Filling of Through Holes on Varying Substrate Thickness

Nippon MacDermid Co., Ltd.

10:50-11:20 Chinese

The Study on the Characteristics of High-speed Boards and the Countermeasure of Drill Bits

Shenzhen Jinzhou Precision Technology Corp.,

This seminar has been cancelled

10:50-11:20

Halogen-free IC substrate materials “MEGTRON GX R-1515D/R-1410D”

Panasonic Corporation

11:30-12:00

ダイナトロンが提案する測長/検査ソリューション(データ基準)新製品 自動PCB寸法測定機「QuickSCALE」についての製品紹介。

Dynatron Co.,LTD.

11:30-12:00

Vision inspection proposal for Substrate material with high quality requirement

YASUNAGA CORPORATION

11:30-12:00

EcoFlash -Next Level of Enhanced Isotropic Etchants-

Atotech Japan K.K.

12:10-12:40

Revolutionary new atomization machine “G-smasher” ~Principle and practical examples of atomization~

RIX CORPORATION

12:10-12:40

Through hall filling process for fine patterning CU-BRITE TF4

JCU CORPORATION

12:10-12:40

VitroCoat GI Adhesion Enabling Technology for Reliable Metallization and Patterning of Glass Interposers

Atotech Japan K.K.

12:50-13:20

New type vertical continues plating system for electro-less copper plating U-VCPS

C. Uyemura & Co., Ltd.

12:50-13:20

Revolutionary new atomization machine “G-smasher” ~Principle and practical examples of atomization~

RIX CORPORATION

12:50-13:20

Proposal of next generation high performance PWB technology.

FUJITSU INTERCONNECT TECHNOLOGIES LIMITED

13:30-14:00

Ultra Low CTE Core Material for APU(FC-CSP) Application / MCL-E-770G

Hitachi Chemical Co., Ltd.

13:30-14:00

Proposal to digitization of the printing technology ~Optimization of priting conditions by rheology analyzer and simulation analysis~

TENRYUSEIKI Co.,Ltd.

13:30-14:00

Surface finishing technology trend for fine line less than L/S 5μm patterning

MELTEX INC.

14:10-14:40

Diversified needs on EMS market and UMC's Challenges in Automotives, Smart Grid, Wearable and other new market.

UMC Electronics Co., Ltd.

14:10-14:40

Introduction of Orbotech Automated Optical Rework (AOR) System

Orbotech Japan Co., Ltd.

14:10-14:40

Introduction of the coated tools realizing cost reduction

UNION TOOL CO.

14:50-15:20

Visualization of plasma processing effect using plasma indicator PLAZMARK®

SAKURA COLOR PRODUCTS CORPORATION

14:50-15:20

New gold plating solutions for surface finishing of substrate

MATSUDA SANGYO CO., LTD

14:50-15:20

New Routing Environment & Technology:Timing Vision, AiXX

Cadence Design Systems, Japan

15:30-16:00

Double-side FCCL with conductive through-hole for cost and process saving

ARAKAWA CHEMICAL INDUSTRIES, LTD.

15:30-16:00

ORC's state-of-the-art Direct Imaging System

ORC MANUFACTURING CO.,LTD.

15:30-16:00

The introduction of solvent-soluble polyimide characterized by high heat resistance, low Dk and low Df

ARAKAWA CHEMICAL INDUSTRIES, LTD.

16:10-16:40

Solder Resist for Direct Imaging

TAMURA CORPORATION

Wed., June 3

D Room
10:50-11:20
  • The Cloud EDA “Quadcept”…The future of Electric CAD

    Yasuhisa Morimoto

    Quadcept,Inc. Marketing Strategist

    Quadcept have changed a lot in E-CAD market. This time, we present to you the future of E-CAD with introduing our innovation history.

    Apply to

    TEL. 06-4802-1007 

11:30-12:00
  • The latest actual cases of X-ray Fluoroscopic/CT system use for R&D/failure analysis.

    Yoshio Kuni

    SHIMADZU CORPORATION Analytical & Measuring Instruments Division Global Marketing Department, Manager

    The principle and the latest applications of X-ray non-destructive inspection: analysis for electrical parts,LED, storage battery, composite material.

    Apply to

    Please come visit D Room directly if you'd like to audit.

12:10-12:40
  • High reliability and actual results -Introduction of PCB technologies of CMK for “automotive use”

    Seiji Yamamoto

    CMK CORPORATION Automotive Technology Section Production Technology Division Team Leader

    Introduction of Automotive PCB technology-SEPT(Solder Crack Prevention) CARFT(RF) CMK-COMP)(High Current Heat Radiation)

    Apply to

    Please come visit D Room directly if you'd like to audit.

12:50-13:20
  • Proposal of next generation high performance PWB technology.

    Kenichiro Abe

    FUJITSU INTERCONNECT TECHNOLOGIES LIMITED Director, New Product Development Department, Development Division

    Propose the new Anylayer Via structure PWB, which meets requirements below;
    1. Improve design performance
    2. Improve transmission loss
    3. Improve TAT

    Apply to

    Please come visit D Room directly if you'd like to audit.

13:30-14:00
  • 3μm thickness Positive DFR which can achieve 40μm pitch by subtractive method using general etching machine.

    Shigeki Watanabe

    MICRO PROCESS INC. Marketing

    Features
    1) Excellent adhesion during development and etching to a Profile-Free copper foil.
    2) Better etching resolution compared to thick DFR.

    Apply to

    Please come visit D Room directly if you'd like to audit.

14:10-14:40
  • Research Center for Three-Dimensional Semiconductors of efforts and infrastructure technology

    Kanta Nogita

    Fukuoka Industry, Science & Technology Foundation Research Center for Three-Dimensional Semiconductors Deputy Director

    I report the activity of Research Center for Three-Dimensional Semiconductors and elemental technologies

    Apply to

    Please come visit D Room directly if you'd like to audit.

14:50-15:20
  • Smart Print Circuit Boad with Murata's MAGICSTRAP®

    Ikuhei Kimura

    Murata Manufacturing Co., Ltd. RFID Project, Technology Integrated Products Dept. New Products & Business Division Murata Mfg. Co., Ltd.

    Murata Mfg. Co., Ltd. introduces a RFID devise “MAGICSTRAP®”, for the ultimate traceability and functionality on PCB for the decade of Industry 4.0.

15:30-16:00
  • Material to reduce Solder Crack for automotive application

    Takayo Kitajima

    Hitachi Chemical Co., ltd. Printed Wiring Board Materials R&D Dept. Advanced Core Materials Business Sector

    We will introduce low elastic modulus material TD-002 which enables solder crack prevention under applied to PWBs surface of standard material.

E Room
10:50-11:20
  • Copper Filling of Through Holes on Varying Substrate Thickness

    Jim Watkowski

    Nippon MacDermid Co., Ltd. MacDermid, Inc.

    A through hole fill process that provides defect free filled holes on substrates ranging from 0.2mm to 0.8mm thick with varying aspect ratios.

    Apply to

    TEL. 044-820-1181 FAX. 044-812-4485 Japan.sales@macdermid.com

11:30-12:00
  • ダイナトロンが提案する測長/検査ソリューション(データ基準)新製品 自動PCB寸法測定機「QuickSCALE」についての製品紹介。

    Junichi Kitamura

    Dynatron Co.,LTD. Sales Division

    測定テーブルに基板を置くだけで、ガーバーデータで指定した箇所を自動で瞬間測長。設計値と測長値を合否判定。測定結果は、印刷やエクセルにレポート出力。 

    Apply to

    TEL. 03-3940-9081 FAX. 03-3940-9080 sales@dynatron.co.jp

12:10-12:40
  • Revolutionary new atomization machine “G-smasher”
    ~Principle and practical examples of atomization~

    Kazuyoshi Ohishi

    RIX CORPORATION GS System Division Nanoparticle System Division Business Development Headquarters

    Introduce the detail of G-smasher's features and some examples of dispersion such as ductil metals particles (Ag, Cu, Ni) without surface damages.

    Apply to

    TEL. 092-935-8013 FAX. 092-936-8470 gskai@rix.co.jp

12:50-13:20
  • New type vertical continues plating system for electro-less copper plating
    U-VCPS

    Shunsaku Hoshi

    C. Uyemura & Co., Ltd. Research and Development Division, Central Research Laboratory

    Electro-less copper plating for thin panel is difficult to keep stable conveyance. we devloped new type vertical continues plating system “U-VCPS”.

    Apply to

    Please come visit E Room directly if you'd like to audit.

13:30-14:00
  • Ultra Low CTE Core Material for APU(FC-CSP) Application / MCL-E-770G

    Ryoichi Uchimura

    Hitachi Chemical Co., Ltd. Printed Wiring Board Materials R&D Dept., Advanced Core Materials Business Sector

    MCL-E-770G has an ultra low CTE of 1.8 ppm/℃ by applying a novel resin system and it can remarkably reduce the warpage for thinner CSP application.

14:10-14:40
  • Diversified needs on EMS market and UMC's Challenges in Automotives,
    Smart Grid, Wearable and other new market.

    Kazuhisa Takasu

    UMC Electronics Co., Ltd. Director Executive Vice President

    Some advanced technology market area such as Automotive, Smart Grid, or Wearable make Japanese EMS players to transform from just a “sub-contractor” to “strategic value chain partner”. UMC would like to introduce successful cases.

14:50-15:20
  • Visualization of plasma processing effect using plasma indicator PLAZMARK®

    Seisaku Ohshiro

    SAKURA COLOR PRODUCTS CORPORATION Manager of Central R&D New Business Development

    Plasma indicator PLAZMARK® shows plasma processing effects by changing of color. PLAZMARK® is useful for check the plasma density and 2D uniformity.

    Apply to

    Please come visit E Room directly if you'd like to audit.

15:30-16:00
  • Double-side FCCL with conductive through-hole for cost and process saving

    Akihisa Hamazawa

    ARAKAWA CHEMICAL INDUSTRIES, LTD. POMIRAN BUSSINESS CORPS, ELECTRONIC MATERIALS DIVISION

    We propose an application of double-side FCCL with conductive through-hole by wet plating method on PI film for process and cost saving.

    Apply to

    TEL. 03-5645-7804 FAX. 03-5645-7867 hikari_info@arakawachem.co.jp

    Please come visit E Room directly if you'd like to audit.

Thu., June 4

D Room
10:50-11:20
  • Presentation of the effective utilization of electrolysis water in the production of printed boards. (clear up for misunderstanding & questions of efficacy of the electrolysis water)

    Yasuaki Nishio

    FUJI KIKO CO.,LTD SALES ENGINEER

    Introducing more beneficial use and new usage technique of the electrolysis water to solve problems in the printed board production field.

    Apply to

    Please come visit D Room directly if you'd like to audit.

11:30-12:00
  • VPS reflow equipment with an void reduction

    Takahisa Oshita

    Techno Alpha Co.ltd.

    製品の小型化やSMT実装部品の微細化などにより問題視されている半田ボイド。これを低減する方法の一つとしてVPSリフロー装置によるリフローが挙げられます。ボイド低減になぜVPSリフロー装置なのか?その謎について解明します。

    Apply to

    TEL. 03-3492-7421 FAX. 03-3492-2580 oshita@technoalpha.co.jp

12:10-12:40
  • Smart Print Circuit Boad with Murata's MAGICSTRAP® English

    Ikuhei Kimura

    Murata Manufacturing Co., Ltd. RFID Project, Technology Integrated Products Dept. New Products & Business Division Murata Mfg. Co., Ltd.

    Murata Mfg. Co., Ltd. introduces a RFID devise “MAGICSTRAP®”, for the ultimate traceability and functionality on PCB for the decade of Industry 4.0.

12:50-13:20
  • Introduction to the case study of the controller METIS series

    Yukihiro Yoshidome

    ISHIHARA CHEMICAL CO.,LTD. Sales Department7

    The future of METIS controller. Why do we need the controller? What are the benefits to install the controller? We will explain the case of these.

    Apply to

    TEL. 03-3832-8037 FAX. 03-3832-8132 nakatsugawa-k@unicon.co.jp

13:30-14:00
  • これから基板設計を始める方の為のCADLUSアシスト機能と遠隔コミュニケーション機能

    田崎 勝也

    NISOUL CO.,LTD 営業企画部 マーケティング責任者

    CADLUS(有償、無償版)へ共にアシスト機能を搭載致しました。より、身近になったプリント基板CADと検図、サポートをより便利にする遠隔コミュニケーション機能をご紹介いたします。

    Apply to

    TEL. 04-2958-8600 FAX. 04-2958-3939 info@nisoul.co.jp

14:10-14:40
  • Electroless copper plating process with nano silver catalyst NACE PROCESS

    Tomo Moriguti

    OKUNO CHEMICAL INDUSTRIES CO., LTD. Reseach, Metal Finishing

    We have developed NACE PROCESS which is electroless Cu process using Ag-nano particles as cata. We describe greater point than Pd cata.

    Apply to

    Please come visit D Room directly if you'd like to audit.

14:50-15:20
  • Discovering the new apprication for the X-ray radioscopy Fourth edition

    Sueki Baba

    BEAMSENSE CO.,LTD President

    By fusing the computing technology and the X-ray sensor technology, we have developed new X-ray imaging technology. Now we report latest situation.

15:30-16:00
  • Understanding S-parameter easily

    Tetsuya Koizumi

    Gardien Japan Co., Ltd Sales Department Polar Instruments&PWB Products Manager

    Apply to

    Please come visit D Room directly if you'd like to audit.

16:10-16:40
  • Introduction of a new X-ray fluorescence film thickness analyzer to achieve high accuracy and high throughput

    Naokatsu Nosaka

    Hitachi High-tech Science Corporation Engineer

    We presents the new FT150 series that enables a higher throughput at a higher accuracy demanded for managing micro-PCBs and electric parts.

    Apply to

    TEL. 03-6280-0068 FAX. 03-6280-0075 naokatsu.nosaka.jy@hitachi-hitech.com

E Room
10:50-11:20
  • The Study on the Characteristics of High-speed Boards
    and the Countermeasure of Drill Bits
    Chinese

    Mr. Zhou Weixian

    Shenzhen Jinzhou Precision Technology Corp., R&D Department Manager

    This paper studied and analyzed the drilling characteristics of some common high speed boards on the market, and by using sophisticated measuring and controlling methods such as measuring the temperature, the strength and high speed photography, this paper also studied the regular processing patterns of the high speed boards from the aspects like drilling temperature, cutting strength, chips removal and drill bits abrasion, etc. Based on these analyses, the paper studied the countermeasures of drill bits.

    This seminar has been cancelled

11:30-12:00
  • Vision inspection proposal for Substrate material with high quality requirement

    Junya Wakade

    YASUNAGA CORPORATION R&D GROUP DIV.PLANNING DEPT. CE DIV.

    AOI machine for High quality/High functional devices for Automobiles. High speed/High accuracy demensional inspections and defect inspections.

    Apply to

    TEL. 0595-24-2252 FAX. 0595-24-2720 yazu-koa@fine-yasunaga.co.jp

12:10-12:40
  • Through hall filling process for fine patterning CU-BRITE TF4

    Masahiro Sawa

    JCU CORPORATION PWB Section 1, Electronics Technology Development Devision 1

    Superior to conventional process, CU-BRITE TF4 is a process having high filling performance so that it is able to deposit surface with thin film.

    Apply to

    kikaku@jcu-i.com

12:50-13:20
  • Revolutionary new atomization machine “G-smasher”
    ~Principle and practical examples of atomization~

    Kazuyoshi Ohishi

    RIX CORPORATION GS System Division Nanoparticle System Division Business Development Headquarters

    Introduce the detail of G-smasher's features and some examples of dispersion such as ductil metals particles (Ag, Cu, Ni) without surface damages.

    Apply to

    TEL. 092-935-8013 FAX. 092-936-8470 gskai@rix.co.jp

13:30-14:00
  • Proposal to digitization of the printing technology ~Optimization of priting conditions by rheology analyzer and simulation analysis~

    Takeharu Natori

    TENRYUSEIKI Co.,Ltd. Technical Engineering and Development Department

    We introduce from the analysis of the material by rheology analyzer,and simulation for printing mechanism to approach to the digitization of printing.

    Apply to

    TEL. 0265-82-5111 FAX. 0265-82-5857 a.hara@tenryuseiki.com

14:10-14:40
  • Introduction of Orbotech Automated Optical Rework (AOR) System

    Masaki Hishikawa

    Orbotech Japan Co., Ltd. AOI/AOR Product Manager, Product/Marketing Dept. PCB Division

    Introduction of Orbotech Automated Optical Rework (AOR) system for High value and most advanced products.

    Apply to

    TEL. 03-6367-2527 FAX. 03-5790-5633 PCB-Sales@Orbotech.com

14:50-15:20
  • New gold plating solutions for surface finishing of substrate

    Takafumi Kubo

    MATSUDA SANGYO CO., LTD CHEMICAL PRODUCTS DEVELOPMENT GROUP ENGINEERING DEVELOPMENT SECT.

    We'll introduce new gold plating solutions developed for surface finishing of PWBs, which have superior throwing power even at low gold concentration.

    Apply to

    TEL. 03-3345-0811 FAX. 03-3345-8605 watanabe-yuk@matsuda-sangyo.co.jp

15:30-16:00
  • ORC's state-of-the-art Direct Imaging System

    Duk Lee

    ORC MANUFACTURING CO.,LTD. General Manager, Optical Development Department

    DI is a competent technology for high-density PWB imaging. Required for even the finer, ORC presents our flag ship model, and other latest models.

    Apply to

    TEL. 042-798-5133 FAX. 042-798-5135 5月中旬より使用開始予定jpcashow2015@orc.co.jp

16:10-16:40
  • Solder Resist for Direct Imaging

    Naoya Kakiuchi

    TAMURA CORPORATION
    R&D DIVISION ELECTRONIC CHEMICALS BUSINESS SECTOR, SENIOR MANAGER

    The higher accuracy of Solder Resist(SR) opening position is needed. We report the trend of the SR for Direct Imaging, which is one of the solutions.

    Apply to

    TEL. 04-2934-4062 FAX. 04-2934-2997 webinfo@tamura-ss.co.jp

Fri., June 5

D Room
10:50-11:20
  • Presentation of the High Temperature Warpage Measurement System

    Masatoshi Inoue

    TAKAOKA TOKO CO.,LTD. Technology Development Department Applied Optics Inspection System Business Division

    We present you the “High Temperature Warpage Measurement System”, which is able to inspect the warpage of the IC package during the heating process.

    Apply to

    Please come visit D Room directly if you'd like to audit.

11:30-12:00
  • 「生産性向上」を実現する高減衰能ゴムカップリング: XGシリーズのご紹介

    Masashi Sugiyama

    NabeyaBi-tech Kaisha Sales Team Product Sales Manager

    サーボモータの性能を最大限引き出す「XGシリーズ」。防振ゴムを一体成型したNBKの高減衰能ゴムカップリング「XGシリーズ」は、“減衰”と“剛性”の最適設計により、高ゲイン時のハンチングを抑え、「整定時間短縮」⇒「生産性向上」を実現。高ゲイン時のハンチング対策を、カップリング変更(XG使用)だけで解決出来るメカニズムをご紹介。

    Apply to

    TEL. 0575-23-1121 FAX. 0575-23-1719 akari.nishimura@nbk1560.com

12:10-12:40
  • Organic Interposer for 2.1D and 2.5D Integration with L/S under 5/5

    Kumiko Ishikawa

    JCU CORPORATION PWB Section 2, Electronics Technology Development Devision 1

    Low cost organic interposers for 2.1D and 2.5D are under development. Able to provide processes from seed layer formation to pattern formation.

    Apply to

    kikaku@jcu-i.com

12:50-13:20
  • Advanced technical report of flux-free reflow, solder bonding and metal bonding

    Yasuhisa Yamada

    Ayumi Industry Co., Ltd. Sales engineer, Tokyo office

    Reflow process without flux is widely noticed today. Ayumi introduce its latest packaging technology focusing on flux-free reflow bumping and bonding.

    Apply to

    TEL. 03-3548-2610 FAX. 03-3231-3460 kyo01@ayumi-ind.co.jp

13:30-14:00
  • Phtonic curing topic:Pulse shaping and pulse uniformity

    Kenji Shinozaki

    NovaCentrix, NovaCentrix Supervisor

    Recent progress in photonic curing will be reviewed. PulseForge enables pulse shaping tequnigue and uniform distribution of light intensity.

    Apply to

    TEL. 03-3459-5125 FAX. 03-3459-5073 kenji.shinozaki@novacentrix.com

14:10-14:40
  • Direct Imaging System solutions that spread from the Ledia (Tentative title)

    Shuji Sakaue

    SCREEN Graphic and Precision Solutions Co., Ltd. Software Engineering Section Product Development Department 3 Product Development Division

    * We'd inform you later at website.

    Apply to

    TEL. 075-414-7610 FAX. 075-417-2705 info-m@screen-mt.com

    Please come visit D Room directly if you'd like to audit.

14:50-15:20
  • Low Dk type adhisive film for High-speed transmission circuits

    Shota Mori

    TOYOCHEM CO.,LTD TOYOCHEM CO.,LTD Polymer & Coating R&D Division

    We developed Low dielectric adhesive film called “Lioelm TSU series” for the high speed transmission circuit. It corporates originally designed polymers to reduce transmission loss during high speed transmission.

    Apply to

    TEL. 03-3272-0905 FAX. 03-3272-0938 master@toyoinkgroup.com

15:30-16:00
  • Introduction of “Low” Silver & Tempurature Solder Material available “Low” Cost Manufacturing

    Tomoko Nagai

    SENJU METAL INDUSTRY CO.,LTD. Solder Technical Center Researcher

    Low silver solder materials are able to reduce material cost. Low tempurature one are able to reduce components cost and energy consunmption.

    Apply to

    Please come visit D Room directly if you'd like to audit.

16:10-16:40
  • OKI launched the metal mask cleaning equipment (ACT100Lite).

    Tadanori Arakawa

    Oki Communication Systems Co., Ltd. Director

    Oki has developed the washing equipment for metal / screen stencil. This time, we have new lineup developed small equipment for just metal stencil.

    Apply to

    TEL. 04-2922-0211 arakawa946@oki.com

E Room
10:50-11:20
  • Halogen-free IC substrate materials “MEGTRON GX R-1515D/R-1410D”

    Yasunori Ambe

    Panasonic Corporation Electronic Materials Business Division Circuit Board Materials Division Package Materials Development Group

    Recently, the major request for memory PKG is thinner. We developed the new materials. The new laminate & prepreg are applied for Low warpage.

    Apply to

    Please come visit E Room directly if you'd like to audit.

11:30-12:00
  • EcoFlash -Next Level of Enhanced Isotropic Etchants-

    Toshio Honda

    Atotech Japan K.K. Electronics Division Prmoduct Management Department

    EcoFlash is a Flash Etching process for Next Generation. It will foster great economic and absolutely minimizing the environmental impacts.

    Apply to

    Please come visit E Room directly if you'd like to audit.

12:10-12:40
  • VitroCoat GI Adhesion Enabling Technology for Reliable Metallization and Patterning of Glass Interposers

    Akira Mieno

    Atotech Japan K.K. Electronics Division Prmoduct Management Department

    We're introducing “VitroCoat GI process” which enables reliable TGV(Through Glass Via) metallization and pattering on glass for glass interposer.

    Apply to

    Please come visit E Room directly if you'd like to audit.

12:50-13:20
  • Proposal of next generation high performance PWB technology.

    Kenichiro Abe

    FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
    Director, New Product Development Department, Development Division

    Propose the new Anylayer Via structure PWB, which meets requirements below;
    1. Improve design performance
    2. Improve transmission loss
    3. Improve TAT

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    Please come visit E Room directly if you'd like to audit.

13:30-14:00
  • Surface finishing technology trend for fine line less than L/S 5μm patterning

    Kazutaka Tajima

    MELTEX INC.
    Manager New business initiatives & partnership Technology and Development DEPT.

    Introduction of the development of products for fine line patterning and the approach to the future technology will be presented.

    Apply to

    TEL. 048-665-2123 FAX. 048-652-1515 sales@meltex.com

14:10-14:40
  • Introduction of the coated tools realizing cost reduction

    Kenji Oshima

    UNION TOOL CO. Tool Engineering Department, PCB Tool Development Section

    Long-life and high-efficiency PCB tool developments and its drilling performance, utilizing UNION TOOL's coating technology, for cost reduction.

    Apply to

    TEL. 03-5493-1020 FAX. 03-5493-1014 Kotaro-n@uniontool.co.jp

14:50-15:20
  • New Routing Environment & Technology:Timing Vision, AiXX

    Ko Nagasawa

    Cadence Design Systems, Japan Field Engineering & Service Custom IC & PCB Group Technical Leader

    Cadence introduce you New Routing Technology “Timing Vision”, “AiXX” that enhances the user's ability to develop a strategy for resolving timing.

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    Please come visit E Room directly if you'd like to audit.

15:30-16:00
  • The introduction of solvent-soluble polyimide characterized by high heat resistance, low Dk and low Df

    Takashi Tasaki

    ARAKAWA CHEMICAL INDUSTRIES, LTD. HB Group, R&D Dept. Ⅱ, Electronic Materials Division

    This presentation shows properties of the novel solvent-soluble polyimide characterized by high heat resistance and low Dk/Df and its adhesives.

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    Please come visit E Room directly if you'd like to audit.

How to Apply

Please apply directly to the appropriate contact (TEL / FAX / E-mail / URL) of the seminar you would like to audit.