NPI Presentation (Exhibitor's seminar)
Wed., June 3 - Fri., June 5, 2015 
D Room in East Hall 6 / E Room in East Hall 3 FREE
Wed., June 3
D Room
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The Cloud EDA “Quadcept”…The future of Electric CAD
Yasuhisa Morimoto
Quadcept,Inc. Marketing Strategist
Quadcept have changed a lot in E-CAD market. This time, we present to you the future of E-CAD with introduing our innovation history.
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The latest actual cases of X-ray Fluoroscopic/CT system use for R&D/failure analysis.
Yoshio Kuni
SHIMADZU CORPORATION Analytical & Measuring Instruments Division Global Marketing Department, Manager
The principle and the latest applications of X-ray non-destructive inspection: analysis for electrical parts,LED, storage battery, composite material.
Apply to
Please come visit D Room directly if you'd like to audit.
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High reliability and actual results -Introduction of PCB technologies of CMK for “automotive use”
Seiji Yamamoto
CMK CORPORATION Automotive Technology Section Production Technology Division Team Leader
Introduction of Automotive PCB technology-SEPT(Solder Crack Prevention) CARFT(RF) CMK-COMP)(High Current Heat Radiation)
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Please come visit D Room directly if you'd like to audit.
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Proposal of next generation high performance PWB technology.
Kenichiro Abe
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED Director, New Product Development Department, Development Division
Propose the new Anylayer Via structure PWB, which meets requirements below;
1. Improve design performance
2. Improve transmission loss
3. Improve TATApply to
Please come visit D Room directly if you'd like to audit.
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3μm thickness Positive DFR which can achieve 40μm pitch by subtractive method using general etching machine.
Shigeki Watanabe
MICRO PROCESS INC. Marketing
Features
1) Excellent adhesion during development and etching to a Profile-Free copper foil.
2) Better etching resolution compared to thick DFR.Apply to
Please come visit D Room directly if you'd like to audit.
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Research Center for Three-Dimensional Semiconductors of efforts and infrastructure technology
Kanta Nogita
Fukuoka Industry, Science & Technology Foundation Research Center for Three-Dimensional Semiconductors Deputy Director
I report the activity of Research Center for Three-Dimensional Semiconductors and elemental technologies
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Please come visit D Room directly if you'd like to audit.
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Smart Print Circuit Boad with Murata's MAGICSTRAP®
Ikuhei Kimura
Murata Manufacturing Co., Ltd. RFID Project, Technology Integrated Products Dept. New Products & Business Division Murata Mfg. Co., Ltd.
Murata Mfg. Co., Ltd. introduces a RFID devise “MAGICSTRAP®”, for the ultimate traceability and functionality on PCB for the decade of Industry 4.0.
Apply to
TEL. 075-955-6953 FAX. 075-955-6634 magicstrap@murata.com
https://www.murata.co.jp/contact/product/contact.php?g_product_category=rfid
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Material to reduce Solder Crack for automotive application
Takayo Kitajima
Hitachi Chemical Co., ltd. Printed Wiring Board Materials R&D Dept. Advanced Core Materials Business Sector
We will introduce low elastic modulus material TD-002 which enables solder crack prevention under applied to PWBs surface of standard material.
Apply to
E Room
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Copper Filling of Through Holes on Varying Substrate Thickness
Jim Watkowski
Nippon MacDermid Co., Ltd. MacDermid, Inc.
A through hole fill process that provides defect free filled holes on substrates ranging from 0.2mm to 0.8mm thick with varying aspect ratios.
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ダイナトロンが提案する測長/検査ソリューション（データ基準）新製品 自動PCB寸法測定機「QuickSCALE」についての製品紹介。
Junichi Kitamura
Dynatron Co.,LTD. Sales Division
測定テーブルに基板を置くだけで、ガーバーデータで指定した箇所を自動で瞬間測長。設計値と測長値を合否判定。測定結果は、印刷やエクセルにレポート出力。
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Revolutionary new atomization machine “G-smasher”
~Principle and practical examples of atomization~Kazuyoshi Ohishi
RIX CORPORATION GS System Division Nanoparticle System Division Business Development Headquarters
Introduce the detail of G-smasher's features and some examples of dispersion such as ductil metals particles (Ag, Cu, Ni) without surface damages.
Apply to
TEL. 092-935-8013 FAX. 092-936-8470 gskai@rix.co.jp
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New type vertical continues plating system for electro-less copper plating
U-VCPSShunsaku Hoshi
C. Uyemura ＆ Co., Ltd. Research and Development Division, Central Research Laboratory
Electro-less copper plating for thin panel is difficult to keep stable conveyance. we devloped new type vertical continues plating system “U-VCPS”.
Apply to
Please come visit E Room directly if you'd like to audit.
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Ultra Low CTE Core Material for APU(FC-CSP) Application / MCL-E-770G
Ryoichi Uchimura
Hitachi Chemical Co., Ltd. Printed Wiring Board Materials R&D Dept., Advanced Core Materials Business Sector
MCL-E-770G has an ultra low CTE of 1.8 ppm/℃ by applying a novel resin system and it can remarkably reduce the warpage for thinner CSP application.
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Diversified needs on EMS market and UMC's Challenges in Automotives,
Smart Grid, Wearable and other new market.Kazuhisa Takasu
UMC Electronics Co., Ltd. Director Executive Vice President
Some advanced technology market area such as Automotive, Smart Grid, or Wearable make Japanese EMS players to transform from just a “sub-contractor” to “strategic value chain partner”. UMC would like to introduce successful cases.
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Visualization of plasma processing effect using plasma indicator PLAZMARK®
Seisaku Ohshiro
SAKURA COLOR PRODUCTS CORPORATION Manager of Central R&D New Business Development
Plasma indicator PLAZMARK® shows plasma processing effects by changing of color. PLAZMARK® is useful for check the plasma density and 2D uniformity.
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Please come visit E Room directly if you'd like to audit.
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Double-side FCCL with conductive through-hole for cost and process saving
Akihisa Hamazawa
ARAKAWA CHEMICAL INDUSTRIES, LTD. POMIRAN BUSSINESS CORPS, ELECTRONIC MATERIALS DIVISION
We propose an application of double-side FCCL with conductive through-hole by wet plating method on PI film for process and cost saving.
Apply to
TEL. 03-5645-7804 FAX. 03-5645-7867 hikari_info@arakawachem.co.jp
https://www.arakawachem.co.jp/jp/inquiry/
Please come visit E Room directly if you'd like to audit.
Thu., June 4
D Room
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Presentation of the effective utilization of electrolysis water in the production of printed boards. (clear up for misunderstanding & questions of efficacy of the electrolysis water)
Yasuaki Nishio
FUJI KIKO CO.,LTD SALES ENGINEER
Introducing more beneficial use and new usage technique of the electrolysis water to solve problems in the printed board production field.
Apply to
Please come visit D Room directly if you'd like to audit.
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VPS reflow equipment with an void reduction
Takahisa Oshita
Techno Alpha Co.ltd.
製品の小型化やSMT実装部品の微細化などにより問題視されている半田ボイド。これを低減する方法の一つとしてVPSリフロー装置によるリフローが挙げられます。ボイド低減になぜVPSリフロー装置なのか？その謎について解明します。
Apply to
TEL. 03-3492-7421 FAX. 03-3492-2580 oshita@technoalpha.co.jp
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Smart Print Circuit Boad with Murata's MAGICSTRAP® English
Ikuhei Kimura
Murata Manufacturing Co., Ltd. RFID Project, Technology Integrated Products Dept. New Products & Business Division Murata Mfg. Co., Ltd.
Murata Mfg. Co., Ltd. introduces a RFID devise “MAGICSTRAP®”, for the ultimate traceability and functionality on PCB for the decade of Industry 4.0.
Apply to
TEL. 075-955-6953 FAX. 075-955-6634 magicstrap@murata.com
https://www.murata.co.jp/contact/product/contact.php?g_product_category=rfid
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Introduction to the case study of the controller METIS series
Yukihiro Yoshidome
ISHIHARA CHEMICAL CO.,LTD. Sales Department7
The future of METIS controller. Why do we need the controller? What are the benefits to install the controller? We will explain the case of these.
Apply to
TEL. 03-3832-8037 FAX. 03-3832-8132 nakatsugawa-k@unicon.co.jp
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これから基板設計を始める方の為のCADLUSアシスト機能と遠隔コミュニケーション機能
田崎 勝也
NISOUL CO.,LTD 営業企画部 マーケティング責任者
CADLUS（有償、無償版）へ共にアシスト機能を搭載致しました。より、身近になったプリント基板CADと検図、サポートをより便利にする遠隔コミュニケーション機能をご紹介いたします。
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Electroless copper plating process with nano silver catalyst NACE PROCESS
Tomo Moriguti
OKUNO CHEMICAL INDUSTRIES CO., LTD. Reseach, Metal Finishing
We have developed NACE PROCESS which is electroless Cu process using Ag-nano particles as cata. We describe greater point than Pd cata.
Apply to
Please come visit D Room directly if you'd like to audit.
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Discovering the new apprication for the X-ray radioscopy Fourth edition
Sueki Baba
BEAMSENSE CO.,LTD President
By fusing the computing technology and the X-ray sensor technology, we have developed new X-ray imaging technology. Now we report latest situation.
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Understanding S-parameter easily
Tetsuya Koizumi
Gardien Japan Co., Ltd Sales Department Polar Instruments&PWB Products Manager
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Please come visit D Room directly if you'd like to audit.
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Introduction of a new X-ray fluorescence film thickness analyzer to achieve high accuracy and high throughput
Naokatsu Nosaka
Hitachi High-tech Science Corporation Engineer
We presents the new FT150 series that enables a higher throughput at a higher accuracy demanded for managing micro-PCBs and electric parts.
Apply to
TEL. 03-6280-0068 FAX. 03-6280-0075 naokatsu.nosaka.jy@hitachi-hitech.com
E Room
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The Study on the Characteristics of High-speed Boards
and the Countermeasure of Drill Bits ChineseMr. Zhou Weixian
Shenzhen Jinzhou Precision Technology Corp., R&D Department Manager
This paper studied and analyzed the drilling characteristics of some common high speed boards on the market, and by using sophisticated measuring and controlling methods such as measuring the temperature, the strength and high speed photography, this paper also studied the regular processing patterns of the high speed boards from the aspects like drilling temperature, cutting strength, chips removal and drill bits abrasion, etc. Based on these analyses, the paper studied the countermeasures of drill bits.
This seminar has been cancelled
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Vision inspection proposal for Substrate material with high quality requirement
Junya Wakade
YASUNAGA CORPORATION R&D GROUP DIV.PLANNING DEPT. CE DIV.
AOI machine for High quality/High functional devices for Automobiles. High speed/High accuracy demensional inspections and defect inspections.
Apply to
TEL. 0595-24-2252 FAX. 0595-24-2720 yazu-koa@fine-yasunaga.co.jp
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Through hall filling process for fine patterning CU-BRITE TF4
Masahiro Sawa
JCU CORPORATION PWB Section 1, Electronics Technology Development Devision 1
Superior to conventional process, CU-BRITE TF4 is a process having high filling performance so that it is able to deposit surface with thin film.
Apply to
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Revolutionary new atomization machine “G-smasher”
~Principle and practical examples of atomization~Kazuyoshi Ohishi
RIX CORPORATION GS System Division Nanoparticle System Division Business Development Headquarters
Introduce the detail of G-smasher's features and some examples of dispersion such as ductil metals particles (Ag, Cu, Ni) without surface damages.
Apply to
TEL. 092-935-8013 FAX. 092-936-8470 gskai@rix.co.jp
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Proposal to digitization of the printing technology ~Optimization of priting conditions by rheology analyzer and simulation analysis~
Takeharu Natori
TENRYUSEIKI Co.,Ltd. Technical Engineering and Development Department
We introduce from the analysis of the material by rheology analyzer,and simulation for printing mechanism to approach to the digitization of printing.
Apply to
TEL. 0265-82-5111 FAX. 0265-82-5857 a.hara@tenryuseiki.com
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Introduction of Orbotech Automated Optical Rework (AOR) System
Masaki Hishikawa
Orbotech Japan Co., Ltd. AOI/AOR Product Manager, Product/Marketing Dept. PCB Division
Introduction of Orbotech Automated Optical Rework (AOR) system for High value and most advanced products.
Apply to
TEL. 03-6367-2527 FAX. 03-5790-5633 PCB-Sales@Orbotech.com
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New gold plating solutions for surface finishing of substrate
Takafumi Kubo
MATSUDA SANGYO CO., LTD CHEMICAL PRODUCTS DEVELOPMENT GROUP ENGINEERING DEVELOPMENT SECT.
We'll introduce new gold plating solutions developed for surface finishing of PWBs, which have superior throwing power even at low gold concentration.
Apply to
TEL. 03-3345-0811 FAX. 03-3345-8605 watanabe-yuk@matsuda-sangyo.co.jp
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ORC's state-of-the-art Direct Imaging System
Duk Lee
ORC MANUFACTURING CO.,LTD. General Manager, Optical Development Department
DI is a competent technology for high-density PWB imaging. Required for even the finer, ORC presents our flag ship model, and other latest models.
Apply to
TEL. 042-798-5133 FAX. 042-798-5135 5月中旬より使用開始予定jpcashow2015@orc.co.jp
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Solder Resist for Direct Imaging
Naoya Kakiuchi
TAMURA CORPORATION
R&D DIVISION ELECTRONIC CHEMICALS BUSINESS SECTOR, SENIOR MANAGERThe higher accuracy of Solder Resist(SR) opening position is needed. We report the trend of the SR for Direct Imaging, which is one of the solutions.
Apply to
TEL. 04-2934-4062 FAX. 04-2934-2997 webinfo@tamura-ss.co.jp
Fri., June 5
D Room
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Presentation of the High Temperature Warpage Measurement System
Masatoshi Inoue
TAKAOKA TOKO CO.,LTD. Technology Development Department Applied Optics Inspection System Business Division
We present you the “High Temperature Warpage Measurement System”, which is able to inspect the warpage of the IC package during the heating process.
Apply to
Please come visit D Room directly if you'd like to audit.
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「生産性向上」を実現する高減衰能ゴムカップリング： XGシリーズのご紹介
Masashi Sugiyama
NabeyaBi-tech Kaisha Sales Team Product Sales Manager
サーボモータの性能を最大限引き出す「XGシリーズ」。防振ゴムを一体成型したNBKの高減衰能ゴムカップリング「XGシリーズ」は、“減衰”と“剛性”の最適設計により、高ゲイン時のハンチングを抑え、「整定時間短縮」⇒「生産性向上」を実現。高ゲイン時のハンチング対策を、カップリング変更（XG使用）だけで解決出来るメカニズムをご紹介。
Apply to
TEL. 0575-23-1121 FAX. 0575-23-1719 akari.nishimura@nbk1560.com
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Organic Interposer for 2.1D and 2.5D Integration with L/S under 5/5
Kumiko Ishikawa
JCU CORPORATION PWB Section 2, Electronics Technology Development Devision 1
Low cost organic interposers for 2.1D and 2.5D are under development. Able to provide processes from seed layer formation to pattern formation.
Apply to
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Advanced technical report of flux-free reflow, solder bonding and metal bonding
Yasuhisa Yamada
Ayumi Industry Co., Ltd. Sales engineer, Tokyo office
Reflow process without flux is widely noticed today. Ayumi introduce its latest packaging technology focusing on flux-free reflow bumping and bonding.
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Phtonic curing topic:Pulse shaping and pulse uniformity
Kenji Shinozaki
NovaCentrix, NovaCentrix Supervisor
Recent progress in photonic curing will be reviewed. PulseForge enables pulse shaping tequnigue and uniform distribution of light intensity.
Apply to
TEL. 03-3459-5125 FAX. 03-3459-5073 kenji.shinozaki@novacentrix.com
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Direct Imaging System solutions that spread from the Ledia (Tentative title)
Shuji Sakaue
SCREEN Graphic and Precision Solutions Co., Ltd. Software Engineering Section Product Development Department 3 Product Development Division
* We'd inform you later at website.
Apply to
TEL. 075-414-7610 FAX. 075-417-2705 info-m@screen-mt.com
Please come visit D Room directly if you'd like to audit.
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Low Dk type adhisive film for High-speed transmission circuits
Shota Mori
TOYOCHEM CO.,LTD TOYOCHEM CO.,LTD Polymer & Coating R&D Division
We developed Low dielectric adhesive film called “Lioelm TSU series” for the high speed transmission circuit. It corporates originally designed polymers to reduce transmission loss during high speed transmission.
Apply to
TEL. 03-3272-0905 FAX. 03-3272-0938 master@toyoinkgroup.com
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Introduction of “Low” Silver & Tempurature Solder Material available “Low” Cost Manufacturing
Tomoko Nagai
SENJU METAL INDUSTRY CO.,LTD. Solder Technical Center Researcher
Low silver solder materials are able to reduce material cost. Low tempurature one are able to reduce components cost and energy consunmption.
Apply to
Please come visit D Room directly if you'd like to audit.
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OKI launched the metal mask cleaning equipment (ACT100Lite).
Tadanori Arakawa
Oki Communication Systems Co., Ltd. Director
Oki has developed the washing equipment for metal / screen stencil. This time, we have new lineup developed small equipment for just metal stencil.
Apply to
TEL. 04-2922-0211 arakawa946@oki.com
E Room
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Halogen-free IC substrate materials “MEGTRON GX R-1515D/R-1410D”
Yasunori Ambe
Panasonic Corporation Electronic Materials Business Division Circuit Board Materials Division Package Materials Development Group
Recently, the major request for memory PKG is thinner. We developed the new materials. The new laminate & prepreg are applied for Low warpage.
Apply to
Please come visit E Room directly if you'd like to audit.
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EcoFlash -Next Level of Enhanced Isotropic Etchants-
Toshio Honda
Atotech Japan K.K. Electronics Division Prmoduct Management Department
EcoFlash is a Flash Etching process for Next Generation. It will foster great economic and absolutely minimizing the environmental impacts.
Apply to
Please come visit E Room directly if you'd like to audit.
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VitroCoat GI Adhesion Enabling Technology for Reliable Metallization and Patterning of Glass Interposers
Akira Mieno
Atotech Japan K.K. Electronics Division Prmoduct Management Department
We're introducing “VitroCoat GI process” which enables reliable TGV(Through Glass Via) metallization and pattering on glass for glass interposer.
Apply to
Please come visit E Room directly if you'd like to audit.
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Proposal of next generation high performance PWB technology.
Kenichiro Abe
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Director, New Product Development Department, Development DivisionPropose the new Anylayer Via structure PWB, which meets requirements below;
1. Improve design performance
2. Improve transmission loss
3. Improve TATApply to
Please come visit E Room directly if you'd like to audit.
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Surface finishing technology trend for fine line less than L/S 5μm patterning
Kazutaka Tajima
MELTEX INC.
Manager New business initiatives & partnership Technology and Development DEPT.Introduction of the development of products for fine line patterning and the approach to the future technology will be presented.
Apply to
TEL. 048-665-2123 FAX. 048-652-1515 sales@meltex.com
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Introduction of the coated tools realizing cost reduction
Kenji Oshima
UNION TOOL CO. Tool Engineering Department, PCB Tool Development Section
Long-life and high-efficiency PCB tool developments and its drilling performance, utilizing UNION TOOL's coating technology, for cost reduction.
Apply to
TEL. 03-5493-1020 FAX. 03-5493-1014 Kotaro-n@uniontool.co.jp
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New Routing Environment & Technology:Timing Vision, AiXX
Ko Nagasawa
Cadence Design Systems, Japan Field Engineering & Service Custom IC & PCB Group Technical Leader
Cadence introduce you New Routing Technology “Timing Vision”, “AiXX” that enhances the user's ability to develop a strategy for resolving timing.
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Please come visit E Room directly if you'd like to audit.
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The introduction of solvent-soluble polyimide characterized by high heat resistance, low Dk and low Df
Takashi Tasaki
ARAKAWA CHEMICAL INDUSTRIES, LTD. HB Group, R&D Dept. Ⅱ, Electronic Materials Division
This presentation shows properties of the novel solvent-soluble polyimide characterized by high heat resistance and low Dk/Df and its adhesives.
Apply to
Please come visit E Room directly if you'd like to audit.
How to Apply
Please apply directly to the appropriate contact (TEL / FAX / E-mail / URL) of the seminar you would like to audit.
- Events
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Panel Discussion - JIEP Advanced Electronics Packaging (JISSO) Technology Symposium
- International Seminar NEW!
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- NPI Presentation
(Exhibitor's seminar) - PROTEC Seminar
- JMID 3D-MID Seminar
(Molded Interconnect Device) - Academic Plaza
- IPC Hand Soldering Competition Japan
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