JPCA Show / Large Electronics Show / WIRE Japan Show / Microelectronics Show / JISSO PROTEC / Monotsukuri Fiesta

Wed., June 3 - Thu., June 4, 2015　　International Seminar Room in East Hall 6　　Admission Required

Wed., June 3

How to apply 

International Seminar Session I

• 13:00–14:00

  Stretchable electronics and electronic textile, new frontiers for PCB technology

  Mr. Johan De Baets

   Profile

  Johan De Baets works at imec since 1995 as a senior research engineer, where he now heads the Centre for Microsystems Technology. He has been involved in a number of European and national research projects on advanced electronic interconnection technologies, stretchable interconnect and electronic textile. He is currently co-ordinating the EC FP7 project “PASTA”.

  Group manager
  Center for Microsystems Technology
  Imec

  Printed circuit board technology has been evolving ever since its beginning, from single-layer to complex multilayer boards, flexible printed circuits, microvia technology, and more recently, into large area circuits on foil, stretchable electronics and electronics on or in textile.
  In this presentation new large area electronic technologies will be presented, with a focus on stretchable interconnections. These stretchable interconnections, in combination with miniaturization of components and circuits, are leading to electronic systems that are flexible, stretchable, comfortable and - with a suited encapsulation - even washable. This technology will lead to the integration of electronics in textile or in molded plastics, with applications in automotive, clothing, housing, technical textiles, healthcare, lighting,...
  The stretchable interconnect technology is based on meander-shaped conductors (Cu, conductive ink) created on flexible material. This can easily be done with known volume-manufacturing processes. The presentation will highlight new processes, reliability test results and new applications of the technology. The work has been supported by the European FP7 projects “Pasta” and “Terasel”.

• 14:00–15:00

  How will PB Manufacturing Change in a Digital Age

  Mr. Hikmat Chammas

  Engineer Fellow
  Advanced Manufacturing Engineering
  Honeywell Aerospace

   Profile

  Hikmat Chammas is the AME Electronics Processing and Fabrication Technology Fellow; who serves as the technology focal point for Card Assembly (CCA) manufacturing processes for the aerospace businesses. Hikmat has over 30 years experience in contract manufacturing for the Department of Defense (DoD), as well as, Communication Network Equipment (CNE), and Terminal Product (TP). He pioneered the Surface Mount Technology (SMT) at Hadco (presently known as Sanmina Corporation) and established 4 green fields operations during his career in Circuit Card Assembly (CCA), Backplane compliance technology and vertical integration. He spear headed the development of Design for Manufacturing (DFM) guidelines at Northrop Grumman, and ran training programs for the Hardware & CAD Engineering organizations. Hikmat has extensive experience in technology, including, Surface Mount Technology (BGA, CBGA, μBGA), New Product Development (NPD), Plated through hole (PTH), Press-fit compliance pins (VHDM), expert solder and reflow profiling, ultrasonic welding, plastic molding, sheet metal fabrication, as well as, supporting international and domestic technology processes. Hikmat has lead EPIC 500 Tiger Global Team that optimized the Thermal profile requirements that resulted in improvement of BGAs solderability by 100% and eliminated customer escape due to solder defects. He developed cost modeling and DFM tools for value engineering (VE) that resulted in achieving cost reduction of several million dollars for AOC, A350, A380, block III, EGI, GMLRS, EGPWS, and other systems utilizing DFx methodology. He completed the study on Embedded Passive Technology and presented several white papers on the subject. Hikmat was awarded by IPC the Distinguished committee Service Award in recognition of your outstanding contributions in me 5 - 18 G subcommittee in expediting the completion of IPC 7092, design and assembly process implementation for embedded components. Hikmat is well known in the engineering community as one of the pioneer in the Embedded Active and passive technologies. Hikmat has a Bachelors of Science in Electrical Engineering from State University College at Buffalo, New York. He also completed a manufacturing management program (MMP) studies through Honeywell. He is Design For Six Sigma (DFSS) green belt and Lean Manufacturing certified.

  Continuous demand for additional electrical/electronic functions while maintaining small real-estate has forced the industry toward miniaturization; embedded technology has been used to replace passive surface mounted components such as resistors and capacitor in several telecommunications, radio wave, Space applications. The embedded technology offer significant component placement reduction over the standard Surface Mount Devices (SMD), and improve the utilization of real-estate for additional functionality and improvement in DFM and reduction in COPQ.
  Miniaturization creates major challenges to Printed Board (PB) fabricators. HDI, Micro via, signal routing, trace space/width, aspect ratio, layer count, Impedance control, material and board thickness. These are some of the requirement that will be required to ensure quality and reliably are met in the defense and aerospace industries. Advanced PB Technology has a great potential for high frequency and high density applications.

• 15:00–16:00

  Automotive Electronics – Trends and Requirements for Printed Circuit Boards

  Mr. Joerg D. Schaefer

  Head of PCB Technology Development HK
  Robert Bosch

   Profile

  Education

  1989/1995 Physical Metallurgy and Material Science at the University of Stuttgart,
         MS Engineering Degree (Dipl.-Ing.)

  Prof. Education & Career

  Max-Planck-Institute for Metals Research and the University of Stuttgart (D)
  1995 Diploma (MS) in Physical Metallurgy
  1996 Doctoral Graduation Course
  1993/95 Research Associate

  The University of Tokyo, Institute of Industrial Science (Japan)
  1998 Research Associate

  Tohoku National Industrial Research Institute, Sendai, (Japan)
  1998 DAAD Scholarship and Visiting Scientist

  IBM Germany GmbH
  1989 Associate at Failure Analysis Laboratory for Semiconductors, Multilayer Ceramics,
       Printed Circuit Boards and Chemistry.

  Analytics for Technology and Environment GmbH, (D), Spin-Off IBM FA Laboratory
  1998 Head of Physical Analysis and Metallographic Laboratory, Department Manager

  Robert Bosch GmbH (Germany)
  2000 Automotive Electronics, (Rt)Engineering Technology Materials Centre Ceramics;
       Foundation of Materials Centre Ceramics. Deputy Section Manager (AE/ECC)
  2005 Automotive Electronics, (Rt),Engineering Technology for Electronic Circuit Units,
       Sen. Project Manager, Low Temperature Co-Fired Ceramics. (AE/ETC1)
  2010 Automotive Electronics, (Si), Engineering for Assembly and Interconnect Technology.
       Project Manager, Development of Printed Circuit Board Technology, (AE/EAI1)

  Robert Bosch Co. Ltd (Hong Kong, SAR China)
  2012 Automotive Electronics, Head of PCB Technology Development APAC Sen. Manager, (AE/EAI-HK)

  Member of the Journal of Applied Physics, Review Board; American Institute of Physics
  Member of the German Society of Material Science (DGM e.V.)

  Robert Bosch GmbH as one of the largest automotive suppliers in the world is challenging sustainable mobility solutions for the future. One of the trends will be the electrification of the power train as well as an increased number of comfort functions and connected devices in vehicles and other applications.
  The technical requirements for Printed Circuit Board technologies and materials will be deployed from international megatrends, product, reliability and functional needs. Reliable designs have to be realized on each system level and a bottom up approach by a balanced mix of simulation and experimental verifications stimulate the time to market of engineering developments.

Thu., June 4

How to apply 

International Seminar Session III

• 14:00–15:00

  Strategies for the printed circuit industry in Europe

  Dr. Udo Bechtloff

  Chairman of the Managing Board
  KSG Leiterplatten GmbH

   Profile

  Mr Bechtloff, born in 1950, studied electronic technology at the University of Applied Sciences in Mittweida, Saxony and earned his doctorate in the field of ceramic metallization in 1977. Afterwards he worked in hybrid manufacturing at Robotron, the most important electronics manufacturer of the former GDR.

  From the mid 80s he was responsible for the set up of a production plant for scientific devices and was its technical manager until 1989.

  Between 1990 and 1996 he worked in several plants and different positions within the Fuba group, finally as the manager of R&D.

  Since January 1997 Mr Bechtloff has served as Chairman of the Managing Board of KSG Leiterplatten GmbH and since 2003 as co-partner as well. From May 2012 he has been holding the title “honorary professor in electronic materials” at the University of Applied Sciences in Mittweida, Saxony.

  Professor Bechtloff is the leader of the working group Printed Circuit Board within the German Electrical and Electronic Manufacturers’ Association ZVEI. Since 2002 he has been member of the Executive Board of the Organic Electronics Association at the German Engineering Foundation VDMA as well as the Steering Committee of the European Interconnect Technology Initiative and the industrial advisory board at the Electronics Packaging Laboratory of the Dresden University of Technology. Furthermore, Mr Bechtloff is spokesman of the advisory board of the Fraunhofer ENAS Chemnitz and is board member at the GMM within the VDE, the Association for Electrical, Electronic and Information Technologies.

  The European Union with its 28 member states and a population of more than 500 Mio. people still is one of the biggest and most important economic regions in the world.
  However, strategies to keep added value within the European Union are inevitable, otherwise the EU will - sooner or later - mutate from a superpower into a buyer´s nation.
  To mention here the electronic market which has become a critical economic factor over the (last) years. Not the entire market in principle, but the manufacturing sector of electronic components for the EU electronic market, the manufacturing of printed circuits included.
  In the 1980ies over 1.500 printed circuit manufacturers existed in Europe. Today only 265 are left over, of whom the majority is located in Germany. By numbers: 82 manufacturers or 31%.
  What are the reasons for this development and which measures have been taken by these European producers in order to counteract?
  This presentation will demonstrate possible solutions as well as positive and successful examples of how European producers operate with the objective of safeguarding the future of the electronic market in the EU.