JMID 3D-MID Seminar (Molded Interconnect Device)

Wed., June 3 - Fri., June 4, 2015　　M Room, East Hall 6　　FREE

This seminar will be held to contribute to the recognition improvement of the MID technology, and to realize the collaboration with the electronic circuit industry to contribute to market expansion in the future

Wed., June 3
Thu., June 4
Fri., June 5

Wed., June 3

10:30–11:00

Technology Trend of MID and Introduction of Japan MID Association

Hiroyuki Kamidate

Manager
Japan MID Association

11:10–11:40

The trend and applications of LPKF LDS®

Hiroyuki Kamidate

Techinical Sales Engineer
LPKF Laer&Electronics KK

13:00–13:30

3D-MID mounting using SmartFAB

Tsuyoshi Hamane

Senior Leader
FA Development dep. Design Sec.
FUJI MACHINE MFG. CO., LTD.

13:40–14:10

Plating for LDS MID Manufacturing Process - Approach for fine-pitch and environmental measures

Toshiya Watanabe

Chief
R&D, Electronics Solutions
Nippon MacDermid Co., Ltd.

14:20–14:50

Molex MID / Antenna

Welson Tan

Molex
Senior Manager
Product Design Group
Molex Global Commercial Product Division
Antenna Business Unit

15:00–15:30

The intoroduction of NEXTRA, 3D-MID Design CAD system

Dietmar Lautwein

FlowCAD Solutions GmbH

15:40–16:10

3D-MID by SKW-Method

Norio Yoshizawa

Directer
Engineering Dept.
Sankyo Kasei Co., Ltd.

16:20–16:50

MID manufacturing process using ultra-short pulse LASER

Kazuyuki Meguro

Chief technical researcher
Division of functional surface technology
Iwate Industrial Research Institute

Thu., June 4

10:30–11:00

Technology Trend of MID and Introduction of Japan MID Association

Seiji Suzuki

Manager
Japan MID Association

11:10–11:40

3D-MID by SKW-Method

Norio Yoshizawa

Directer
Engineering Dept.
Sankyo Kasei Co., Ltd.

13:00–13:30

MID manufacturing process using ultra-short pulse LASER

Kazuyuki Meguro

Chief technical researcher
Division of functional surface technology
Iwate Industrial Research Institute

13:40–14:10

Plating for LDS MID Manufacturing Process - Approach for fine-pitch and environmental measures

Toshiya Watanabe

Chief
R&D, Electronics Solutions
Nippon MacDermid Co., Ltd.

14:20–14:50

3D-MID for sensor packaging in automotive and medical application

Uwe Rudy

Project Manager MIT
Mitronics
HARTING AG, Switzerland

15:00–15:30

The trend and applications of LPKF LDS®

Hiroyuki Kamidate

Techinical Sales Engineer
LPKF Laer&Electronics KK

15:40–16:10

The intoroduction of NEXTRA, 3D-MID Design CAD system

Dietmar Lautwein

FlowCAD Solutions GmbH

16:20–16:50

Molex MID / Antenna

Welson Tan

Molex
Senior Manager
Product Design Group
Molex Global Commercial Product Division
Antenna Business Unit

Fri., June 5

10:30–11:00

Technology Trend of MID and Introduction of Japan MID Association

Masahiro Sato

Chairman
Japan MID Association

11:10–11:40

Panasonic MID Solution

Mitsuru Kobayashi

Electromechanical Control Business Division
Panasonic Corporation

13:00–13:30

3D-MID by SKW-Method

Norio Yoshizawa

Directer
Engineering Dept.
Sankyo Kasei Co., Ltd.

13:40–14:10

MID manufacturing process using ultra-short pulse LASER

Kazuyuki Meguro

Chief technical researcher
Division of functional surface technology
Iwate Industrial Research Institute

14:20–14:50

The intoroduction of NEXTRA, 3D-MID Design CAD system

Dietmar Lautwein

FlowCAD Solutions GmbH

15:00–15:30

Introduction of solderable high performance plastic for 3D-MID

Katsuhito Moriya

Technical Service
Ensinger Japan Co.,Ltd.

15:40–16:10

Plating for LDS MID Manufacturing Process - Approach for fine-pitch and environmental measures

Toshiya Watanabe

Chief
R&D, Electronics Solutions
Nippon MacDermid Co., Ltd.

16:20–16:50