JPCA Show / Large Electronics Show / WIRE Japan Show / Microelectronics Show / JISSO PROTEC / Monotsukuri Fiesta

Wed., June 3 - Fri., June 5, 2015　　Academic Plaza, East Hall 3　　FREE

Wed., June 3

• High Q-factor planar spiral RF inductor using composite core

  Makoto Sonehara^1,2), Kazuaki Furihata¹⁾, Yuki Miyajima¹⁾, Toshiro Sato1,²⁾

  Advanced Magnetic Devices Lab., Dep. of Electrical and Electronic Eng., Fac. of Eng., Shinshu Univ.¹⁾
  Spin Device Technology Center (SDTC)²⁾

• Selective plating on Aluminum and polyimide Co-existed circuit boards with UV irradiation

  Junki Oshikiri^1,2), Tatuya Nakashima^1,3), Yasushi Umeda¹⁾, Katsuhiko Tashiro¹⁾, Hideo Honma¹⁾, Osamu Takai^1,2)

  Kanto Gakuin University, Materials & Surface Engineering Research Institute¹⁾
  Graduate School of Engineering, Kanto Gakuin University²⁾
  College of Science and Engineering, Kanto Gakuin University³⁾

• A Study on Copper-Molybdenum Alloy Films by Electrochemical Technique

  Sho Kawamura¹⁾, Nobuaki Watanabe²⁾, Ichiro Koiwa¹⁾, Kim Namjae³⁾, Takeshi Ohyama³⁾

  Koiwa Laboratory, College of Engineering, Kanto Gakuin University¹⁾
  Institute of Engineering, Kanto Gakuin University²⁾
  Photo Technica Corporation³⁾

• Composite Electrodeposition of Zn-AlOx(OH)y Film from Non-Suspended Solution Using Quaternary Ammonium Salt

  Kenta Chokki¹⁾, Nobuaki Watanabe²⁾, Ichiro Koiwa³⁾, Kazuhiro Yabe⁴⁾

  Koiwa Laboratory, College of Engineering, Kanto Gakuin University¹⁾
  Institute of Engineering, Kanto Gakuin University²⁾
  Koiwa Laboratory, College of Science and Engineering, Kanto Gakuin University³⁾
  Oki Engineering Co., Ltd.⁴⁾

• Synthesis of Cyanide for Films Plated from Cyanide Free Bath-

  Ichiro Koiwa¹⁾, Nobuaki Watanabe²⁾, Shoma Koike³⁾, Norio Hirashita⁴⁾, Makoto Urano⁴⁾, Kunimitsu Maejima⁴⁾

  Koiwa Laboratory, College of Science and Engineering, Kanto Gakuin University¹⁾
  Institute of Engineering, Kanto Gakuin University²⁾
  Graduate School, Kanto Gakuin University³⁾
  Engineering Division, Kanto Gakuin University⁴⁾

• Development of the Self-deposition Coating for Various Metal Materials

  Hitoshi ISHII¹⁾, Ichiro KOIWA²⁾

  Central Research Laboratories, R&D Center IV, Nihon Parkerizing Co., Ltd.¹⁾
  Koiwa Laboratory, College of Science and Engineering, Kanto Gakuin University²⁾

• Development of Heat Resistance Insulation Coating Subject to The Metal

  Ichiro OURA¹⁾, Junichi UCHIDA¹⁾, Yasuhiro KINOSHITA¹⁾, Ichiro KOIWA²⁾

  Central Research Laboratories, R&D Center I, Nihon Parkerizing Co., Ltd.¹⁾
  Koiwa Laboratory, College of Science and Engineering, Kanto Gakuin University²⁾

• Development of micro force sensor to apply to MEMS blood flower meter

  Toshihiro Takeshita

  Kyushu university/ Microsystems & Bioengineering Lab

• Development of Evaluation Method of Bond Strength of Lead-free Solder Joint

  Fumito TAKENOUCH¹⁾, Akira YAMAUCHI²⁾

  Materials Design Laboratory, Department of Production Systems, National Institute of Technology, Gunma College¹⁾
  Department of Mechanical Engineering, National Institute of Technology, Gunma College²⁾

• Analysis of conduction path formation in Cu-loaded electrically conductive adhesives during curing in air

  M. Inoue¹⁾, T. Notsuke²⁾, Y. Sakaniwa³⁾, K. Teshigawara³⁾, Y. Tada¹⁾

  ASRLD Unit, Gunma University¹⁾
  School of Technology, Gunma University²⁾
  Graduate School of Science and Technology, Gunma University³⁾

• Transmission Characteristics Through the Bent Arm Wearing Magnetically-Coupled Coils for Body Area Communication

Thu., June 4

• Hardware Development of Lightweight Block Cipher, SPECK

  Tadashi Okabe

  Tokyo Metropolitan Industrial Technology Research Institute

• Study on the proton beam writing of SU-8 containing nanoparticles

  R. Sano¹⁾, H. Hayashi²⁾, H. Nishikawa¹⁾

  Energy Property Laboratory, Electrical Engineering and Computer Science, Shibaura Institute of Technology Guraduate School of Engineering and Science¹⁾
  Center for Flexible System Integration, Shibaura Inst. Tech.²⁾

• PBW Technology on Hyper Integration

  Hidetaka Hayashi¹⁾, Ryo Sano²⁾, Hiroyuki Nishikawa^1,2)

  Research Organization for Advanced Engineering, Center for Flexible System Integration, Shibaura Institute of Technology¹⁾
  Electrical Engineering and Computer Science, Shibaura Institute of Technology Graduate School of Engineering and Science²⁾

• Study on New High-Temperature-Resistant Packaging Using Interconnections Formed by Nickel Micro-Electroplating for SiC Power Devices

  Haruka MIYANO, Noriyuki KATO, Yasunori TANAKA, Keito OTA, Tomonori IIZUKA, Kohei TATSUMI

  Graduate School of Information, Production and Systems, Waseda University, Tatsumi Lab

• The detection of minimum BLT condition with electrical capacitance measurement

  Yasuhiro Saito, Satoru Suzuki, Takanori Komuro

  Komuro Lab/Department of Electrical and Electronic Engineering/Kanagawa Institute of Technology

• Room-temperature formation of high-adhesion Cu/glass stacks

  Mitsuhiro Watanabe, Eiichi Kondoh

  Kondoh and Watanabe laboratory, University of Yamanashi

• Nondestructive inspection inside rechargeable battery by high-resolution electric current imaging system

  Kenjiro Kimura

  Kimura Research Group, Department of Chemistry, Graduate School of Science, Kobe University

• High-Speed Through Silicon Via(TSV) Filling

  Hoang Van Ha, Chikara Funahashi, Kazuo Kondo

  Materials Process Lab., Dept. of Chemical Engineering, Osaka Prefecture University

• Rapid Detection of Pathogenic Bacteria Using Molecular-imprinting Technology

  Takamasa Kinoshita¹⁾, Hiroyuki Nakata²⁾, Shiho Tokonami²⁾, Yojiro Yamamoto^1,3), Tomoaki Nishino⁴⁾, Hiroshi Shiigi¹⁾, Tsutomu Nagaoka¹⁾

  Molecular Recognition Chemistry Group, Department of Applied Chemistry, Osaka Prefecture University¹⁾
  Tokonami Laboratory, Department of Applied Chemistry, Osaka Prefecture University²⁾
  Green Chem. Inc.³⁾
  Nishino Laboratory, Department of Applied Chemistry, Osaka Prefecture University⁴⁾

• Room-temperature wafer bonding with Au thin film using Ar rf plasma activation for application to high power optical devices

  Eiji Higurashi, Ken Okumura, Tadatomo Suga, Kei Hagiwara

  Microsystem integration and packaging laboratories, Department of Precision engineering, School of Engineering, The University of Tokyo
  NHK Science and Technology Research Laboratories

Fri., June 5

• Development of Ultra-Micro Electromagnetic Induction Generator Combined with MEMS and Multilayer Ceramic Non-Winding Wire Magnetic Circuit

  Y. Yokozeki, H. Endo, K. Maezumi, T. Suzuki, M. Takato, K. Saito, F. Uchikoba

  Uchikoba･Saito Laboratory, Nihon University

• Development of Insect Type MEMS Microrobot Using Multilayer Ceramics Non-Winding Three-Phase Induction Motor

  Y. Asano, K. Maezumi, Y. Yokozeki, K. Suzuki, M. Takato, K. Saito, F. Uchikoba

  Uchikoba･Saito Laboratory, Nihon University

• IC Design of Neural Networks for Locomotion Rhythm Generation of Microrobot

  K. Sugita, Y. Ishihara, Y. Naito, T. Suzuki, M. Takato, K. Saito, F. Uchikoba

  Uchikoba･Saito Laboratory, Nihon University

• Room temperature deposition of amorphous silicon carbide film

  Kohei Shioda¹⁾, Hitoshi Habuka²⁾

  Department of chemical and energy engineering, Yokohama National University¹⁾
  Department of chemical and energy engineering, Yokohama National University²⁾

• Suppression of Loss in an RF Transmission Line using Negative Permeability Material

  Yuki Kiyono¹⁾, Shiro Kawakubo¹⁾, Hidetoshi Nakayama1,²⁾, Makoto Sonehara^3,2), Toshiro Sato^3,2)

  NAKAYAMA Lab., Dep. of Electronics and Control Engineering, National Institute of Technology, Nagano College.¹⁾
  Spin Device Technology Center (SDTC)²⁾
  Advanced Magnetic Devices Lab., Dep. of Electrical and Electronic Eng., Fac. of Eng., Shinshu Univ.³⁾

• Quasi left-handed transmission line type RF thin film common mode filter using coupled inductor and MIM capacitor

  Yuki Watanabe¹⁾, Yasuaki Yoshisaku¹⁾, Yuya Kawai¹⁾, Makoto Sonehara^1,2), Toshiro Sato^1,2), Hidetoshi Nakayama^3,2)

  Advanced Magnetic Devices Lab., Dep. of Electrical and Electronic Eng., Fac. of Eng., Shinshu Univ.¹⁾
  Spin Device Technology Center (SDTC)²⁾
  NAKAYAMA Lab., Dep. of Electronics and Control Engineering, National Institute of Technology, Nagano College³⁾

• Multiple pulse irradiation set in the laser via hole formation for PWB

  Munetaka IOZUMI¹⁾, Toshiki HIROGAKI²⁾, Eiichi AOYAMA²⁾, Keiji OGAWA³⁾

  Doshisha University,　Laboratory of Manufacturing System and Design¹⁾
  Doshisha University²⁾
  Ryukoku University³⁾

• Investigation of data mining method based on PCB drilling tools catalog
  -Decision system of drilling condition focused on cutting distance-

  Yoshimasa SUZUKI¹⁾, Toshiki HIROGAKI²⁾, Eiichi AOYAMA²⁾, Keiji OGAWA³⁾

  Manufacturing System Design Laboratory,Graduate school of science and Enginnering ,Doshisha University¹⁾
  Faculty of Science and Engineering, Doshisha University²⁾
  Dept. of Mechanical and Systems Engineering,Ryukoku University³⁾

• Development of Thin Film Capacitor using Type BaTiO₃ Nano-Particles Mono-Dispersed Ink

  Koichi Suematsu, Masashi Arimura, Naoyuki Uchiyama, Shingo Saita, Teruhisa Makino

  Chemical and Texture Research Institute, Fukuoka Industrial Technology Center

• Fine integration at low temperature under low stress.

  Yoshihisa KATOH*¹⁾, Younggun HAN*), Osamu HORIUCHI¹⁾,Woon CHOI²⁾, and Hajime TOMOKAGE^1,2)

  Center of System Integration Platform Organization Standards, Fukuoka University¹⁾
  Department of Electronics Engineering & Computer Science, Tomokage Laboratory, Fukuoka University²⁾