Platinum Sponsor
MacDermid Alpha
MEIKO
ADTED

Introduction

  • Photo

    Chairman,
    Exhibition Organizing
    Steering Committee
    Takeo
    Takai

  • Photo

    Chairman,
    Japan Electronics
    Packaging and
    Circuits Association
    (JPCA)
    Toshifumi
    Kobayashi

  • Photo

    Chairman,
    Japan Institute of
    Electronics Packaging
    (JIEP)
    Akira
    Fujisaki

  • Photo

    Chairman,
    Japan Robot
    Association (JARA)
    Kenji
    Yamaguchi

  • Photo

    Chairman,
    Sangyo-times, Inc
    Wataru
    Izumiya

  • Photo

    President,
    KOGYO TSUSHIN
    CO,.Ltd.
    Masaki
    Inoue

  • Photo

    Chairman,
    Japan Federation of Electronic
    Parts Distributors And Dealers
    Yoshitaka
    Okumiya

  • Photo

    President & CEO,
    JTB Communication Design, Inc.
    Takayuki
    Fujiwara

  • President,
    SENKEN SHIMBUN CO.,LTD
    Koji
    Sasaki

Outline


Aim Our objective is to contribute to the advancement of the electronic circuit industry and all related fields by presenting an exhibition of products, knowledge and solutions related to the electronic circuits and packaging technologies used in all electronic devices, IT devices and equipment, as well as the design, testing and logistics of large electronics (printed electronics, stretchable electronics, etc.).
Exhibition Period Wednesday – Friday, June 12-14, 2024. 10:00 a.m. to 5:00 p.m.
Venue Tokyo Big Sight East Exhibition Halls
Sponsor
(tentative)
Ministry of Economy, Trade and Industry
Overseas Cooperation
(tentative)

World Electronic Circuits Council (WECC) Member Associates:
China Printed Circuit Association (CPCA), European Institute of Printed Circuits (EIPC),
Electronic Industries Association of India (ELCINA),
Hong Kong Printed Circuit Association (HKPCA),
IPC - Association Connecting Electronics Industries (IPC),
Indian Printed Circuit Association (IPCA), Korean Printed Circuit Association (KPCA),
Thailand Printed Circuit Association (THPCA), Taiwan Printed Circuit Association (TPCA)


Association of Electronic Industries in Singapore(AEIS),
Korea Packaging Integration Association(KPIA)

Co-sponsors
(tentative)

The Institute of Image Information and Television Engineers, Japan Information Technology Services Industry Association, Information Processing Society of Japan, Federation of Electro Plating Industry Association, The Institute of Electrical Engineers of Japan, JAPAN ELECTRICAL INSULATING and ADVANCED PERFORMANCE MATERIALS INDUSTRIAL ASSOCIATION, The Institute of Electrical Installation Engineers of Japan, Japan Electronics and Information Technology Industries Association, COPPERFOIL INDUSTRIES ASSOCIATION, Japan Association of Medical Devices Industries, Medical Technology Association of Japan, JAPAN FEDERATION OF PRINTING INDUSTRIES, Japan Audio Society , Acoustical Society of Japan, Japan Chemical Industry Association, Japan Fire Alarms Manufacturers' Association, Japan Medical Imaging and Radiological Systems Industries Association , JAPAN DIE&MOLD INDUSTRY ASSOCIATION, The Japan Machinery Federation, Japan Metal Heat Treatment Association, Japan Measuring Instruments Federation, The Japan Society Of Industrial Machinery Manufacturers, Japan Automobile Research Institute, Japan Auto Parts Industries Association, The Vacuum Society of Japan, Japan Precision Measuring Instruments Manufacturers Association, Japan Electric Association, Japan Electric Measuring Instruments Manufacturers' Association, The Japan Electrical Manufacturers' Association, Nippon Electric Control Equipment Industries Association, Japan Lighting Manufacturers Association, The Japanese Electric Wire & Cable Makers' Association, JAPAN ELECTRICAL WIRING SYSTEM INDUSTRIES ASSOCIATION, Semiconductor Equipment Association of Japan, Japan Plating Suppliers Association, Japan Fine Ceramics Association, The Japan Society for Analytical Chemistry, JAPAN ANALYTICAL INSTRUMENTS MANUFACTURERS' ASSOCIATION , THE JAPAN BEARING INDUSTRY ASSOCIATION, Japan Game-Associated Enterprise Corporation, Japan India Industry Promotion Association, The Japan Welding Engineering Society, OPTOELECTRONICS INDUSTRY AND TECHNOLOGY DEVELOPMENT ASSOCIATION, Japan Business Machine and Information System Industries Association, The Surface Finishing Society of Japan, Japan Fine Ceramics Center, Japan Automobile Manufacturers Association, Inc., Photovoltaic Power Generation Technology Reseach Association, Chemical materials Evaluation and REsearch BAse , Photonics Electronics Technology Research Association, Materials Science Society of Japan, Communications and Information network Association of Japan, Software Association of Japan, Nippon Electronic Device Industry Association, Japan Robot Association, SEMI, Japan Drone Consortium, General Incorporated Association Japan UAS Industrial Development Association, Japan Agricultural Machinery Manufacturers Association, Electric Glass Industry Association of Japan

Managed by Japan Electronics Packaging and Circuits Association (JPCA)
Secretariat Office JTB Communication Design, Inc.
Entrance Fee JPY1,000 (Tax included)
* Free Adminssion for visitors with invitations and those who have pre-registered online.

Sunway

Gold Sponsor
Dynatron
TAIYO HOLDINGS CO., LTD.
MEC Co., Ltd.
V Technology
ESI
Atotech
Silver Sponsor
Kyosha
SHOWA
Bronze Sponsor
NIKKAN INDUSTRIES CO., LTD.
TOA MUSENDENKI CO.,LTD
JPCASHOW MEKKI
Organization
Japan Electronics Packaging and Circuits Association
Japan Institute of Electoronics Packaging
Japan Robot Association
The Semiconductor Industry News
Electric Wire News
JTB Communication Design
Japan Federation of Electronic Parts Distributors And Dealers
Tokyo Electronics Appliances Wholesalers Association
SENKEN SHIMBUN CO.,LTD.