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Introduction

Chairman,
Exhibition Organizing
Steering Committee
Takeo Takai

Chairman,
Japan Electronics
Packaging and
Circuits Association
(JPCA)
Toshifumi Kobayashi

Chairman,
Japan Institute of
Electronics Packaging
(JIEP)
Eiji Higurashi

Chairman,
Japan Robot Association（JARA）

Chairman,
Sangyo-times, Inc
Wataru Izumiya

President,
KOGYO TSUSHIN
CO,.Ltd.
Masaki Inoue

Chairman,
Japan Federation of Electronic
Parts Distributors And Dealers
Yoshitaka Okumiya

Representative Director and Chairperson
Japan OSAT Association
Makoto Sumita

Outline

Exhibitions
  • PWB Tech 2027
  • Module Japan 2027
  • Flexible Printed Circuits Products Area
  • EMS Japan 2027
Organizer
Joint Shows
  • Advanced Electronics Packaging (JISSO) Technology Symposium
  • Academic Plaza
  • eX-tech 2027
Organizer
Organizer
CORE
Exhibitions
  • CORE TECHNOLOGIES Expo 2027 – AI / Photonic-Electronic Integration
Co-organizers
Co-organizers
Co-organizers
Organizer
Co-organizers
Aim Our objective is to contribute to the advancement of the electronic circuit industry and all related fields by presenting an exhibition of products, knowledge and solutions related to the electronic circuits and packaging technologies used in all electronic devices, IT devices and equipment, as well as the design, testing and logistics of large electronics (printed electronics, stretchable electronics, etc.).
Exhibition
Period		 Wednesday – Friday, June 2 - 4, 2027. 10:00 a.m. to 5:00 p.m.
Venue Tokyo Big Sight East Exhibition Halls
Sponsor
(tentative)		 Ministry of Economy, Trade and Industry
Overseas
Cooperation
(tentative)

World Electronic Circuits Council (WECC) Member Assosiations:

China Printed Circuit Association (CPCA), European Institute of Printed Circuits (EIPC),
Electronic Industries Association of India (ELCINA),Hong Kong Printed Circuit Association (HKPCA),
Global Electronics Association (GEA), Indian Printed Circuit Association (IPCA),
Korea Semiconductor Packaging and Circuits Association (KPCA), Thailand Printed Circuit Association (THPCA),
Taiwan Printed Circuit Association (TPCA)

Korea Packaging Integration Association-JKC （KPIA）
Co-sponsors
(tentative)		 The Institute of Image Information and Television Engineers, Symposium on Sensing via Image Information, The Institute of Image Electronics Engineers of Japan, Camera & Imaging Products Association(CIPA), Japan Photo Imaging Association, Japan Information Technology Services Industry Association, Information Processing Society of Japan(IPSJ), Federation of Electro Plating Industry Association, THE INSTITUTE OF ELECTRICAL INSTALLATION ENGINEERS OF JAPAN, Japan Electronics and Information Technology Industries Association, The Institute of Electronics, Information and Communication Engineers(IEICE), Copper Foil Industries Assosiation, Japan India Industry Promotion Association (JIIPA), Japan Amusement Indusry Association(JAIA), Japan Association of Medical Equipment Industries (JAMEI), Medical Technology Association of Japan, JAPAN FEDERATION OF PRINTING INDUSTRIES, Japan Audio Society (JAS) , The Acoustical Society of Japan, Japan Fire Alarms Manufacturers' Association, Japan Die and Mold Manufacturers Association, The Japan Machinery Federation, Japan Metal Heat Treatment Association, The Japan Measuring Instruments Federation (JMIF), Japan Inspection Instruments Manufacture's Association, Japan Automobile Research Institute (JARI), Japan Auto Parts Industries Association, The Japan Society of Vacuum and Surface Science, JAPAN VACUUM INDUSTRY ASSOCIATION, Japan Precision Measuring Instruments Manufacturers Association（JMA）, The Japan Electric Association, Japan Electric Measuring Instruments Manufacturers' Association (JEMIMA), The Japan Electrical Manufacturers' Association (JEMA), Nippon Electric Control Equipment Industries Association, Japan Electric Lamp Manufacturers Association (JELMA), Reliability Center for Electronic Components of Japan, The Japanese Electric Wire & Cable Makers’ Association, JAPAN ELECTRICAL WIRING SYSTEM INDUSTRIES ASSOCIATION, Semiconductor Equipment Association of Japan (SEAJ), Japan Plating Suppliers Association(KZK), The Japan Society for Analytical Chemistry (JSAC) , Japan Analytical Instruments Manufacturers' Association, The Japan Bearing Industry Association (JBIA) , The Japan Welding Engineering Society (JWES), OPTOELECTRONICS INDUSTRY AND TECHNOLOGY DEVELOPMENT ASSOCIATION, Japan Business Machine and Information System Industries Association ( JBMIA ) , The Japan Fine Ceramics Center (JFCC) , Japan Embedded Systems Technology Association (JASA）, The Materials Science Society of Japan, Communications and Information Network Association of Japan (CIAJ), Software Association of Japan, Nippon Electronic Device Industry Association, Japan Drone Consortium, Japan Agricultural Machinery Manufacturers Association, Electric Glass Industry Association of Japan, Japan Robot System Integrator Association, The Society of Instrument and Control Engineers (SICE), Japan Chemical Fibers Association

※Subject to change
Organized by Japan Electronics Packaging and Circuits Association (JPCA)
Secretariat Office Power Project Co., Ltd.
Entrance Fee 1,000 Yen (tax included)

* Free Adminssion for visitors with invitations and those who have pre-registered online.

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