Wed., June 5
＜西展示ホール内2F 西1商談6＞NPI会場A
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Surface Modified PTFE Sheet for 5G << Realization of Low Contact Angle >>
Hiroyoshi Kubo
komiyama electron corp. Corporate Officer
The developed PTFE sheet can be used as a high frequency printed circuit board material for 5G high speed communication. Replace the fluorine on the PTFE surface with hydroxide using a proprietary ion beam source. Wettability is greatly improved. The PTFE surface has a single-digit contact angle and has high adhesion with Cu.
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Orbotech New Product Introduction: Direct Imaging System for Solder Mask - Orbotech Diamond 10 and others
Orbotech Japan Co., Ltd.
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PC based AOI using game graphics card
Nobuo Ohtake
Stella Corporation CEO
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Persons wishing to participate, please come directly to the venue.
Please come to our booth (West Hall 2-111).
＜西展示ホール内2F 西2商談6＞NPI会場B
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Paper Substrates Creat New Devices and NFC tags.
Haru Wakasugi
Techno Alpha Co.,LTD. Marketing Manager
Though digital devices are emerging lately, papers are no way ignored yet.
We present “PowerCoat”, paper substrates developed by Arjowiggins, France, the world leading manufacturer of creative papers, to add new values on papers such as "Sensing", “information” etc. PowerCoat makes you realize cutting-edge devices and NFC tags thanks to its cost merit, touch, presence and disposal easiness.Apply to
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LPKF Laser cutting technology which German Tier 1 approved.
Hiroyuki Kamidate
LPKF Laser & Electronics K.K. Technical Sales
Laser cutting technology is good at HDI assembled PCB. New LPKF laser cutting system implement best quality PCB cutting with additional new features like high speed cutting and non-carbonized edge. Introducing the high performance laser cutting technology which is approved by German Tier 1.
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Yoshiteru Kawakami
INNOTECH CORPORATION IC SOLUTION B.U. ICS TECHNICAL Dept.2
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Thu., June 6
＜西展示ホール内2F 西1商談6＞NPI会場A
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New SMT cleaner realizes static control
Tomomi Shinohara
BRUX JAPAN CO., LTD. President
This seminar highlights the new SMT cleaner that realized combining two vital functional requirements, for the SMT industry, board cleaning and static control.
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Latest Technology of FANUC Robot
Shinsuke Sakakibawa
FANUC CORPORATION ROBOT Business Division
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Takahisa Oshita
Techno Alpha Co., Ltd. Electronics Group Assistant Manager
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Orbotech Solution for 5G & Flex
Yasushi Kimura
Orbotech Japan Co., Ltd. PCB Department Vice President
＜西展示ホール内2F 西2商談6＞NPI会場B
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Development Trend of Dry Film Resist Stripper
Nana Hattori
MELTEX INC. PWB Application Development, Technology Development Dept. Chief Engineer
High resolution and excellent adhesion strength are required to DFRs for fine pattern formation of high-density package substrates, but these can cause the difficulty on DFR stripping.
In this presentation, our action for development of DFR stripper and environment-oriented policy will be presented.
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Persons wishing to participate, please come directly to the venue.
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HIROSHI ONO
MITSUI MINING & SMELTING CO.,LTD Engineered Materials Sector Copper foil Division
In recent years, with the background of explosive increase in data volume, the frequency increase of electrical signals has been accelerated. Therefore, we are required to evaluate and grasp the transmission loss of the circuit in advance. We usually make several substrates and evaluate the transmission loss. However, although the substrates are made from the same CAD data, often the losses do not match. Are there other factors that affect transmission loss other than the variation of the materials used? I investigated the influence of the cross-sectional shape of the circuit, the surface treatment of the circuit, the grain size of the copper foil, and the anticorrosion plating.
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The latest technical information of drilling and routing for printed circuit board.
Yukiyoshi Hoshi
UNION TOOL CO. Tool Engineering Department, PCB Tool Department Section Manager
The latest information about the recent tool developments and future prospects of PCB drilling and routing basing on user’s needs by PCB applications.
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Failproof thermal design method of circuit boards for electronic designers
Naoki Kunimine
KOA CORPORATION Technical adviser President of Thermal Design Laboratory Co.,Ltd.
Dispersion of heat source by layout and spread of heat by pattern are important for heat dissipation of small components. However, it is difficult for electric designers to design a board considering heat.
The thermal design procedures and tools for small components will be introduced.Apply to
Persons wishing to participate, please come directly to the venue.
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Use of small and high-rated components in thermal design of boards
Yoshinori Aruga
KOA CORPORATION Technology and Engineering Center Meister
The power density of small components has increased significantly in recent years. As a result, the number of problems caused by unintended component temperature rises has increased. We will introduce the key points in using small and high rated components with experimental data.
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JCU Product Applications for 5G
Ryosuke FUJIWARA
JCU CORPORATION
Total process that enables wiring connection reliability and high precision wiring formation technology for 5G compatible substrates.
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Hiroyuki Takayanagi
INNOTECH CORPORATION IC SOLUTION B.U. OrCAD SALES DEPT.
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Fri., June 7
＜西展示ホール内2F 西1商談6＞NPI会場A
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Masaki Izumiyama
Hitachi High-Tech Science Corpration
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Development high performance stencil with new metal coating for SMT process
Kimiko Hashimoto
PROCESS LAB. MICRON Co.Ltd.
It is the important issue in miniaturization of MLCC in electronic industry that the guarantee of necessary volume as print in SMT process with high aspect ratio opening. We have achieved to solve this problem by developing the new metal coating technology onto stencil surface providing high printing performance.
＜西展示ホール内2F 西2商談6＞NPI会場B
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Electrolytic copper plating bath for ETS
Takuya Okamachi
C. Uyemura & Co., Ltd. Research and Development Division Senior researcher
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Tomofumi Miyashige
NALTEC, Inc.
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Tetsuo Shinno
All Sensors Asia Pacific K.K.
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TEL. +81-47-489-5939 FAX. +81-47-489-5940 tomari@allsensors.com