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JPCA Show / Microelectronics Show / JISSO PROTEC /
Large Electronics Show / WIRE Japan Show

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Exhibit Profile

JPCA Show 2017

PWB Tech 2017
PWB Tech 2017 How to Apply
Products Single-sided, double-sided, and multi-layered printed wiring boards, flexible printed wiring boards, build-up wiring boards, flex-rigid printed wiring boards, ceramic wiring boards, metal (copper, aluminum, etc.) based printed wiring boards, other printed wiring boards, and related books, etc.
Design Technologies Functional design (circuit design for functional requests) technology, logical design (circuit diagram design) technology, parts layout design and bill of materials, pattern design, layout design, structure design, various design support tools (for the above listed technologies), signal integrity design support tools, power integrity design support tools, electromagnetic field analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
Reliability and Inspection Technologies Inspection and assessment contract services, various kinds of inspection devices, various testing devices, evaluation/analysis systems, inspection jigs, and related books, etc.
Main Materials Rigid copper clad laminates (CCLs), flexible copper clad laminates (FCCLs), shield boards, multi-layer PWB prepregs, copper foil with adhesive, ceramic board materials, copper/aluminum board materials, special board materials, various insulating materials, solder mask materials, and related books, etc.
Processing Technologies, Materials and Equipment Plating, mold casting, hole drilling, plate making, plating chemicals, surface processing chemicals, etching chemicals, various inks, pastes, various tools, dry film resist, and related books, etc.
Manufacturing Equipment Chemical processing device, photolithography exposure equipment, machining equipment, transportation equipment, coating equipment, plasma processing equipment, laser processing devices, printing equipment, and related books, etc.
Environmental Systems Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (such as heat exchangers/waste heat utilization systems/thermal storage systems), and related books, etc.
Distribution Systems Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc.
Module Japan 2017
Module Japan 2017 How to Apply
Products Rigid substrate, build-up substrate, tape substrate, COF/TAB, ceramic substrate, lead frame, wafer-level package, two-dimensional package (SiP), three-dimension packages, silicon interposer, glass interposer, MEMS interposer (with rewiring layer), functional layer interposer, rigid active device embedded substrate, flexible active device embedded substrate, rigid passive device embedded substrate, flexible passive device embedded substrate, module device embedded substrate, IPD device embedded substrate, MEMS device embedded substrate, LTCC, bare dies, WLCSP/WLP, BGA (CSP), LGA, QFN, Chip parts, complex chip parts, IPD, modules of various types, MEMS, books on related topics, and related books, etc.
Design Technologies Functional design (circuit design for functional requests) technology, logical design (circuit diagram design) technology, parts layout design and bill of materials, pattern design, layout design, structure design, various design support tools (for the above listed technologies), signal integrity design support tools, power integrity design support tools, electromagnetic field analysis (measures for EMC/EMI/SI), electrical, mechanical, and thermal property simulators, CAE devices such as CAD, CAM, CIM, and related books, etc.
Reliability and Inspection Technologies Inspection and assessment contract services, various kinds of inspection devices, various testing devices, evaluation/analysis systems, inspection jigs, and related books, etc.
Main Materials Core multi-layered PWBs, organic package substrate materials, various alloys (Fe-Ni, Cu), polyimide film/tape, ceramic board materials, silicon wafers, glass blanks, organic/inorganic rewiring layer and materials, metal plates/radiator plates, metal stiffener plates, semiconductor insulating layer materials, optical wave guide materials, solder mask materials, organic/inorganic board (insulating) materials, copper foil carriers, film carriers, and related books, etc.
Processing Technologies, Materials and Equipment Plating, mold casting, hole drilling, plate making, plating chemicals, surface processing chemicals, etching chemicals, various inks, pastes, various tools, dry film resist, die bonding materials, bonding wire, solder balls, bump materials, metal barrier materials, sealing resin, underfill, coating materials, various adhesives agents, conductive/nonconductive film, conductive/nonconductive paste, metal masks, and related books, etc.
Manufacturing Equipment Chemical processing device, photolithography exposure equipment, machining equipment, transportation equipment, coating equipment, cleaning equipment, back-grinding equipment, CMP equipment, dicing equipment, wire bonders, die bonders, flip chip bonder, dispenser, plasma processing equipment, laser drilling equipment, RIE (Reactive Ion Etching) equipment, laser marking equipment, laser trimming machine, thermosetting device, printing equipment, and related books, etc.
Environmental Systems Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (including heat exchangers/waste heat utilization systems/thermal storage systems) and related books, etc.
Distribution Systems Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc.
EMS Japan 2017
EMS Japan 2017 How to Apply
Products Printed wiring mount board (printed wiring board on which electronic components are mounted and electrically interconnected; eg., AV or digital home appliances, mobile devices, automobiles, PCs and PC peripherals, household appliances and industrial equipment, and motherboards for powered devices), mounted module substrate (a module substrate on which electronic components are mounted and electrically interconnected; eg., AV and digital home appliances, mobile devices, automobile, PCs and PC peripherals, household appliances and industrial equipment, and module boards and IC packages for powered devices), insertion device mounted board, chip component mounted board, IC package mounted board, wire bonding mounted board, TAB/COF mounted board, flip chip mounted board, other electronic circuit boards, memory and storage devices, general-purpose logic ICs, transistors, diodes, optical semiconductors, sensor/imagining elements, high-frequency devices, microcomputers, ASIC, specific-purpose ICs (for use in TVs, AV equipment, communications equipment, in-car devices, and peripherals), general-purpose linear ICs (power supply ICs, motor drivers, LED drivers, transistor arrays, operational amplifiers and comparators, intelligent power devices (IPD), etc.), and related books, etc.
Design Technologies Packaging and structural design technologies, functional design technologies, logical design technologies, part layout design technologies, bill of materials (BOM), pattern design, layout design, various design support tools, 2D CAD, 3D CAD, digital mock-up tools, knowledge management systems, plotters/printers, CAM, process simulators, CAE (mechanism analysis, structure analysis, thermo-fluid analysis, resin flow analysis, casting analysis, electromagnetic field analysis, press analysis), analyzing service by contract, and related books, etc.
Reliability and Inspection Technologies Electronic circuit mounted board/ semiconductor integrated circuit inspection and assessment contract services, various kinds of electronic circuit mounted board and semiconductor integrated circuit inspection devices, various kinds of electronic circuit mounted board and semiconductor integrated circuit testing devices, various kinds of electronic circuit mounted board and semiconductor integrated circuit evaluation and analysis systems, burn-in devices, logical testing devices, memory test devices, linear testing systems, inspection jigs, testing, inspection and assessment contract services, and related books, etc.
Main Materials Electronic circuit boards, module substrates, wafers, mask materials, solder, lead frames, molding compounds, packaging materials, product structural components, other main materials used in the manufacture of electronic circuit mounted boards, development services by consignment, and related books, etc.
Manufacturing Equipment, and Processing Materials and Equipment Processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing printed wiring mounted boards (including for processes such as mounting, embedding, insertion and assembly of parts and devices), processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing mounted module substrates (for processes such as die layering and stacking, embedding and assembly, dicing, bonding, packaging, sealing, marking, soldering and other mounting and assembly processes), processing equipment and materials such as agents, chemicals, pastes, films, jigs and tools for manufacturing semiconductor integrated circuits (for processes such as single-crystal processing/exposure, depiction/resist processing/etching/heat treatment/ thin film formation/ion implantation/ washing and drying, etc.), various types of machine tools for device production, casting, defining/washing equipment, various transportation systems and equipment, pure water/ liquid agent/water treatment equipment, various types of gas devices, clean rooms, control equipment, FA systems, and related books, etc.
Environmental Systems Water pollution control system, waste material and liquid processing, global-warming prevention system, air pollution control system, land contamination prevention system, noise control system, energy conservation system, CO2 reduction system, heat utilization (including heat exchangers/waste heat utilization systems/thermal storage systems) and related books, etc.
Distribution Systems Transportation, packaging and packing equipment, embossed carriers, trays, tubes, internal and external boxes, logistics system, transportation system, trade control service, procurement and commissioned production, ordering system, drawing and documentation control systems, security systems, inventory control systems, traceability control, warehouse control system, intellectual property management systems, IT solutions, and related books, etc.

Microelectronics Show 2017 How to Apply

Leading-edge products based on high-density or high-frequency packaging technologies, high-density substrate and interposers, component contained boards, semiconductor chips, systems in package (SiP), systems on chip (SoC), indication/optical devices and sensors, materials related to high-density packaging, pastes, lead-free solder and junction materials, sealing resins, adhesives,, and underfill materials, anti-heat materials, high frequency ready polymer, systems and devices related to high-density packaging such as bonders (e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip (FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB systems and equipment and production facilities, and related books, etc.

JISSO PROTEC 2017 How to Apply

Electronic Component Placement Machines and related Equipment and Systems Electronic component placement machines, electronic component insertion machines, screen printers, soldering equipment (reflow oven), and dispensers
Packaging related Equipment and Systems Transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines
Semiconductor Packaging Machines and Systems Wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems
Inspection/Test Equipment Automated optical inspection equipment, inspection/measuring equipment associated with semiconductor manufacturing, and inspection/measuring equipment associated with other packaging
Packaging Design Systems Design tools, production optimizing software, and packaging programming devices
Packaging Devices/Components and related Materials SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, and bulk supplies
Packaging Device Packaging Materials Taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases
Packaging Joining Systems Soldering devices, solder/joining materials, and underfill materials
High Frequency Compatible Devices, Components, and Materials Devices, components, and materials
Environment related Devices and Materials Devices and materials associated with the zero emission process and waste treatment recovery
Publications Related books in every field

Large Electronics Show 2017

PE PROCESS 2017
PE PROCESS 2017 How to Apply
Applications of Printed Electronics Printed electronics substrate (rigid and flexible), display products (organic TFT, organic/inorganic EL, LCD, electronic papers, wearable displays, 3D displays, POP displays, etc.), next-generation lighting, AC EL lighting, light control film, electrophoresis, chemical compound solar cells, die sensitization solar cells, organic film solar cells, fuel cells, capacitors, flexible speakers, flexible actuators, antenna modules, RFID, printed memory, printed tags, smart labels, organic devices, light circuit/light communication devices, electromagnetic wave shielding film, ceramic capacitors, thin-film transistors, organic transistors, sensor modules, and related books, etc.
Main Printed Electronics Materials Conductive materials, semiconductor materials, dielectric materials, insulating materials, metal nano-particles, oxide semiconductors, flexible sheets, and related books, etc.
Process Materials Conductive ink, insulating ink, ink-jet ink, metal colloid, organic EL, color filters, orientation panels, encapsulation materials, barrier materials, transparent conductive film, functional film, light-curing materials, photoelectric conversion materials, photocatalysts, polymer semiconductor materials, and related books, etc.
Design Technologies Various design simulations, molecular design software, design tools, analysis tools, ultra-high-precision measurement machine design tools, and related books, etc.
Reliability and Inspection Technologies Surface defect inspection device, layer thickness measurement devices, film defect inspection device, contact angle measurement device, various electronic microscopes, transmittance measurement device, uneven layer thickness analysis device, organic EL brightness assessment system, phase difference measurement device, polarization measurement device, brightness measurement device, illuminance measurement device, chromaticity measurement device, retardation measurement device, spectroscopic ellipsometer, spectral interference layer thickness measurement device, and related books, etc.
Manufacturing Equipment Ink-jet printing devices, nano-imprint devices, micro contact printing, dispenser, laser abrasion, laser transcription, gravure printing (including gravure offset printing), screen printing (including rotary screen printing), flexographic printing, transfer printing, Roll to Roll pattern forming, photo lithography, fine pattern exposure device, coating, drying, curing, and burning devices (ultraviolet ray, electron beam, far-infrared ray), heat laminate device, surface processing device, and related books, etc.
Device Engineering 2017
Device Engineering 2017 How to Apply
Parts, MEMS and Devices MOS logic/micro/memory semiconductors, digital bipolar semiconductors, system LSI, analog IC, photo IC, power IC, discrete semiconductor or other semiconductors, memory devices, passive devices (resistors, capacitors, transformers, coils, inductors, oscillatory parts, filters), noise prevention devices, connection parts (connectors, switches, relays), conversion parts (acoustic parts, magnetic heads, ultra-small motors, sensors), functional parts, photo MEMS (mirrors, switches, scanners, etc.), RF-MEMS (switches, oscillatory devices, filters, etc.), sensor MEMS (acceleration, angularity, velocity, pressure, gas, temperature, etc.), fluid MEMS (micro flow channels, micro reactors, etc.), actuator MEMS (valves, pumps, etc.), power MEMS (fuel cells, compact generators), bio/chemical MEMS (DNA/RNA chips, chemical substance inspection, etc.), integrated MEMS (CMOS/LSI integrated devices, etc.)
Parts, MEMS and Device Materials Semiconductor Silicon, chemical compound semiconductor materials, organic semiconductor materials, magnetic materials (ferrite), dielectric materials, electronic parts materials, electronic parts metal materials, permanent magnets, bond magnets, piezoelectric ceramics, quartz materials, non-lead piezoelectric materials, liquid phase method materials, electrode materials, piezoelectric film (ZnO, AIN, PZT), sapphire, polymers, LTCC substrates, glass substrates, Si, and related books, etc.
Process Materials and Equipment Film-forming and wiring materials, film-forming materials for CVD and ALD, CVD materials and gasses, ion injection gas, photo masks, liquid immersion lithography materials, photo resist materials, etching fluid and gas, CMP polishing materials, various detergents, various synthetic materials, various additives, surface-active agents, various solvents, tape or pasting materials, adhesives, protection materials, nanotubes, film materials for MEMS (e.g. getter materials), polymer materials such as dendrimer, polymer materials, sterile clothes/gloves/masks/shoes/caps, clean rollers/wipers/various rolls/brushes, static charge free products/dust-free products, clean room/clean bench/isolators, films/mats/sheets, particle counters, air conditioners, filters, other cleaning-related tools, and related books, etc.
Design Technologies Hardware design solutions (system LSI, ASIC/ASSP, MPU/DSP, FPGA/PLD devices, EDA), function design, logic design, layout design, structure design, signal integrity design support tools, power integrity design support tools, electromagnetic field analysis tools (for EMC/EMI), electrical, mechanical, and thermal property simulators, CAE support equipment such as CAD, CAM, CIM, and related books, etc.
Reliability and Inspection Technologies Inspection consignment services, burn-in device, logic test equipment, memory test equipment, linear test system, various inspection devices, various test devices, waveform measurement devices, transmission characteristic instruments, wireless communication measurement devices, semiconductor/IC measurement devices, industrial measurement devices, evaluation/analysis systems, inspection jigs, and related books, etc.
Manufacturing Equipment Wafer processing equipment, single crystal production device, exposure/depiction device, resist processing equipment, etching equipment, dry etching device, heat processing device, thin film forming device (CVD devices, sputtering devices, etc.), ion injection device, CMP equipment, cleaning-drying equipment, various transportation systems and equipment, pure water/chemical liquid/water processing equipment, various gas devices, dicing equipment, micro/nano dies, nano imprint device, ion beam processing equipment, micro radiation processing equipment, sheet forming equipment, extrusion/casting/injection molding machine, pressurized forming equipment, laser micro processing equipment, thin film coating equipment, drying furnaces, burning/sintering equipment, microwave heating equipment, dissolution process equipment, fracturing process equipment, ultrasound processing equipment, wafer bonding equipment (aligner), deep etching equipment (for MEMS), clean room equipment, and related books, etc.
SS(Solid-State)Lighting 2017
SS(Solid-State)Lighting 2017 How to Apply
LED/OLED Applications High luminance LED, organic EL, electronic circuit boards for mounting power IC/IGBT/inverters and other high power devices, or electronic circuit boards already mounted with the above, LED/OLED (Organic EL) lighting devices, lighting modules/units, various types of display devices, display backlight units, in-car units, LED/organic EL lighting implements and devices, LED/OLED lighting control systems, power supply, driver IC controllers, and related books, etc.
LED/OLED Main Materials Crystal substrates, electrode materials, glass substrates, resist materials, phosphor, ceramic materials, organic EL materials, lead frames, and related books, etc.
Processing Materials and Equipment Bonding wires, molding materials, binding/sealing materials and pastes, resins, heat sinks, heat-release/heat-resistance materials, coating materials, solder, masks, desiccant, reflective material, lenses, metal mold, polarizer, light reflector, optical film, and related books, etc.
Design Technologies Optical design tools, thermo-fluid analysis tools, structural analysis tools, CAE/CAD/CAM and other design support tools, PLM/CPC/PDM, and related books, etc.
Reliability and Inspection Technologies Appearance inspection system/surface inspection system, LED/OLED measuring instrument, luminance measuring instrument, thermal resistance measuring instrument, color measuring instrument, illuminance measuring instrument, spectroscopic/photometric measuring instrument, current/voltage measuring instrument, acceleration/life testing machine, and other inspection/measurement/test/evaluation related instruments, and related books, etc.
Manufacturing Equipment Coating equipment, resist processing equipment, exposure device, etching equipment, bonder, joining machine, molding/sealing-process-related equipment, cleaning equipment, carrier device, clean-related equipment, anti-electrostatic equipment, water processor, gas/chemical supplying device, lighting module, unit assembly equipment, mounted device, and related books, etc.

WIRE Japan show 2017 How to Apply

Industrial equipment and communications, such as electric wires, cables, connectors, electric wire processors, AWM, wire harness processors, and electric wire or cable measuring instrument, and related books, etc.

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Gold Sponsor
Meltex
TAIYO INK
MEKTRON
SHIKOKU CHEMICALS
Orbotech
FPC connection
FISCHER INSTRUMENTS
ESI
Silver Sponsor
MacDermid
Bronze Sponsor
Somar
JPCA Plating_Committe
JPCA Shikizai
Organization
Japan Electronics Packaging and Circuits Association
Japan Institute of Electoronics Packaging
Japan Robot Association
The Semiconductor Industry News
Electric Wire News
Co-located Exhibitions
Smart Sensing 2017
Smart Factory Japan Japan 2017
2017 防災産業展 in 東京
Partner's Exhibition
PCB EXPO
JAPANiCAN