JIEP Advanced Electronics Packaging (JISSO) Technology Symposium
Wed., June 3 - Fri., June 5, 2015 
Symposium A Room, Symposium B Room in East Hall 6 PAID
Wed., June 3
Symposium Room A
The future and application of power electronics
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Future prospect of the latest power semiconductor devices
Noriyuki Iwamuro
University of Tsukuba
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Latest Power Device for Realized High Efficiency Inverter
Seiki Igarashi
Fuji Electric Co.,Ltd.
Evolution of in-vehicle system and
directionality of packaging technology innovation
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Development trend of advanced automotive electronics
Yoshiyuki Hattori
TOYOTA CENTRAL R&D LABS., INC.
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Trend and Challenges of Automotive Power Devices
Arihiro Kamiya
DENSO CORPORATION
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SI/PI/EMI Simulation Techniques and Application to Automotive Design
Hideki Asai
Shizuoka University
Symposium Room B
IoT/M2M and its requested latest technology
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Agricultural Renaissance by IoT (Temporary)
Hiroshi Shimamura
Vegetalia Corp., Ltd.
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Manufacturing technology for MEMS sensors toward Trillion Sensors Universe
Hiroto Kanao
SPP Technologies Co., Ltd.
The near future technology to food, health, and life
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Plant factory business of Toshiba
Noriaki Matsunaga
Toshiba corporation
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Verbal analysis of Pathophysiology; Technology that can realize early detection of disease from voice
Shunji Mitsuyoshi
The University of Tokyo
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Fabric Microsystems Using Nano/Micro-Machining and Weaving Integration of Fiber-Type Substrates
Toshihiro Itoh
The University of Tokyo
Thu., June 4
Symposium Room A
Expectation for the next generation wide gap power device
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Diamond Junction FETs
Mutsuko Hatano
Tokyo Institute of Technology
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Present situation and challenges of SiC power devices
Hiroshi Yamaguchi
National Institute of Advanced Industrial Science and Technology
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Power electronics application of a normally-off GaN transistor
Satoru Takahashi
Panasonic Corporation
Relations between robot and human society
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Current Status and Challenges of Rescue Robots
Masatoshi Hatano
Nihon University
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Cool technology of assist suit
Katsuhisa Asano
Activelinnk Co.,Ltd.
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Trend of MEMS Sensors and Sensor Networks for Trillion Sensor World
Hiroshi Imamoto
Micromachine Center
Symposium Room B
Current state and the future of new devices for healthcare (temporary)
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Jisso technologies for micro/nano medical devices
Norihisa Miki
Keio University
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Development of Medical and Healthcare Devices Using Microsystems
Yoichi Haga
Tohoku University
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HealthCare Monitoring System Design and Applications in Cloud Computing Era
Kiyoshi Itao
The Advanced Institute of Wearable Environmental Information Networks
Innovative technology of the next generation material for assembly
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Development of inorganic Anisotropic Conductive Films (i-ACF)
Shunji Kurooka
FUJIFILM Corporation
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Development of thermal conductive film materials for the thermal resistance reduction
Hiroshi Takasugi
NAMICS CORPORATION
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Ultra-fine Pattern Formation technologies and action assignment for 2.5D interposer
Diasuke Fujimoto
Hitachi Chemical Co.,Ltd.
Fri., June 5
Symposium Room A
View of the next generation society opening by wearable equipment
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Wearable Communication using Near-field Intrabody Communication
Yaso Kato
Aoyama Gakuin University
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The Electro Packaging Technology of Wearable equipment in Epson
Akira Makabe
SEIKO EPSON CORPORATION
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M2M Escalation Changes the Business of Electronics and RF Modules-The trend of Sensors and RF Modules-
Sakae Kajita
Non Profit Organization Circuit-Network
How becomes 2.5D, 3D Packaging ?
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New Technology Trends of 2.1D, 2.5D, 3D Packaging
Susumu Honda
Non Profit Organization Circuit-Network
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HMC (Hybrid Memory Cube) and 3D Integration
Yoshitomo Asakura
Micron Japan, Ltd.
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Innovations in Smart & Connected Device Packaging
Kinya Ichikawa
Intel K.K.
Symposium Room B
Electronics Packaging Technologies
for Next Generation Mobile Equipments
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Capacitor Embedded Interposer using Narrow Gap Chip Parts Mounting Technology
Katsuya Kikuchi
National Institute of Advanced Industrial Science and Technology
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Electroless platable polyimide-film after desmear process, and application to build-up process
Tadahiro Yokozawa
UBE INDUSTRIES, LTD.
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High density organic package for 2.1D,2.5D interposer
Noriyoshi Shimizu
SHINKO ELECTRIC INDUSTRIES CO., LTD.
Embedded substrate technology that keeps evolving and its strategy
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J-Devices' PLP (Panel Level Package) Technology
Akio Katsumata
J-DEVICES Corporation
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Panel Level Embedded Substrate Technology for High Performance Application
Yu-Hua Chen
UNIMICRON
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The latest trend of embedded components substrate “EOMIN™”
Masashi Miyazaki
TAIYO YUDEN CO.,LTD.
How to attend JIEP Advanced JISSO Technology Symposium
1. How to apply
Not yet pre-registered as visitors
Already pre-registered
Tickets are sold every morning from 9:30am at the ticket booth located on the JIEP Advanced JISSO technology symposium stage at East hall 3 of Tokyo big sight.
2．Admission fee
| 1 Session | 2 Session | 3 Session | |
|---|---|---|---|
| JIEP/JPCA/JARA Member | 10,000JPY | 12,000JPY | 14,000JPY |
| Non-Member | 14,000JPY | 16,000JPY | 18,000JPY |
| JIEP Senior Member | 5,000JPY | 6,000JPY | 7,000JPY |
| Students | 1,000JPY | 2,000JPY | 3,000JPY |
3．How to pay
- Please pay the admission fee by cash at the ticket booth located on the JIEP Advanced JISSO technology symposium stage at hall 3 of Tokyo big sight.
- Events
- Seminar Programs & Events
- Keynote Speech/
Panel Discussion - JIEP Advanced Electronics Packaging (JISSO) Technology Symposium
- International Seminar NEW!
- EHS Seminar / UL Forum NEW!
- NPI Presentation
(Exhibitor's seminar) - PROTEC Seminar
- JMID 3D-MID Seminar
(Molded Interconnect Device) - Academic Plaza
- IPC Hand Soldering Competition Japan
- Platinum Sponsor
- Gold Sponsor
- Silver Sponsor
- Bronze Sponsor
- Organization
- Partner's Exhibition
