다양한 기획이나 행사

• 글로벌 서킷 컨벤션
• Special Events List
• JPCA 창립50주년기조 강연
• 제 1회 프린티드 일렉트로닉스 컨벤션
• 최첨단 실장 기술 심포지엄
  • >> Wed.,June 13
  • >> Thur.,June 14
  • >> Fri.,June 15
• KPCAパビリオンセミナー
• Other Open Seminars

최첨단 실장 기술 심포지엄

●6월13일（수）～ 6월15일（금）

Wed.,June 13

A Room 9:30～16:20

A.M. 9:30～　Battery for Environment-Friendly Society

EV’s possibility for future social system

Youichi Kishimoto

General Manager,
Technology Marketing Department,
Planning and Advanced Engineering Development Division,
NISSAN MOTOR CO., LTD.

Power System Development for Eco-Society with Secondary Batteries

Kenji Tanaka

Assistant Professor,
School of Engineering,
The University of Tokyo

Hydrogen and Fuel Cell Technology

Hisataka Yakabe

Hydrogen system Team Leader,
Technical Research Institute,
Tokyo Gas Co., Ltd.

P.M. 13:30～　Future of Japanese Electronic Industry

Beyond triumph and defeat

Tomihiro Nakamori

Chief Strategist,
NikkeiBP Consulting

“Future Prospect” How electronics industry will change in next 10 years?

Sakae Tanaka

President Chief Business Planner,
Aqaubit corp.

B Room 9:30～16:20

A.M. 9:30～　Power Integrity and EMC

Power Integrity Co-design

Toshio Sudo

Professor,
Dept. of Electronic Engineering,
Shibaura Institute of Technology

Power Integrity Assessment for 3D High Density Packaging

Yutaka Honda

Design Solution Group,
ATE Service Corporation

PCB Pattern Design Method Considering LSI Power Characteristics for Stabilizing LSI Operation and Reducing Noise Emission

Motoki Hiroyuki

PCB Development Group,
Aica Kogyo Co., Ltd.

P.M. 13:30～　Superior Materials Technology in the World

The latest via-filling plating technology From Build-up PWB to TSV

Shingo Nishiki

Manager, Research, Metal Finishing,
OKUNO CHEMICAL INDUSTRIES CO., LTD.

Potential of Glass for 3D Interconnection

Shintaro Takahashi

Assistant Manager,
Technology Planning Gr., Technology Development General Div., AGC Electronics,
ASAHI GLASS CO., LTD.

Optical Film applied for FPD and TSP_ From Input to Output

Tadayuki Kameyama

General Manager,
Development Dept.4, R&D Div., Information Fine Materials Sector,
Nitto Denko CorporationN

PAGE TOP ▲

Thur.,June 14

A Room 9:30～16:20

A.M. 9:30～　Bio and Chemical Devices Connection to Electronics

Microfluidic Devices for Novel Bio- and Environmental Technologies

Teruo Fujii

Professor,
Institute of Industrial Science,
University of Tokyo

Manufacturing and Application of Plastic Micro Chemistry System chip

Susumu Arai

S-BIO Business Div. Research Dept.,
SUMITOMO BAKELITE CO., LTD.

Bio Chemical Process Innovation by Microfluidic Control

Shigenori Togashi

Unit Leader, Senior Researcher,
Mechanical Engineering Research Center,
Hitachi, Ltd., Hitachi Research Laboratory

P.M. 13:30～　Revival of Japanese Electronic Industry

The future of value and electronics

Morinosuke Kawaguchi

Associate Director,
Arthur D. Little (Japan), Inc.

Electronics Industry A Historical View

Yoshio Nishimura

Technology Journalist

B Room 9:30～16:20

A.M. 9:30～　Recent Technology Trends on Power Electronics in the EV HEV era

Semiconductor Packaging Technology for Power Electronics

Shinichi Hiramatsu

Lead Frame Package Engineering Department,
Packaging & Test Technology Division, Production and Technology Unit,
Renesas Electronics Corporation

Tasks and updates for Power Device Packaging Technology

Masahiro Kikuchi

General Maneger,
Module Package Technology Sect.Packaging Technology Dept. Semiconductors Technology Div.
Matsumoto Factory Electric Devices Business Headquarters,
Fuji Electric Co., Ltd.

Evaluation of Reliability of Power-Modules and Packaging Processes

Qiang YU

Associate Professor,
Department of Mechanical Engineering,
Yokohama National University

P.M. 13:30～ The heat radiation and Cooling Technology for the High-density Package

Estimation of Temperature Distribution of PCB with Effective Thermal Conductivity

Tomoyuki Hatakeyama

Assistant Professor,
Department of Mechanical Systems Engineering,
Toyama Prefectural University

Measurement and Reduction of Thermal Contact Resistance

Toshio Tomimura

Professor,
Graduate School of Science and Technology,
Kumamoto University

Development of Inorganic-resin composites with high thermal conductivity using inorganic filler handling technology

Yuji Hotta

Group Leader,
Advanced Manufacturing Research Institute, Inorganic-Based Plastics,
National Institute of Advanced Industrial Science and Technology

PAGE TOP ▲

Fri.,June 15

A Room 9:30～16:20

A.M. 9:30～　The latest trend of the LED technology for Eco-society

LED Packaging Technology NEW Trend

Tetsuya Onishi

Managing Director,
Grand Joint Technology Ltd.

LED Packaging Solution for High Performance LED

Masaru Nonomura

Manager,
LED Project 3 Team New Business Incubation Office,
Panasonic Factory Solutions Co., Ltd.

Bonding Technology For LED “Die Bonder & Wire Bonder”

Hagiwara Yoshihito

Deputy General Manager,
Engineering Planning Dept.,
SHINKAWA LTD.

P.M. 13:30～　OEL Technology to Broaden the World

Polarized electroluminescence from organic light-emitting devices

Masahiro Misaki

Specially-assigned Assistant Professor,
Graduate School of Engineering, Kobe University

Current Status and future trend of High Efficiency and High Quality OLED for Lighting Application

Takuya Komoda

Research Director,
Core Technologies Development Center,
Panasonic Corporation, Eco Solutions Company

Technical Trend of OLED Lighting

Nobuhito Miura

Manager,
OLED Business Development Project,
Kaneka Corporation

B Room 9:30～16:20

A.M. 9:30～ Practical & Profittable 3D Solutions for the Next-generation Applications

Key Technologies and trends for 2.5D/3D Packaging

Yasumitsu Orii

Manager, Senior Technoical Staff Member (STSM)
Electronic&Optical Packaging, IBM Japan,Ltd.
IBM Research - Tokyo

The latest topics of 3D packaging technology

Daisuke Ohshima

Assistant Manager,
System Jisso Research Laboratories,
NEC Corporation

The Application Technology of 3-D Circuit Substrate Process

Gentaro Masuda

Project Manager,
PALAP Project Production Eng. Dept.,
DENSO CORPORATION

P.M. 13:30～　3D Package which Realizes High Functions

Semiconductor package strategy for mobile application

Akio Katsumata

General Manager,
Packaging Research & Development Center,
J-DEVICES CORPORATION

OSAT technology to contribute semiconductor products growth

Toshihiko Nishio

Director, STATS ChipPAC Japan

New 3D-Integration Technology R&D and Prospects 2012

Morihiro Kada

R&D Consultant,
Association of Super-Advanced Electronics Technologies

Please note that the speaker(s) and Program(s) are subject to change.