A.M. 9:30～ Battery for Environment-Friendly Society
Technology Marketing Department,
Planning and Advanced Engineering Development Division,
NISSAN MOTOR CO., LTD.
School of Engineering,
The University of Tokyo
Hydrogen system Team Leader,
Technical Research Institute,
Tokyo Gas Co., Ltd.
P.M. 13:30～ Future of Japanese Electronic Industry
President Chief Business Planner,
A.M. 9:30～ Power Integrity and EMC
Dept. of Electronic Engineering,
Shibaura Institute of Technology
Design Solution Group,
ATE Service Corporation
PCB Development Group,
Aica Kogyo Co., Ltd.
P.M. 13:30～ Superior Materials Technology in the World
Manager, Research, Metal Finishing,
OKUNO CHEMICAL INDUSTRIES CO., LTD.
Technology Planning Gr., Technology Development General Div., AGC Electronics,
ASAHI GLASS CO., LTD.
Development Dept.4, R&D Div., Information Fine Materials Sector,
Nitto Denko CorporationN
A.M. 9:30～ Bio and Chemical Devices Connection to Electronics
Institute of Industrial Science,
University of Tokyo
S-BIO Business Div. Research Dept.,
SUMITOMO BAKELITE CO., LTD.
Unit Leader, Senior Researcher,
Mechanical Engineering Research Center,
Hitachi, Ltd., Hitachi Research Laboratory
P.M. 13:30～ Revival of Japanese Electronic Industry
Arthur D. Little (Japan), Inc.
A.M. 9:30～ Recent Technology Trends on Power Electronics in the EV HEV era
Lead Frame Package Engineering Department,
Packaging & Test Technology Division, Production and Technology Unit,
Renesas Electronics Corporation
Module Package Technology Sect.Packaging Technology Dept. Semiconductors Technology Div.
Matsumoto Factory Electric Devices Business Headquarters,
Fuji Electric Co., Ltd.
Department of Mechanical Engineering,
Yokohama National University
P.M. 13:30～ The heat radiation and Cooling Technology for the High-density Package
Department of Mechanical Systems Engineering,
Toyama Prefectural University
Graduate School of Science and Technology,
Advanced Manufacturing Research Institute, Inorganic-Based Plastics,
National Institute of Advanced Industrial Science and Technology
A.M. 9:30～ The latest trend of the LED technology for Eco-society
Grand Joint Technology Ltd.
LED Project 3 Team New Business Incubation Office,
Panasonic Factory Solutions Co., Ltd.
Deputy General Manager,
Engineering Planning Dept.,
P.M. 13:30～ OEL Technology to Broaden the World
Specially-assigned Assistant Professor,
Graduate School of Engineering, Kobe University
Core Technologies Development Center,
Panasonic Corporation, Eco Solutions Company
OLED Business Development Project,
A.M. 9:30～ Practical & Profittable 3D Solutions for the Next-generation Applications
Manager, Senior Technoical Staff Member (STSM)
Electronic&Optical Packaging, IBM Japan,Ltd.
IBM Research - Tokyo
System Jisso Research Laboratories,
PALAP Project Production Eng. Dept.,
P.M. 13:30～ 3D Package which Realizes High Functions
Packaging Research & Development Center,
Director, STATS ChipPAC Japan
Association of Super-Advanced Electronics Technologies
Please note that the speaker(s) and Program(s) are subject to change.