Since the exhibition in 2010, the technological ideas incorporated in JPCA’s “Vision for the Future of the Electronic Circuit Industry,” including thermal management solutions, device embedded technology, high-speed/high frequency technologies, printed electronics, which is central to large electronics, LED/OLED technology product technologies and various functional materials, have been exhibited in booths put up by various companies all over the venue.
In 2012, in an effort to increase appreciation of the above ideas among application developers both within Japan and abroad, and thereby contribute to creating an environment that will facilitate the incorporation of these technologies into devices and hardware components and actual production, we plan to zone and cluster the various exhibitions that make up the JPCA Show and the Large Electronics Show according to their functions with a view to enabling users who visit the exhibition to find solutions to their specific issues.
While retaining the core theme of conventional electronic circuit board manufacturing, or electronic circuit packaging board manufacturing technologies, we plan to reorganize the exhibition into a more user-friendly layout by zoning it along the lines of functional technology so that application designers (product designers, LSI product designers) can make comparative study with the aim of commercializing new products and find high-cost performance products that are superior to current products and allow for better differentiation as well as obtain information that will contribute to future development by matching what they are looking for with the relevant exhibitor or exhibition booth more quickly and efficiently.