Other Open Seminars
●Wednesday, June 13 to Friday, June 15, 2012
■CPCA China / KPCA Korea / TPCA Taiwan Pavilion Seminars
■NPI (New Product Introduction) Presentation/PROTEC Seminar
■JIEP Tutorials/Workshops
■Academic Plaza
■Electronics Handicraft Class
■Open Seminars in the exhibition Hall
■Workshop of Flexible Printed Wiring Board
●Date:Wed.,June 13- Fri.,June 15,2012 ●Venue:East Hall 5
Wed.,June 13
Activities for JPCA Device Embedded Electronic Circuits Board Standard Committee
JPCA-EB01:A summary of JPCA Device Embedded Substarate Scope/ReliablityTest/Design/Terminology Standard(Edition5)
10：40 ～11：20
Prof.Hajime Tomokage, Fukuoka University
－Define shipment inspection and desine guides.
Yasuhiro Uranishi
JPCA-EB02:A summary of JPCA Device Embedded Substrate Data Format Standard(Edition1)
11：20 ～12：10
－Reduce the production and inspection by data format for active and passive device embedded inside of an organic board.
Prof.Hajime Tomokage, Fukuoka University
－Using the EB02,Simulation to integrate SiP and Substrate date.
Hidemichi Kawase Executive Director, Engineering Keirex Technology Inc.
－Introduction of CAD system for Device Embedded Substrate.
Matsuoka Hiroshi Manufacturing Solution Practice 1 Chief Engineer YDC Corporation
－EB02 realize DFM/DFT solution.
Hirohiko Matsuzawa ELN Section ZUKEN Inc.
Device Embedded Circuit Board Maker Presentation
Embedded Capacitance and Resistance build-in PCB for better Signal Integrity and Power Integrity in high frequency range
13：00 ～13：40
Terada Masakazu OK PRINT CORPORATION
Technology of Device Embedded Substrate.
13：40 ～14：20
Tohru matsumoto MEIKO ELECTRONICS CO.,LTD.
The Role of Wafer Level Package in Device Embedded Substrate.
14：20 ～15：00
Takeshi Wakabayashi Teramikros, Inc.
Development Trend of B2itTM PCB with Embedded Active Devices and Passive Components.
15：00 ～16：00
Kenji Sasaoka Dai Nippon Printing.Co Ltd
Thur.,June 14
Activities for JPCA Device Embedded Electronic Circuits Board Standard Committee
JPCA-EB01:A summary of JPCA Device Embedded Substarate Scope/ReliablityTest/Design/Terminology Standard(Edition5)
10：40 ～11：20
Prof.Hajime Tomokage, Fukuoka University
－Define shipment inspection and desine guides.
Yasuhiro Uranishi
JPCA-EB02:A summary of JPCA Device Embedded Substrate Data Format Standard(Edition1)
11：20 ～12：10
－Reduce the production and inspection by data format for active and passive device embedded inside of an organic board.
Prof.Hajime Tomokage, Fukuoka University
－Using the EB02,Simulation to integrate SiP and Substrate date.
Hidemichi Kawase Executive Director, Engineering Keirex Technology Inc.
－Introduction of CAD system for Device Embedded Substrate.
Matsuoka Hiroshi Manufacturing Solution Practice 1 Chief Engineer YDC Corporation
－EB02 realize DFM/DFT solution.
Hirohiko Matsuzawa ELN Section ZUKEN Inc.
Trends and issues in Device Embedded Substrate/Expectations of material and material from packaging technology roadmap
Challenge to adopt technology equipment from the set of built-in components.
13：00 ～13：40
Hiroshi Manita CASIO COMPUTER CO., LTD.
Technology Issues and expectations from the semiconductor package.
13：40 ～14：20
Yoshiaki Sugizaki, TOSHIBA CORPORATION
Technology Issues and expectations from the component technology.
14：20 ～15：00
kajita Murata Manufacturing Co., Ltd.
Technology issues and suggestions from PWB, overseas trends.
15：00 ～16：00
Utsunomiya Henry Interconnection Technologies,Inc.
Fri.,June 15
Activities for JPCA Device Embedded Electronic Circuits Board Standard Committee
JPCA-EB01:A summary of JPCA Device Embedded Substarate Scope/ReliablityTest/Design/Terminology Standard(Edition5)'
10：40 ～11：20
－Define shipment inspection and desine guides.
Prof.Hajime Tomokage, Fukuoka University
/Yasuhiro Uranishi
JPCA-EB02:A summary of JPCA Device Embedded Substrate Data Format Standard(Edition1)
11：20 ～12：10
－Reduce the production and inspection by data format for active and passive device embedded inside of an organic board.
Prof.Hajime Tomokage, Fukuoka University
－Using the EB02,Simulation to integrate SiP and Substrate date.
Hidemichi Kawase Executive Director, Engineering Keirex Technology Inc.
－Introduction of CAD system for Device Embedded Substrate.
Matsuoka Hiroshi Manufacturing Solution Practice 1 Chief Engineer YDC Corporation
－EB02 realize DFM/DFT solution.
Hirohiko Matsuzawa ELN Section ZUKEN Inc.
Device Embedded Circuit Board Maker Presentation
The 3D multi-simulation platform STEERSIP for SiP and Device Embeddes Substrate design.
13：00 ～13：40
Hidemichi Kawase Executive Director, Engineering Keirex Technology Inc.
Introduction of CAD system for Device Embedded Substrate "αⅢ-Design Device Embedded Substrate Package".
13：40 ～14：20
Matsuoka Hiroshi Manufacturing Solution Practice 1 Chief Engineer YDC Corporation
CR-8000 strongly supports from designing to testing with Device Embedded Substrate.
14：20 ～15：00
Hirohiko Matsuzawa ELN Section ZUKEN Inc.
Testing Device Embedded Substrates interconnecting with CAD Tools.
15：00 ～16：00
Hiroshi YAMAZAKI HIOKI E.E. CORPORATION
■JPCA Optoelectronics Assembly Technology Standardization Seminar
