The world’s top-level “global circuit convention” specializing in total “monotsukuri”(industrial production) solutions to make the latest equipment a reality
Growing out of the “To Realize the Dream – Next-Generation Application Development Support Seminar” commenced in 2011, we are setting up a new, specialist total design solutions exhibition which brings together hardware and software, development support tools, and subcontracted development services in each block of “wireless and high frequency”, “power source and management”, “device control circuits”,and “image processing and display circuits” that configure all kinds of equipment.
◆Cosponsored by: Japan Electronics Packaging and Circuits Association (JPCA) and The Semiconductor Industry News (Sangyo Times Inc.)
Main Products and Technologies to be Exhibited
Held in conjunction with:The 18th Semiconductor of the Year Awards and the Electronics Products Analysing “BUNKAI” Special Exhibit
Amid rising expectations of printed electronics (PE)-ready products, including next-generation lighting, displays, organic solar cells, antennas, RFID tags, memories, sensor modules, and printed electronic substrates, commercialization process technology is also becoming established. PE PROCESS 2012 in conjunction with the 1st PEC Japan will offer solutions as an exhibition of specialist technology aimed at experts who are investigating the optimum production line structures from design through to commercialization.
In conjunction with the 1st Printed Electronics Convention (PEC Japan), where experts in the field will give detailed presentations on process, device, materials, and applications trends in printed electronics, which is the focus of global expectations, we are now setting up a closed specialist exhibit. This is aimed at experts who are serious about pushing the limits in the investigation of production and commercial application of printed electronics.
We are setting up an exhibition focused on optimum production systems for printed electronics (PE)
Applications to exhibit at PE PROCESS 2012 now open!!
Experts in the field will provide detailed information on the latest technological developments and application trends in printed electronics, which is in the global spotlight
We are planning presentations on the outlook for technology and industry and panel discussions featuring key personnel from industry-leading top corporations and next-generation companies
Sponsored by the Japan Institute of Electronics Packaging (JIEP), this is an in-depth packaging technology symposium with interaction between audience and presenters.
※Free invitations will be distributed to exhibitors in a perfect opportunity to attract attendance
At the Academic Plaza Program, which is sponsored by Japan Institute of Electronics Packaging (JIEP), university research laboratories and public research institutes will set up booths and present their latest research results to the industrial world and visitors to provide opportunities for academic-industrial alliances for new technological development and business partnerships.