6.13 Wed - 6.15 Fri At Tokyo Big Sight 10:00 - 17:00 JPCA Show 2012 Large Electronics Show 2012 2012 Microelectronics Show JISSO PROTEC 2012 Monotsukuri Fiesta 2012 夢をカタチに

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Global Circuit Convention

The world’s top-level “global circuit convention” specializing in total “monotsukuri”(industrial production) solutions to make the latest equipment a reality

Monotsukuri Fiesta 2012 夢をカタチに PE PROCESS 2012 The 1st PEC JAPAN 2012 Keynote Presentations Special Exhibition Symposium Academic Plaza Program The exhibition offers visitors a number of diverse jointly sponsored programs in which they may participate.

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An exhibition of design solutions integrating the software and hardware essential for the development of all kinds of equipment
Monotsukuri Fiesta 2012
Applications to exhibit now open for Next-Generation
Applications Development Support Exhibition!!
夢をカタチに 次世代アプリ開発支援技術展

Growing out of the “To Realize the Dream – Next-Generation Application Development Support Seminar” commenced in 2011, we are setting up a new, specialist total design solutions exhibition which brings together hardware and software, development support tools, and subcontracted development services in each block of “wireless and high frequency”, “power source and management”, “device control circuits”,and “image processing and display circuits” that configure all kinds of equipment.
◆Cosponsored by: Japan Electronics Packaging and Circuits Association (JPCA) and The Semiconductor Industry News (Sangyo Times Inc.)　

Main Products and Technologies to be Exhibited

▼Hardware
（All kinds of control units, devices, memories, IP cores, FPGA, analog ICs, etc.）
▼Software
（operting systems, device drivers, middleware, data bases, security-related software useability-related software, etc.）
▼Related support tools
（Language-related, debugging tools, measurement tools, verification tools, function and architecture design tools, various management tools, etc.)
▼Subcontracted development services
（Design centers, design services, consulting, testing and production subcontracting, IP distribution services）

Held in conjunction with:The 18th Semiconductor of the Year Awards and the Electronics Products Analysing “BUNKAI” Special Exhibit

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2PE Process Exhibition 2012 PE PROCESS 2012

Amid rising expectations of printed electronics (PE)-ready products, including next-generation lighting, displays, organic solar cells, antennas, RFID tags, memories, sensor modules, and printed electronic substrates, commercialization process technology is also becoming established. PE PROCESS 2012 in conjunction with the 1st PEC Japan will offer solutions as an exhibition of specialist technology aimed at experts who are investigating the optimum production line structures from design through to commercialization.

In conjunction with the 1st Printed Electronics Convention (PEC Japan), where experts in the field will give detailed presentations on process, device, materials, and applications trends in printed electronics, which is the focus of global expectations, we are now setting up a closed specialist exhibit. This is aimed at experts who are serious about pushing the limits in the investigation of production and commercial application of printed electronics.

We are setting up an exhibition focused on optimum production systems for printed electronics (PE)

Applications to exhibit at PE PROCESS 2012 now open!!

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3The 1st PEC JAPAN 2012 （PEC JAPAN 2012）NEW

Experts in the field will provide detailed information on the latest technological developments and application trends in printed electronics, which is in the global spotlight

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4Keynote Presentations

We are planning presentations on the outlook for technology and industry and panel discussions featuring key personnel from industry-leading top corporations and next-generation companies

5Advanced Electronics Packaging (Jisso) Symposium

Sponsored by the Japan Institute of Electronics Packaging (JIEP), this is an in-depth packaging technology symposium with interaction between audience and presenters.
※Free invitations will be distributed to exhibitors in a perfect opportunity to attract attendance

6Academic Plaza Program

At the Academic Plaza Program, which is sponsored by Japan Institute of Electronics Packaging (JIEP), university research laboratories and public research institutes will set up booths and present their latest research results to the industrial world and visitors to provide opportunities for academic-industrial alliances for new technological development and business partnerships.

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7The exhibition offers visitors a number of diverse jointly sponsored programs in which they may participate.

■Special Exhibits/Open Seminars
The Open Seminar Program always has a lively audience with basic training courses on electronic circuit production including a printed board training seminar and environment seminar. We provide an environment that fills the needs of a whole range of visitors from new employees through to industry trend watchers.
■Electronics Products Analysing “BUNKAI” Seminar
The Electronics Products Analysing “BUNKAI” Seminar is always full of visitors
■Exhibitor Seminars on Products and Technologies
(NPI Presentation Program/PROTEC Seminar Program)
Exhibitors will offer information and communication seminars to visitors free of charge.
■World Electronic Circuits Council (WECC) Exhibition
Electronic circuit industry groups from China, Korea, Taiwan, Hong Kong, India, and other Asian countries and regions, and from Europe and the United States, will come together in one place. Visitors can see the overall trends in the electronic circuit industry while in Japan.

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