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Exhibition will change in 2010.
Overview of the Implementation
Understanding equipment trends and making proposals for the future
To Enhance the Effect of Your Exhibition
To Enrich the Effect of the Exhibition
Target products and technologies of JPCA Show 2010
Target products and technologies of 2010 Microelectronics Show
Target products and technologies of JISSO PROTEC 2010
Target products and technologies of Large Electronics Show 2010
Features of Exhibits
Timetable toward the show
Exhibition layout
Search of Exhibitors
Exhibitors Update Information
Floor Map Hall 2,3
Floor Map Hall 4,5,6
Monotsukuri Fiesta 2010
Keynote Address
Advanced packaging technology symposium
Exhibitor seminars on products and technologies
Various seminars in the exhibition hall
Academic Plaza
Special exhibitions and open seminars
JIEP Tutorials/Workshops
Electronics Handicraft Class
World Electronic Circuits Council (WECC) Group exhibition
Exhibitor's List of 2004
Exhibitor's List of 2005
Exhibitor's List of 2006
Exhibitor's List of 2007
Exhibitor's List of 2008
Exhibitor's List of 2009
Press Release
Access to Tokyo Big Sight
Download of official logo
Information of HOTEL
Result report of 2004
Result report of 2005
Result report of 2006
Result report of 2007
Result report of 2008
Result report of 2009
Search of exhibitors
Exhibitors Update Information
HOME
Exhibitor's LIST
(in Alphabetical order)
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
search of exhibitor
JPCA Show 2010 PWB Technology Expo Products Category
JPCA Show 2010 IC Packaging Expo
JPCA Show 2010 Device Embeddend Expo
Large Electronics Show 2010 Printed Electronics Show
Large Electronics Show 2010 Device Manufacturing Process Technologies Expo
Large Electronics Show 2010 LED Lighting Process Zone
2010 Microelectronics Show
JISSO PROTEC 2010
Monotsukuri Fiesta 2010
Academic Plaza
search of
each Main
Handling
Products
Please select the product
P001 PWB:Target Products
P002 PWB:Target Design Technologies
P003 PWB:Target Reliability and Inspection Technologies
P004 PWB:Main Materials
P005 PWB:Target Processing Technologies
P006 PWB:Target Manufacturing Equipment
P007 PWB:Target Environmental Systems
P008 PWB:Target Distribution Systems
Please select the product
IC001 IC-P: Target Products
IC002 IC-P: Target Design Technologies
IC003 IC-P: Target Reliability and Inspection Technologies
IC004 IC-P: Main Materials
IC005 IC-P: Target Processing Technologies, Materials, and Equipmentn
IC006 IC-P: Target Manufacturing Equipment
IC007 IC-P: Target Environmental Systems
IC008 IC-P: Target Distribution Sysmtems
Please select the product
DE001 DE: Target Products
DE002 DE: Target Design Technologies
DE003 DE: Target Rliability and Inspection Technologies
DE004 DE: Main Materials
DE005 DE: Target Processing Technologies, Materials, and Equipment
DE006 DE: Target Manufacturing Equipment
DE007 DE: Target Environmental Systems
DE008 DE: Target Distribution Systems
Please select the product
PE001 PE:Application of Printed Electronics
PE002 PE:Design Technologies
PE003 PE:Realiability and Inspection Technologies
PE004 PE:Main Printed Electronics Materials
PE005 PE:Process Materials
PE007 PE:Manufacturing Equipment
Please select the product
DM001 DMP:Parts, MEMS, and Devices
DM002 DMP:Design Technologies
DM003 DMP:Parts, MEMS, and Device Materials
DM004 DMP:Main Printed Electronics Materials
DM005 DMP:Process Materials
DM006 DMP:Manufacturing Equipment
Please select the product
LE001 LED Lighting Process Products
Please select the product
M001
M002
M003
M004
M005
M006
M007
M008
M009
M010
M011
M012
M013
M014
M015
Please select the product
J001 Products with High-density/High-frequency Electronics Packaging Technologies
J002 High-density Substrates/Interposers/LSI Packages (incl. SiP)
J003 Electronic Components
J004 Embedded Packaging Board
J005 Wafer Process (incl. Process Equipment and Materials)
J006 Display Device/Optical Device
J007 Thick Film and Thin Film Materials (incl. Paste Materials)
J008 MaterialsrelatedtoElectronicsPackaging(Incl.Solders/Lead-freeSolder/AnisotropicConductive/etc.)
J009 High Frequency Equipment/Parts/Materials
J010 Environmental Friendly Equipments/Materials for Electronics Packaging Process
J011 Electronics Assembly/Mounting Equipment
J012 Cream Solder Printing Equipment
J013 Soldering Equipment
J014 Dispensers
J015 Transporting Systems
J016 Taping Machines/Materials
J017 Bulk Feeders
J018 Automatic Assembly Equipment
J019 Other Feeders
J020 Device Padding Materials(Taping Reel/Carrier Tape/TAB Tape and Reel/Magazine Stick)
J021 AOI System for Electronics Assembly and Electronics Packaging(JISSO) Process
J022 Other Equipment and System for Electronics Assembly Technologies
Please select the product
MF001 Electronic Circuit Board for LED Lightings/Electronics Circuit Jisso Products
MF002 LED／OLED, Lighting devices,Lighting Module/Unit Products]
