The 6th JPCA Show Award
JPCA Show Category
- Photosensitive solder resist film for next generation semiconductor package
- Hitachi Chemical Co.,Ltd.
Toshimasa Nagoshi - "High Performance and Environmental Compatibility" High Frequency Properties of Liquid Crystal Polymer Film "BIAC" and Its Board Applications
- JAPAN GORE-TEX INC.
Sunao Fukutake - Electroless Ni/Au Plating Process adapted for flexible board
- OKUNO CHEMICAL INDUSTRIES CO.,LTD
Hiroaki Suzuki - The thermal conductivity for Printed Circuit Board and the Introduction of High Thermal Conductive Glass Composit Copper Clad Laminates "ECOOL Series".
- Panasonic Electric Works Yokkaichi Co.,Ltd.
Takayuki Suzue - Sintering-free Electro-conductive Pattern Formation Technology with Silver Nano-Particle Inks.
- MITSUBISHI PAPER MILLS LTD, IMAGING&DEVELOPMENT COMPANY
KYOTO R&D LABORATORY
Shigeki Shino - Half-etching technology using an alkaline etchant.
- MELTEX INC.
Hiroyuki Kumagai
Large Electronics Show Category
- Organic Pattern Inspection System
- Toray Engineering Co., Ltd.
Masaki Mori
Microelectronics Show Category
- Halogen-free Solder Paste SN100C P602 D4
- NIHON SUPERIOR CO., LTD.
Mitsuhiro Kawahara
