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Specialized exhibitio n of packaging technologies
Products based on high-density or high-frequency packaging technologies, high-density substrates and interposers,
component contained boards, semiconductor chips, systems in package (SiP), systems on chip (SoC), indication/optical
devices and sensors, materials related to high-density packaging, pastes, lead-free solder and junction materials,
sealing resins, adhesives, and underfill materials, anti-heat materials, high frequency ready polymer, systems and
devices related to high-density packaging such as bonders (e.g. wire bonders, die bonders, and LCD/COG bonders),
dispensers, flip chip (FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB systems,
production facilities, and books related to the most advanced future technologies.
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Photographs provided by:
Fuji Machine MFG Co., Ltd.
- Specialized exhibition of production
and packaging process technologiesElectronic component installed machines and related equipment and systems (electronic component placement machines,electronic component insertion machines, cream solder printers, soldering devices (dipping bath, reflow oven), dispensers),packaging related equipment and systems (transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines), semiconductor packaging machines and systems (wire bonders, die bonders, flip chip packaging
systems, LCD/COG bonding systems, BGA/ILB systems, and COB systems), inspection/test devices (board appearance inspection devices, inspection/measuring devices associated with semiconductor manufacturing, and inspection/measuring devices associated with other packaging), packaging design systems (design tools, production optimizing software, and packaging programming devices), packaging devices/components and related materials (SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, bulk supplies), packaging device packaging materials (taping reels, carrier tape, TAB tape/reel,magazine sticks, IC trays, and bulk cases), packaging junction systems (soldering devices, solder/junction materials, and underfill materials), high frequencies ready devices, components, and materials, environment related devices and materials (devices and materials associated with zero mission process and waste treatment/recovery), and related books in every field
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