- Large electronics is a technology to cover large areas with patterns and/or elements using various techniques. Application examples include solar power generation panels, power transportation sheets, and large displays,which are expected to make a large contribution to the realization of lowcost mass production of environmentally friendly products and energysaving products. Printed electronics is one example of large electronics.
- Printed electronics substrate (rigid and flexible), display products (organic TFT,organic/inorganic EL, LCD, electronic papers, wearable displays,3D displays,POP displays, etc.),next-generation lighting,AC EL lighting,light control film,electrophoresis,chemical compound solar cells,die sensitization solar cells,organic film solar cells,fuel cells,capacitors,flexible speakers,flexible actuators,
antenna modules,RFID,printed memory,printed tags,smart labels,organic devices,light circuit/light communication devices,electromagnetic wave shielding film,ceramic capacitors,thin-film transistors,organic transistors,sensor modules,etc.
- Conductive materials, semiconductor materials, dielectric materials, insulating materials, metal nanoparticles, oxide semiconductors, flexible sheets, etc.
- Conductive ink,insulating ink,ink-jet ink,metal colloid,organic EL,color filters,orientation panels,encapsulation materials, barrier materials,transparent conductive film,functional film,light-curing materials,photoelectric conversion materials, photocatalysts,polymer semiconductor materials,etc.
- Various design simulations,molecular design software,design tools,analysis tools,ultra-high-precision measurement machine design tools,etc
- Surface defect inspection device,layer thickness measurement devices,film defect inspection device,contact angle measurement device,various electronic microscopes,transmittance measurement device,uneven layer thickness analysis device,organic EL brightness assessment system,phase difference measurement device,polarization measurement device,brightness measurement device,chromaticity
measurement device,retardation measurement device,spectroscopic ellipsometer,spectral interference layer thickness measurement device, etc
- Ink-jet printing devices,nano-imprint devices,micro contact printing,dispenser,laser abrasion,laser transcription,gravure printing (including gravure offset printing),screen printing (including rotary screen printing),chemical conversion and burning device, (ultraviolet ray, electron beam, far-infrared ray),heat laminate device,surface processing device,flexographic printing,transfer printing,Roll to Roll pattern forming,photo lithography,fine pattern exposure device,etc.
- MOS logic/micro/memory semiconductors,digital bipolar semiconductors,system LSI,analog IC,photo IC,power IC,discrete semiconductor or other semiconductors,memory devices,passive devices(resistors, capacitors,transformers,coils,inductors,oscillatory parts,filters),
noise prevention devices,connection parts(connectors switches,relays),conversion parts(acoustic parts,magnetic heads,ultra-small motors,sensors),functional parts,photo MEMS(mirrors,switches,scanners,etc.),RF_MEMS(switches, oscillatory devices,filters,etc.),sensor MEMS(acceleration,angular velocity,pressure,gas,temperature,etc.),fluid MEMS(micro flow channels,micro reactors,etc.),actuator MEMS(valves,pumps,etc.), power MEMS (fuel cells,compact generators),bio/chemical MEMS(DNA/RNA chips,chemical substance inspection,etc.),integrated MEMS(CMOS/LSI integrated devices,etc.)
- Semiconductor silicon,chemical compound semiconductor materials,organic semiconductor materials,magnetic materials (ferrite), dielectric materials,electronic parts materials,electronic parts metal materials,permanent magnets,bond magnets,piezoelectric ceramics,quartz materials,non-lead piezoelectric materials,liquid phase method materials,electrode materials,piezoelectric film (ZnO, AIN, PZT),sapphire,polymers,LTCC substrates,glass substrates,Si,etc.
- Film-forming and wiring materials,film-forming materials for CVD and ALD,CVD materials and gasses,ion injection gas,photo masks, liquid immersion lithography materials,photo resist materials,etching fluid and gas,CMP polishing materials,various detergents,various synthetic materials,various additives,surface-active agents,various solvents,tape or pasting materials,adhesives,protection materials, nanotubes,film materials for MEMS(e.g. getter materials),polymer materials such as dendrimer, polymer materials,sterile clothes/gloves/masks/shoes/caps,clean rollers/wipers/various rolls/brushes,static charge free products,dust-free products,clean
room/clean bench/isolators,films/mats/sheets,particle counters,air conditioners,filters,other cleaning-related tools,etc.
- Hardware design solutions (system LSI,ASIC/ASSP,MPU/DSP,FPGA/PLD devices,EDA),function design,logic design,layout design,structure design,signal integrity design support tools,power integrity design support tools,electromagnetic field analysis tools (for EMC/EMI),
electrical,mechanical,and thermal property simulators,CAE support equipment such as CAD,CAM,and CIM,etc.
- Inspection consignment services,burn-in device,logic test equipment,memory test equipment,linear test system, various inspection devices,various test devices,waveform measurement devices,transmission characteristic instruments,wireless communication measurement
devices,semiconductor/IC measurement devices,industrial measurement devices,evaluation/analysis systems,inspection jigs,etc.
- Wafer processing equipment,single crystal production device,exposure/depiction device,resist processing equipment,etching equipment,dry etching device,heat processing device,thin film forming device(CVD devices,sputtering devices,etc.),ion injection device, CMP equipment,cleaning-drying equipment,various transportation system and equipment,pure water/chemical liquid/water processing equipment,various gas device,dicing equipment,micro/nano dies,nano imprint device,ion beam processing equipment,micro radiation
processing equipment,sheet forming equipment,extrusion/casting/injection molding machine, pressurized forming equipment,laser micro processing equipment,thin film coating equipment,drying furnaces,burning/sintering equipment,microwave heating equipment,dissolution process equipment,fracturing process equipment,ultrasound processing equipment,wafer bonding equipment (aligner),deep etching equipment (for MEMS),clean room equipment,etc.
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