- Exhibition will change in 2010.
- Overview of the Implementation
- Understanding equipment trends and making proposals for the future
- To Enhance the Effect of Your Exhibition
- To Enrich the Effect of the Exhibition
- Target products and technologies of 2010 Microelectronics Show
 PWB Technology Expo 2010 |
IC Packaging Expo 2010 |
Device Embedded Expo 2010 |
| Target products | ||
| Single-sided, double-sided, and multi-layered rigid printed wiring boards, flexible printe d -wiring boards, buildup -wiring boards,flex-rigid printed wiring boards,ceramic printed wiring boards,metal (copp er, aluminum, etc.)based printed wiring boards, other printed wiring boards, and related books | Rigid substrate, build-up substrate,tape substrate, COF/TAB, ceramic substrate, lead frame, wafer-level package, two-dimensional package(SiP), three-dimension packages,silicon interposer, glass interposer,MEMS interposer (with rewiring layer), functional layer interposer,and related books | Rigidactivedeviceembedded substrate,flexible active device embedded substrate, rigid passive deviceembeddedsubstrate,flexible passive device embedded substrate, module device embedded substrate, IPD device embedd edsubstrate,MEMS-device embedded substrate, LTCC,and related books |
| Target design technologies (for all exhibitions) | ||
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Functional design (circuit design for functional requests) technology,logical design (circuit diagram design) technology, parts layout design/parts tables, pattern design,layout design, structure design,various design support tools (for the above listed technologies),signal integrit y design support tools,powerintegritydesign support tools, electromagnetic field analysis (measure for EMC/EMI/SI),electrical, mechanical, and thermal property simulators, CAE devices such as CAD, CAM, and CIM
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| Target reliability and inspection technologies (for all exhibitions) | ||
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Inspectionandasssessment contract services,various inspection devices,various test devices,evaluation/analysis systems, inspectionjigs
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| Main materials | ||
| Rigid copper clad laminate (CCL), flexiblecoppercladlaminate(FCCL),shield boards,multi-layer PWB prepreg,copperfoilwith adhesive, ceramic board materials,copper/aluminum board materials,special board materials,various insulating materials,solder mask materials | Core multi-layered PWBs,organic packagesubstratematerials,various alloys (Fe-Ni, Cu),polyimide film/tape,ceramic board materials, siliconwafers,glass blanks,organic/inorganic rewiring layer materials,metal plates/radiator plates,metal stiffener plates,semiconductor insulating layer materials,optical wave guide materials,solder mask materials | Bare dies, WLCSP/WLP, BGA (CSP),LGA,QFN,chip parts,complex chip parts,IPD,various modules,MEMS,organic board (insulating) materials,inorganic board (insulating) materia ls , copperfoilcarriers,metal plates radiatorplates,metal stiffener plates,film carriers,silicon wafers, glass blanks, ceramic interposers,semiconductor insulating layer materials, optical wave guide materials, solder mask materials |
| Target processing technologies, materials, and equipment | ||
Plating, mold casting, hole drilling,plate making,plating chemicals,surface processing chemicals,etching chemicals,various inks, pastes,various tools,dry film resist |
For IC Packaging Expo and Device Embedded Expo Plating,mold casting,hole drilling,late making,plating chemicals,surface processing chemicals,etching chemicals,various inks, pastes,various tools,dry film resist,die bonding materials,bonding wire,solder balls,bump materials,metal barrier materials,sealing resin,underfill,coating materials,various adhesives agents,conductive/nonconductive film,conductive/nonconductive paste,metal masks |
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| Target manufacturing equipment | ||
| Chemical processing device,photolithography exposure equipment,machining equipment,transportation equipment,coating equip -ment, polishing device, plasma processingequipment,laser processing device,printing equipment |
For IC Packaging Expo and Device Embedded Expo
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| Target environmental systems (for all exhibitions) | ||
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Water pollution control system, waste material and liquid processing,globalwarming prevention system, air pollutioncon trol system,land contamin ationprevention system, noise control system
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| Target distribution systems (for all exhibitions) | ||
| Transportation, packagingandpacking equipment,embossed carriers,trays,tubes,internal and external boxes,logistics system,transportation system,trade control system,procurement and commissioned production,orderingsystem,inventorycont rol,traceability control,warehousecontrolsystem,IT solutions | ||
