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• Before holding the three exhibitions
• Overview of the Implementation
• Electronic Circuit Industry Keeps Growing

• For the Next Generation
• To Enhance the Effect of Your Exhibition
• To Enrich the Effect of the Exhibition

• Special Exhibition Section
• Features of Exhibits
• Timetable toward the show
• HOME

Scope of Exhibits

Target products and technologies

Electronic circuit boards including rigid printed-wiring boards and buildup-wiring boards, flexible printed-wiring boards, flex rigid printed-wiring boards, ceramic printed-wiring boards, metal-core printed-wiring boards, component contained boards, rigid module boards, TAB/COF boards, and ceramic module boards; electronic circuit mounting boards, including printed-wiring mounting boards (such as insertion part mounting boards and chip part mounting boards), module mounting boards (such as IC package mounting boards and wire bonding mounting boards, TAB/COF mounting boards, and flip-chip mounting boards); working specializing in electronic circuits; products based on electronic circuit boards (such as flat-panel display modules, drive modules, vehicle-mounted modules, and medical device modules); rigid electronic circuit board materials, flexible electronic circuit board materials, base materials for electronic circuits, and related books.

Exhibition Layout

Packing many electronic circuit products, Electronic Circuits EXPO 2009 will provide an electronic circuit area consisting of a Rigid PWB (printed-wiring board) zone, a FPC (flexible printed-wiring board zone, a Module Board zone, and Electronic Circuit Mounting Board (products based on electronic circuit boards) zones and a Board Material area for flexible electronic circuit board base materials. This arrangement provides an exhibition layout that is friendly and attractive to visitors—electronic circuit buyers; you are encouraged to exhibit electronic components and device technologies/products that compose modules.

Target products and technologies

Devices for manufacturing and working on rigid printed-wiring boards, materials (e.g. inks and films) for rigid printed-wiring boards, devices and materials for surface treating printed-wiring boards, plating technologies, materials, machines, and devices required by technologies for manufacturing working on TAB, COF, and film printed-wiring boards, auto cutters and punches, special metal and machining technologies, plants in general and environmental facilities (e.g. clean rooms, wastewater treatment systems, and devices associated with recycling of resources), and related books.

Exhibition Layout

Gathering a lot of manufacturers of materials, equipment, and devices which play an important role in manufacturing of electronic circuit boards under one roof, Electronic Circuits Process EXPO 2009 will have a separate section for each of the manufacturing areas of electronic circuit boards (machining, circuit formation, surface treatment, process materials (e.g. ink and film)), providing a layout friendly to the visitors. In addition, the machining section will have an attractive Laser Lithography zone. The Surface Treatment section will include a Plating Process zone that will be packing and highlighting devices and technologies associated with plating processes; you are encouraged to exhibit plating technologies for semiconductors, devices, parts, lead frames, and products in the automotive and other industries as well as electronic circuit boards.

Target products and technologies

Application software, electronic circuit designs, system consultations and services, EMS and ODM, system solutions associated with communications networks, Internet, and multimedia, CAE devices such as CAD, CAM, and CIM, product design technologies, cabinet designs, model prototypes, molds, RP-aided (rapid prototyping aided) devices and systems, and related books.

Exhibition Layout

DES Expo 2009 will provide an RP System section to gather and highlight devices and technologies associated with RP (rapid prototyping) systems and tools, including optical modeling systems, 3-D high-speed model simulators, which respond to how the time from product development initiation to shipment can be shortened and how the cost reduction can be maximized to quickly deliver high-quality products that meet consumer needs at low prices as a field and technology attracting attention and interest from visitors. Because it is separate as an attractive section, you are encouraged to exhibit your RP technology in the automobile, biological/medical, security, education, entertainment, and service segments and other areas where electronic control is essential in addition to consumer and industrial electronic equipment designs.

Target products and technologies

Appearance test devices, X-ray inspection devices, evaluation testers, testers, components for devices, 3-D/2-D measuring instruments, measuring apparatuses, analyzers, analysis/assessment contract services, image processors, image measuring apparatuses, devices and technologies associated with virtual reality, and related books.

Exhibition Layout

Micro TEST 2009 will provide an Image Sensing section to pack and highlight testing devices and equipment and technologies associated with image processing essential to assessment/analysis devices as an area and technology that attract attention and interest from visitors. It is a separate and attractive section; you are encouraged to exhibit image process systems and equipment in the space/earth, biological/medical, transportation, security, education, entertainment, and service segments and other areas, image sensors, and equipment for compressing/decompressing and transmitting images as well as industrial image processing systems and equipment for working, assembly, inspection, and control.

Target products and technologies

Products based on high-density or high-frequency packaging technologies, high-density substrates and interposers, component contained boards, semiconductor chips, systems in package (SiP), systems on chip (SOC), indication/optical devices and sensors, materials related to high-density packaging, pastes, lead-free solder and junction materials, sealing resins, adhesives, and underfill materials, anti-heat materials, high frequency ready polymer, systems and devices related to high-density packaging such as bonders (e.g. wire bonders, die bonders, and LCD/COG bonders), dispensers, flip chip (FC) packaging, BGA/CSP assembly, TAB packaging, OLB/ILB systems, and COB systems, production facilities, and related books.

Exhibition Layout

As exhibition areas, the show will provide a Dispenser/
Bonding section for precision packaging technologies and a Solder section for and lead-free solder along with a Thermal Management section centering on measures for the heat generated by downsized and speed-enhanced electronic devices as a dense exhibition area that will pack many target products and technologies under one roof.

Target products and technologies

Electronic component installed machines and related equipment and systems (electronic component placement machines, electronic component insertion machines, cream solder printers, soldering devices (dipping bath, reflow oven), dispensers), packaging related equipment and systems (transfer systems, taping machines and materials, bulk feeders and other feeders, and automatic assembly machines), semiconductor packaging machines and systems (wire bonders, die bonders, flip chip packaging systems, LCD/COG bonding systems, BGA/CSP assembly systems, TAB packaging systems, OLB/ILB systems, and COB systems), inspection/test devices (board appearance inspection devices, inspection/measuring devices associated with semiconductor manufacturing, and inspection/measuring devices associated with other packaging), packaging design systems (design tools, production optimizing software, and packaging programming devices), packaging devices/components and related materials (SMD, semiconductor package parts, small electronic parts, chip parts, connectors, sockets, switches, bulk supplies), packaging device packaging materials (taping reels, carrier tape, TAB tape/reel, magazine sticks, IC trays, and bulk cases), packaging junction systems (soldering devices, solder/junction materials, and underfill materials), high frequencies ready devices, components, and materials, environment related devices and materials (devices and materials associated with zero mission process and waste treatment/recovery), and related books.

Exhibition Layout

JISSO PROTEC 2009　– 11th Jisso Process Technology Exhibition will use an exhibition layout that allows visitors to easily view an overview of the packaging process along with related products, latest devices, and technical information as well as electronic component packaging machines.

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