- Japan Electronics Packaging and Circuits Association
Chairman
Shuji Ando
- Japan Institute of Electronics Packaging
Chairman
Hiroshi Tsukada
- Japan Robot Association
Chairman
Hiroshi Tsukada
- Exhibitions Organizing
Steering Committee
Chairman
Yuichiro Naya
Steered by the Japan Electronics Packaging and Circuits Association, JPCA Show 2009-The 39th International Electronic Circuits Exhibition sponsored by Japan Electronics Packaging and Circuits Association, 2009Microelectronics Show-The 23rd Advanced Electronics Packaging Exhibition sponsored by Japan Institute of Electronics Packaging, and JISSO PROTEC 2009-The 11th Jisso Process Technology Exhibition sponsored by Japan Robot Association will take place for three days from Wednesday, June 3, to Friday, June 5, 2009, at Tokyo Big Sight under the theme “INNOVATION FOR THE NEXT DREAM .”
We would like to extend a deep gratitude to the members and exhibitors for their warm support and cooperation.
Over the long histories of these shows, technological development and upsurges of new markets have changed the industrial structure, creating a new framework on the structure.
Under the circumstances, we are committed to preparing for the exhibitions that present many designs, materials, process materials, manufacturing equipment, packaging equipment, and test/inspection technologies associated with electronic circuit boards, component integration, and module packaging. In addition, we provide an opportunity to communicate the spirit of shop-floor production developed by Japan with consideration for the global environment for the future, as technology Japan can be proud of, to global users.
We sincerely would like you to understand the aim of JPCA Show 2009/2009Microelectronics Show/JISSO PROTEC 2009and actively participate.
