- Period ：Wednesday, June 3 - Friday, June 5, 2009
- Place ： TOKYO BIG SIGHT, East Hall 1 Room A
- 6月3日(水)
- Admission free
| 3-1 | Advanced packaging technology for next generation semiconductor
Kazushige Toriyama,IBM Japan, Ltd. |
| 11:00 ～ 12:00 |
The advanced packaging technologies such as a new pre-soldering on substrate are introduced to realize the finer pitch and higher performance devices assembly in this session.
TEL: 075-223-8872 / FAX: 075-252-3203 / E-mail: ktori@jp.ibm.com |
| 3-2 | High density atmospheric pressure plasma machine introduction and viewing
Naofumi Yoshida,FUJI Machine Mfg. Co., Ltd. |
| 12:30 ～ 13:30 |
We will introduce the application and performance of the high density atmospheric pressure plasma processing machine which has been newly developed by Fuji.
URL for acceptance of auditing http://www.fuji.co.jp/ |
| 3-3 | |
| 14:00 ～ 15:00 |
This seminar has been cancelled |
| 3-4 | The printing technology of HITACHI SCREEN PRINTER
Noriaki Mukai,Hitachi Plant Technologies,Ltd. |
| 15:30 ～ 16:30 |
Due to the market demand for communication and mobile products,
micro-components have been used a lot for such SMT process. We will
introduce our printing process to meet such demands.
TEL: 03-3516-7931 / FAX: 03-3516-7933 / E-mail: yuji.ono.tz@hitachi-pt.com |
- 6月4日(木)
- Admission free
| 4-1 | Implementation! Latest high-volume production techniques for 01005(0402) part placement
Tomohiko Hattori,FUJI Machine Mfg. Co., Ltd. |
| 11:00 ～ 12:00 |
We will introduce numerous implementation examples for 0402 part placement, a technology which is now being used to produce mobile musical instruments. This technology is a necessity for solder printing, part pickup stability, low impact placement, maintenance of nozzles that support extremely small parts and high-volume production.
URL for acceptance of auditing http://www.fuji.co.jp/ |
| 4-2 | Changing shopfloor
Seiichi Serizawa,JUKI CORPORATION |
| 12:30 ～ 13:30 |
We all are facing era's big change. In order to survive even in the current circumstances, we have to change and adapt to the trend. JUKI proposes the solutions in your shopfloor.
A general auditing is not accepted. Please acknowledge it. |
| 4-3 | High-capacity & high-quality production system with the NPM
Jun Yamauchi,Panasonic Factory Solutions Co., Ltd. |
| 14:00 ～ 15:00 |
The NPM with multiple board transfer lanes provides printing, placement and inspection processes. This integrated system reduces changeover time wastage and improves further the productivity with variable mix variable volume production. A general auditing is not accepted. Please acknowledge it. |
| 4-4 | The printing technology of HITACHI SCREEN PRINTER
Akira Fukuzumi,Hitachi Plant Technologies,Ltd. |
| 15:30 ～ 16:30 |
Due to the market demand for communication and mobile products,
micro-components have been used a lot for such SMT process. We will
introduce our printing process to meet such demands.
TEL: 03-3516-7931 / FAX: 03-3516-7933 / E-mail: yuji.ono.tz@hitachi-pt.com |
- 6月5日(金)
- Admission free
| 5-1 | New YAMAHA surface Mounter
Naoki Hamamura,YAMAHA Motor Co.,LTd. IM Operations |
| 11:00 ～ 12:00 |
Newly designed high speed mounter with scallabilty and latest YAMAHA technology keeping YAMAHA Modular concept. On top of high productivity, high reliability and ease of use, space and energy saving requirments are fulfilled.
A general auditing is not accepted. Please acknowledge it. |
| 5-2 | Introduction of the next generation placement system
Sugiuchi Kouki,Siemens K.K. |
| 12:30 ～ 13:10 |
Introducing next generation placement system that fulfill high mix low volume production and high CPH with minimum change over time.
A general auditing is not accepted. Please acknowledge it. |
| 5-3 | Proposals methodology of measuring SMD mechanical strength and specification of soft tray. ---Report by JARA JISSO Strategic Working Group--- Sugiuchi Kouki,Japan Robot Association (JARA)/Siemens K.K. |
| 13:30 ～ 14:00 |
JARA JISSO Strategic Working Group announces its findings and suggests common methodology for measuring SMD mechanical strength and specification of soft tray for SMD and Mounter suppliers.
TEL: 03-3434-2919 / FAX: 03-3578-1404 / E-mail: jisso@jara.jp |
| 5-4 | Manufacturing systems of Sony challenges to more High speed.
Atsushi Saito,Sony Manufacturing Systems Co. |
| 14:30 ～ 15:30 |
We introduce the mounting technology with the products of our company that challenges the demand of High speed mounting. Not only Mounter but also Inspection machine and Solder paste printer.
URL: http://www.sonysms.co.jp/event/PROTEC2009.html |
