- 会期 ：6月3日(星期三)～6月5日(星期五)
- 会场 ：TOKYO BIG SIGHT, 东展示楼 东３大厅 、E会场、东５大厅 G会场
- 请在申请方法:各听讲申请处(TEL，FAX，E-mail，URL等)里(上)直接询问。
Room E
- 6月3日(星期三)
- Admission free
Latest Trend for Dry Film Photo Resist
| Japanese | Dryｆilm photoresist for ｌaser direct imaging 『Riston® LDI series』
Takashi Mita,R&D/leader,DuPont MRC DryFilm Ltd. |
| 11:30 ～ 12:00 |
『Riston® LDI series』 are efficient dry film resist that adjusts to the laser such as 355,405nm. We introduce the performance and a new product.
TEL: 03-5521-2400 / FAX: 03-5521-2401 / E-mail: toiawase.dmdf@mrg.mrc.co.jp |
| Japanese | Photosensitive Dry Film Resist for Direct Imaging
Yukiko Muramatsu,Researcher, |
| 12:10 ～ 12:40 |
Direct Imageable Photosensitive Dryfilm Resists for next generation PKG board are introduced. |
| Japanese | Leading-edge trend of micro fabrication for dry film resist
Yousuke Takayama,Manager, |
| 12:50 ～ 13:20 |
There will introduce the ｌeading-edge trend of dry film resist that has the characteristic for the micro fabrication.
TEL: 03-3296-3995 / FAX: 03-3296-3996 / E-mail: yoshida.tr@om.asahi-kasei.co.jp |
The surface treatment and machining technology of realizing a high definition and high density
| Japanese | Introduction for The Latest Drilling Machine with X-ray Technology of Schmoll Maschinen
Ryo Akutsu,Manager, |
| 13:30 ～ 14:00 |
Technical introduction for the latest Drilling Machine with X-ray Technology of Schmoll Maschinen
TEL: 03-5297-3315 / FAX: 03-5297-3316 |
| Japanese | Introduction for drilling cost reduction and developed new PCB tools.
Toshiyuki Watanabe, |
| 14:10 ～ 14:40 |
Proposing drilling with high quality, high performance and low cost to apply PCB progressing in micro fine, also introducing new drills.
TEL: 03-5493-1020 / FAX: 03-5493-1019 / E-mail: info@uniontool.co.jp |
| Japanese | Application of plasma equipment in PCB manufacturing process
Kazuya Mishima,Supervisor, |
| 14:50 ～ 15:20 |
We will introduce our machine that is appropriate for the case and each purpose to solve the defect and the problem that happens on the PCB manufacturing process by the plasma treatment along with making of the minute pattern and the diversification of the material.
TEL: 044-989-9129 / FAX: 044-989-9167 / E-mail: kazuya_mishima@nippoe.co.jp |
| Japanese | Final finish process for printed-circuit board and package substrate
Kazutaka Tajima, |
| 15:30 ～ 16:00 |
Final finish is selected the most suitable method by demand. We developed various final finish process that accepted each demand.
TEL: 048-665-2104 / FAX: 048-652-2090 / E-mail: sales@meltex.co.jp |
- 6月4日(星期四)
- Admission free
The latest FPC manufacture process technology trends
| Japanese | Technical trends of treated rolled copper foil for advanced FPCs
Kengo Kaminaga,Engineer, |
| 10:30 ～ 11:00 |
Super high flexible rolled copper foil for smaller and / or softer FPCs and new developed surface treatment for HDI FPCs will be introduced.
TEL: 03-5573-6555 / FAX: 03-5573-6778 / E-mail: k.miya@nikko-metal.co.jp |
| Japanese | Introduction of Electroless Nickel/Immersion Gold process for Flexible Printed Crcuits
Tsuyoshi Maeda,Deputy Senior Reseacher, |
| 11:10 ～ 11:40 |
We introduce electoroless nickel/immersion gold process adaped flexibility test. We also evaluated solderability test and patern characteristics.
TEL: 06-6202-8532 / FAX: 06-6202-8533 / E-mail: cpd@uyemura.co.jp |
| Japanese | The direct imaging device for FPC by the electrophotography
Tamio Fukui,Manager, |
| 11:50 ～ 12:20 |
It is the innovative device which prints the circuit pattern of the etching resist directly on the FPC surface by electrophotographic technology.
TEL: 075-934-8103 / FAX: 075-931-1285 / E-mail: te.ueda@prp.screen.co.jp |
Challenge to Fine Patterning! Latest trend for Imaging Process
| Japanese | Print-circuit on Polyimide-silica hybrid by Wet plating
Hideki Goda,HB Group Leader, |
| 12:30 ～ 13:00 |
Polyimide-silica hybrid has a structure of nano-silica dispersing in polyimide matrix. It displays very low CTE and is suitable for semi-additive PCB by using wet plating method.
TEL: 03-5645-7805 / FAX: 03-5645-7867 / E-mail: hikari_info@arakawachem.co.jp |
| Japanese | The latest trend of projection exposure technology for fine wiring patterning
Seiro Murakami,Senior Managing Director Divisions Director & Head of Light System Division, |
| 13:10 ～ 13:40 |
The latest trend of the projection exposure technology in the electronic circuit board and the package manufacturing is reviewed, and it reports on the development situation in Mejiro precision Ｉｎｃ.
TEL: 03-3643-2731 / FAX: 03-3643-2737 / E-mail: murakami@mejiro.co.jp |
| Japanese | The Use of Non-Etching Adhesion Promoters Prior To Dry Film Lamination
Takaaki Shirato, |
| 13:50 ～ 14:20 |
In the Semi Additive Process, Non-etching adhesion promoters increase the dry film adhesion without risking removal of the electroless Cu layer.
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The Interconnection Technology which realizes high reliability
| Japanese | Latest void-free packaging and non-flax reflow technology
Yasuhisa Yamada, |
| 14:30 ～ 15:00 |
Introduction of non-flax solderjunction,wafer-level packaging,vacuum sealing of small package technology
TEL: 03-3548-2610 / FAX: 03-3231-3460 / E-mail: tokyo01@ayumi-ind.co.jp |
| Japanese | Sn/Ag/Cu-based thermosetting conductive adhesive paste which has excellent reliability by soldering.
Tashiro Toshiya, |
| 15:10 ～ 15:40 |
Lead & VOC free Sn/Ag/Cu-based Thermosetting Conductive Adhesive Paste which has excellent electrical conductivity by soldering.
TEL: 04-2934-6131 / FAX: 04-2934-6559 / E-mail: eikan.kaken@tamura-ss.co.jp |
| Japanese | Joint Interface Analysis of High Impact Strength SN100C Lead-free BGA Spheres
Daisuke Nishida, |
| 15:50 ～ 16:20 |
High speed impact testing results of Sn-37Pb, Sn-Ag-Cu, and Sn-Cu-Ni BGA solder spheres and the analysis of the fracture areas and joint interfaces.
TEL: 03-3642-5234 / FAX: 03-3642-5257 / E-mail: s.seki@nihonsuperior.co.jp |
| Japanese | Electrolytic solder deposit for the next generation solder resist openings
Toshiya Fujiwara,Chief, |
| 16:30 ～ 17:00 |
Ultra fine pitch SRO is causing production difficulties with the stencil printing process. The answer to this solution is Solder Filling Technology.
※There is no necessity for prior reservation. |
- 6月5日(星期五)
- Admission free
The Latest Technology Trends for Device Embedded Electronic Circuits Board and IC Package Substrate
| Japanese | The superthin 0.15&0.2mm thickness package using a lead frame
Masuda Masachika,Senior Expert, |
| 10:30 ～ 11:00 |
A laminated package of 3-D mounting is watched.The superthin 0.15&0.2mm package which can be laminated using a lead frame is introduced as the one. |
| Japanese | Introduction of projection lens lineup & roadmap for next-generation IC package substrates
Takumi Tanaka,Director,Executive GM, |
| 11:10 ～ 11:40 |
Introducing ADTEC's projection lens lineup & roadmap for next-gen. IC package substrates with showing imaging performance with latest photo resists.
TEL: 03-3433-4466 / FAX: 03-3433-4330 / E-mail: sales@adtec-eng.co.jp |
| Japanese | Buried Bump Interconnection Technology (B2itTM) in EPD &EAD Printed Wiring Board
Kiyoshi Takeuchi,Group Leader,Product Development Group, |
| 11:50 ～ 12:20 |
I introduce a printed wiring board embedded passive device and active device using B2it which is original ｔechnology of Dai Nippon Printing Co., Ltd. |
| Japanese | Advanced Metallization Process for Next Generation PKG Substrate
Hiroyuki Nishiwaki,Manager, |
| 12:30 ～ 13:00 |
RHEM provides metallization process chemicals giving high adhesion for low profile surface, to realize high performance next generation PKG substrate.
TEL: 0250-63-2237 / FAX: 0250-63-0377 / E-mail: nishiwakih@rohmhaas.com |
| Japanese | TCR the material for embedded resistor
Toshio KUROSAWA,Senior Engineer, |
| 13:10 ～ 13:40 |
TCR the material for embedded resistor, its structure, property and recommended process to be built the embedded resistor etc. will be introduced.
TEL: 03-5573-6555 / FAX: 03-5573-6778 / E-mail: k.miya@nikko-metal.co.jp |
| Japanese | Test technologies supporting HVM of embedded passive and active boards
Hidehiko Mitsugi,Manager, |
| 13:50 ～ 14:20 |
Expanding use of embedded components is increasing the importance of electrical test in HVM. We introduce the technologies to ensure the reliability.
TEL: 0268-28-0560 / FAX: 0268-28-0569 / E-mail: info@hioki.co.jp |
Room G
- 6月3日(星期三)
- Admission free
The Latest Technology of Materials for Electronic Circuits Manufacturing
| Japanese |
Hitachi Chemical proposal for new generation PKG substrate
Tetsuro Irino,Senior Engineer, |
| 11:30 ～ 12:00 |
We introduce the concept and a new material in the next generation semiconductor package substrate. |
| Japanese | Low transmission loss and excellent heat resistance PCB material ‘Megtron 4’
Imai Masao,Product Development Group, |
| 12:10 ～ 12:40 |
We will introduce the new material ‘MEGTRON 4’ we have developed to meet the trend of the high speed signal and the lead free soldering process in the IT equipment.
TEL: 06-6909-3787 / FAX: 06-6906-1858 / URL: http://panasonic-denko.co.jp/em/ |
| Japanese | Introduction of the heat resistant adhesive and the application.
Takashi Sato,General Manager, |
| 12:50 ～ 13:20 |
We have developed the heat resistant adhesive. We introduce the performance and the application.
TEL: 03-3542-2274 / URL: http://www.somar.co.jp/ |
| Japanese | The printed wiring board which solved a problem of the heat.
Kaoru Ono,Executive Director & Technical Department chief, |
| 13:30 ～ 14:00 |
We accept a purpose and offer the print circuit boards which solved a problem of the heat of the high brightness LED and the power semiconductor.
TEL: 0266-72-7003 / FAX: 0266-73-5033 / E-mail: ainono@valley.ne.jp |
Evaluation and inspection / analysis technical front line which realizes high reliability
| Japanese |
High precision , high speed & high cost performance PCB AOI to fit under 10μｍ L/S
Tom Murakami,Technology Development Div.,inspec Inc. |
| 14:10 ～ 14:40 |
PCB AOI using submicron resolution L/S measurement with high precision & high speed. It introduces new PCB AOI that achieves overwhelming CP.
TEL: 0187-54-1888 / FAX: 0187-54-3195 / E-mail: inspec.info@inspec21.com |
| Japanese | Non contact and precise 3D measurement and roughness measurement by 3D Measuring Laser Microscope LEXT OLS4000
Hitoshi Suzuki,Group Manager, |
| 14:50 ～ 15:20 |
Non contact and precise 3D measurement and roughness measurement by 3D Measuring Laser Microscope LEXT OLS4000
TEL: 03-6901-9114 / FAX: 03-3340-2345 / E-mail: fis-promotion@ot.olympus.co.jp |
| Japanese | Measurement technology of High frequency signal stracture loss(RIE Technology)
Terumitsu Tsuji,Country Manager, |
| 15:30 ～ 16:00 |
Market required to PCB as to be with high-frequency signal transmission, RIE technology is the suggestion to meet this demand
TEL: 045-339-0155 / FAX: 045-333-0051 / E-mail: japan@polarinstruments.com |
| Japanese | You'll be fine! Analysis ways for some problems in the production field.
Yoshihiko Kawano,Sub-leader, |
| 16:10 ～ 16:40 |
We explain a method of analysis that we used an example and an analysis device of the malfunction to occur at the time of production for.
TEL: 086-243-2340 / FAX: 086-243-8351 / E-mail: moriya@vantecsp.co.jp |
- 6月４日(星期四)
- Admission free
Design solution technology for the next generation
| Japanese | ～Power integrity design in high multilayer printed wiring board～Optimization technique of power supply and ground plane ～
Kazunori Futamura,The second of e-function module developments,Oki Printed Circuit Co., Ltd. |
| 10:30 ～ 11:00 |
I introduce the optimization technique of the power supply and ground plane to improve the power integrity.
TEL: 03-5282-5171 / FAX: 03-3291-6160 / E-mail: hashimoto736@oki.com |
| Japanese | The 3D electromagnetism electromagnetic simulation of the design of PCB
Chihiro Ueda, |
| 11:10 ～ 11:40 |
The introduction of analysis example for high speed in the latest 3D electromagnetic simulation.
TEL: 044-980-0505 / FAX: 044-980-1515 / E-mail: info@aetjaopan.com |
| Japanese | Assembly aided system "PC-MountCAM"
Rikio Nagai, |
| 11:50 ～ 12:20 |
Introduce "PC-MountCAM" software for creating assembly documents and program Automatic assembly equipment.
TEL: 03-3940-9081 / FAX: 03-3940-9080 / E-mail: sales@dynatron.co.jp |
| Japanese | Valor Enterprise3000 DFM for ECO and Cost Down
Shigemi Saitoh,General Manager, |
| 12:30 ～ 13:00 |
Introduction of a famous DFM system "Enterprise 3000" for printed circuit board design process.
TEL: 03-5297-3324 / FAX: 03-5297-3646 / E-mail: enterprs@cybernet.co.jp |
Key technology for JISSO
| Japanese | The latest technology of precise liquid control by Inkjet dispenser etc.
Kazuteru Tomiyama,Manager, |
| 13:50 ～ 14:20 |
We introduce the latest technological trend of precise liquid control in mounting by Inkjet dispenser and Jet dispenser.
TEL: 0422-76-7111 / FAX: 0422-76-7122 / E-mail: eikai@musashi-engineering.co.jp |
| Japanese | Introduces system "SphincsTracer" that can trace lot No. of electronic parts mounted on the PCB.
Fuminori Shiota,Leader, |
| 14:30 ～ 15:00 |
It proposes SphincsTracer with a new concept. Lot No. such as IC of each substrate is recorded by an easy operation, and the traceability is enabled.
TEL: 086-243-2340 / FAX: 086-243-8351 / E-mail: moriya@vantecsp.co.jp |
| Japanese | Improved logistic in SMT manufacturing
Toshimitsu Sakaki, |
| 15:10 ～ 15:40 |
Since 1984, MYDATA has offered real flexibility in SMT manufacturing. This time, MYDATA is introducing the new SMD Tower, which drastically improves your component logistics.
TEL: 03-3553-5053 / FAX: 03-3553-5051 / E-mail: Toshimitsu.Sakaki@mydata.co.jp |
- 6月5日(星期五)
- Admission free
Latest Trend for Plating process
| Japanese ／English |
Latest development on horizontal line plating of PCBs and FPCs.
Frank Baron,Hollumuller. European, and Japan sales manager, |
| 10:30 ～ 11:00 |
Based on over 40 years of horizontal line manufacturing experiences, discuss the lateset development of PCBs and FPCs plating using actual data..
TEL:
06-6202-8532 / FAX: 06-6202-8533 |
| Japanese | High Performance Acid Copper Plating Additive for P.W.B. "TOP Lucina GT"
Hirofumi Watanabe, |
| 11:10 ～ 11:40 |
"TOP Lucina GT"is high quality plating additive for P.W.B. It has very high throwing power, contributes to improvement of productivity and reliabillity.
TEL: 06-6961-0886 / FAX: 06-6963-0740 / E-mail: m-ikeda01@okuno.co.jp |
| Japanese | Green Benefits of Improved Direct Plating Process
Koji Semba,Chief, |
| 11:50 ～ 12:20 |
Introduction of Atotech’s Seleo CP Plus (conductive polymer) & Neopact (Pd-based) processes to illustrate the environmental benefits of direct plating.
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| Japanese | Acid Copper Plating Technologies for Advanced Printed Circuit Boards and Semiconductors.
Hideki Hagiwara, |
| 12:30 ～ 13:00 |
We will introduce our latest acid copper plating technology, such as the via-hole and through hole filling, and the copper bump and RDL patterns formation.
TEL: 03-3835-2951 / FAX: 03-3836-9264 / E-mail: hamachi.yuma@eu.ebara.com |
| Japanese | Advanced plating process technologies of precious metals for next-generation products
Masahiro Ito, |
| 13:10 ～ 13:40 |
We propose substitue plating process and less expensive precious metals in response to the trend toward more efficient use of precious metals.
TEL: 0463-32-8291 / FAX: 0463-33-4017 / E-mail: info@eeja.com |
