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ー「 ソャチヲヌマタヌ サ。ーュ ケョタレ(TEL, FAX, E-mail, URLオ ) ソャカテウソ。 チチ「 ケョタヌヌリ チヨシシソ.

Latest Trend for Electronic Circuit Board Plating Process
English
(Japanese interpretation)
Via2 - Laser Embedded Conductor technology
12:30

13:00
Dave Baron, Director of Technology Strategy and Strategic Marketing, Atotech Germany GmbH, Atotech Japan K.K.

A revolutionary production process for ultra high density IC Substrates-Plating, circuitization and final product electrical performance is the focus.
there is no necessity for prior reservation.

Japanese "Sterling" immesion silver plating process for PWB final finish
13:10

13:40
Noritoshi Ikeda, R&D TEAM, NIPPON MACDERMID CO.,LTD.
We introduce Sterling process of immersion silver plating as PWB final finish, which has the excellent solderability.
TEL: 044-820-1180 / FAX: 044-812-4485 / E-mail: nishukeisuke@macd.co.jp

Japanese Through Hole Filling technology with Uniplate System
13:50

14:20
Toshiya Fujiwara, Chief, Product Marketing Department, Electronics Business Division,
Atotech Japan K.K.
This paper presents through hole filling technology with Uniplate system. This technology enables to reduce process cost and steps significantly.
there is no necessity for prior reservation.

Japanese Electroless Ni-P/Pd/Au plating process。クTOP NPG PROCESS。ケ
14:30

15:00
Yasuhiro Tanabe, R&D Laboratory,Metal Finishing,OKUNO CHEMICAL INDUSTRIES CO.,LTD.,
OKUNO CHEMICAL INDUSTRIES CO.,LTD.
We wish to introduce electroless Ni-P/Pd/Au plating process "Top NPG Process" which gives excellent solder bonding effect and Au wire bonding reliability at Au plating technology on packaging board.
TEL: 06-6965-4111 / FAX: 06-6963-0740 / E-mail: y-tanabe01@okuno.co.jp /
URL: http://www.okuno.co.jp/

Japanese New generation Lead free final finish (Melplate Ni/Pd/Au process)
15:10

15:40
Kazutaka Tajima, Research & Development 1st. LAB., 」ヘ」ナ」フ」ヤ」ナ」リ 」ノ」ホ」テ」ョ
Regulation is enforced by the environmental issue such lead. We developed new completely lead-free final finish that can give many advantages.
TEL: 048-665-2104 / FAX: 048-652-2090 / E-mail: sales@meltex.co.jp /
URL: http://www.meltex.co.jp
 

Latest Trend for Reliability Evaluation Technology
Japanese Updated UL requirements for PWBs and reliability evaluation techique and failure analysis of PCBs.
15:50

16:20
Tamae Takahashi / Saburo Osawa, Director / SMT Evaluation Group Manager,
Director / SMT Evaluation Group Manager, Chemitox, Inc.
Updated UL requirement, reliability evaluation technique and failure analysis for PCBs and SMT.
TEL: 03-3727-7111 / FAX: 03-3728-1710 / E-mail: hi-yamaguchi@chemitox.co.jp /
URL: http://www.chemitox.co.jp

Japanese Reliability Testing Technique of Printed-circuit-board
16:30

17:00
Hirokazu Tanaka, Thechnical DevelopmentH eadquarters, ESPEC CORP.
We report reliability test technology for the problem of the PCB. As the reported test case, it is a connection and insulation reliability test.
TEL: 06-6358-4751 / FAX: 06-6358-5176 / E-mail: k-gotou-c@espec.co.jp
 
Challenge toward Fine -Imaging Process Technology Trend Part 1-
Japanese DryFilm for Laser Direct Imaging 。コRiston® LUV series。サ
10:30

11:00
Amane Aoyagi, Senior Research Chemist, Product Development Group, DuPont MRC DryFilm Ltd.
。コRiston® LUV series。サ are LDI DryFilms with high sensitivity and resolution. Their properties and applications will be introduced in this presentation.
TEL: 03-5521-2400 / FAX: 03-5521-2401 /
E-mail: toiawase.dmdf@mrg.mrc.co.jp / URL: http://www.dmdf.jp/

Japanese Recent action of direct imaging Dry Film Resist.
11:10

11:40
Youichiroh IDE, Electronics Interconnecting Materials Technology & Development Dept. Manager,
ASAHI KASEI EMD CORPORATION
Introducing our developmental status and our future vision.
TEL: 03-6911-2875 / FAX: 03-6911-2748 / E-mail: yamaguchi.tcg@om.asahi-kasei.co.jp

Japanese Photosensitive Dry Film Resists for Direct Imaging
11:50

12:20
Masahiro Miyasaka, Electronic Materials R&D Center, Resercher, Hitachi Chemical Co., Ltd.
Photosensitive dry film resists for direct imaging will be introduced. Dry film for fine package will be focused on.

Japanese Development of Dry Film Solder Mask
12:30

13:00
yoshiaki honma, Sales and Marketing Department, Nichigo-Morton Co., Ltd.
Introduction of Dry Film Solder Resist instead of conventional liquid type for response to the trend of thinner PWB.
TEL: 0495-77-4496 / FAX: 0495-77-0434 / E-mail: yhonma@nichigo-morton.co.jp
 

Challenge toward Fine -Imaging Process Technology Trend Part 2-
Japanese Technology for Enhanced Etching
13:10

13:40
Tadashi Hirakawa, Currentec Inc., Currentec Inc.
Impulse Etching technology combined with additives drastically enhances etch factor in fine features. Vacuum etching technology improves uniformity.
TEL: 03-3728-9298 / FAX: 03-3728-9287 / E-mail: contact@currentec.co.jp /
URL: http://www.currentec.co.jp

English Technology for Enhanced Etching
13:50

14:20
Marcus Lang, Managing Director, LP Chemie, LP Chemie GmbH & Co., KG

Impulse Etching technology combined with additives drastically enhances etch factor in fine features. Vacuum etching techonlogy improves uniformity.
TEL: 03-3728-9298 / FAX: 03-3728-9287 / E-mail: contact@currentec.co.jp /
URL: http://www.currentec.co.jp

Japanese Intelligent Etching compensation system "DynaFLEX"
14:30

15:00
Rikio Nagai, Technical Manager, Dynatron Co.,Ltd
DyanaFLEX compensates design data atutomatically for Copper Etching process with Line, Pads, Gold finger and other attribute.
TEL: 03-3940-9081 / FAX: 03-3940-9080 / E-mail: support@dynatron.co.jp /
URL: http://www.dynatron.co.jp

Japanese Surface treatment agent and the technology for high-end interconnection.
15:10

15:40
Akihiro Aiba, Electronic Materials Company Isohara Works Innovative Materials Development Center Senior Engineer, NIPPON MINING & METAL CO., LTD.
We introduce surface treatment agent and the technology for various metals for high-end interconnection.
TEL: 03-5573-6584 / FAX: 03-5573-6778 / E-mail: I.chizak@nikko-metal.co.jp

Japanese Possibility of the high efficiency and long life light source "Milti Lamp System(MLS)"
15:50

16:20
Hiroyuki Imai, General Manager of Engineering Division, ADTEC Engineering Co., Ltd.
Introduction of the possibility of Multi Lamp System(MLS) with high efficiency and long life features for exposing of printed circuit board.
TEL: 03-3433-4466 / FAX: 03-3433-4330 / E-mail: sales@adtec-eng.co.jp

Japanese State-of-the-art Solder Resist Exposure
16:30

17:00
Kenichi Sudo, Group Leader, Equipment Desining Department, Equipment Company,
ORC MANUFACTURING CO., LTD.
By the new model of Direct Imaging System, "Di IMPACT", we offer the solution to solder resit exposure for higher density & finner electric circuits.
 
Surface Finishing and Mechanical Process Technology to realize High Density and High Definision
Japanese Plasma Surface Treatment System "TAIKAI" and Examples of Its Use
10:30

11:00
Hiroyuki Ueyama, Manager. 2nd Engineerring Section Research & Development Headquarters,
EBARA-UDYLITE CO., LTD.
Presentation of the examples of surface treatment in the use of our Plasma System "TAIKAI" and suggestions in light of reducing environmental burden.
TEL: 03-3835-2951 / FAX: 03-3836-9264 / E-mail: hamachi.yuma@eu.ebara.com

Japanese HOLE PLUGGING INK REMOVAL
11:10

11:40
JUNICHI?KOTANI, MACHINERY DIVISION ,TOKYOB RANCH , SECTION HEAD,
ISHIIHYOKI CO., LTD.
Recently, hole plugging ink removal is important process for reliability improvement of materials. So, we will introduce about this process.
TEL: 03-3939-6845 / FAX: 03-5383-7231 / E-mail: machinery@ishiihyoki.co.jp

Japanese Analysis of Drilling Mechanism and Development in Micro-Mechanical Drilling
11:50

12:20
Hidehito Watanabe, Engineering R&D Depatment Drilling Tool Development Section,
」ユ」ホ」ノ」マ」ホ。。」ヤ」マ」マ」フ。。」テ」マ」ョ
Analysis of micro drills' drilling mechanism and effects on hole quality. Focusing on breakage, examination of new product development is presented.
TEL: 0258-22-2620 / FAX: 0258-22-0246 / E-mail: watnabeh@uniontool.co.jp /
URL: http://www.uniontool.co.jp

English/
Japanese
Flexible drilling and routing solutions
12:30

13:00
Martin Hillenbrand /Ryo Akutsu, Marketing and Sales Manger Asia,
Schmoll Maschinen GmbH/ Sanko Giken Kogyo
Introduction of a new machine series which is customized for flexible production requirements like different drill bit diameters (flexible spindles), small and large lot sizes, short set up time, automation concepts。ヲ
 
NPI ヌチキケチィナラタフシヌ。。エツ JPCAShow2007/2007 Microelectronics show /JISSO PROTEC 2007 テ簑タレソ。 タヌヌム スナチヲヌー。、 スナア箴 PRシシケフウェタヤエマエル. 3 シシシヌ オソステ チヌ狢フ オヌー タヨア カァケョソ。, スナテサ ステソ。エツ チヨタヌヌリ チヨシシソ.オ。コルソゥ テサーュタサ ネクチヌマステエツ ー豼エツ, ー「 テサーュ スナテサ タ蠑メ(ソャチヲヌマタヌ サ。ーュ ケョタレキホ ウェナクウサ コクタフエツ TEL, FAX, E-mail, URLオ )ソ。 チチ「 ケョタヌヌリ チヨシシソ