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ネクア筌コ6ソ 11タマ (シ)-6ソ 13タマ (アン) テサーュ ケォキ
ネクタ螢コTOKYO BIG。。SIGHT オソツハ タステオソ」アF A-Cネクタ( ー「 ネクタ 80ク チ、ソ)
テサーュタサ ネクチヌマステエツ ー豼エツ ー「 ーュソャ クカエルタヌ スナテサタフ オヒエマエル.
ー「 ソャチヲヌマタヌ サ。ーュ ケョタレ(TEL, FAX, E-mail, URLオ ) ソャカテウソ。 チチ「 ケョタヌヌリ チヨシシソ.
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| Latest Trend for Electronic Circuit Board Plating Process |
English (Japanese interpretation) |
Via2 - Laser Embedded Conductor technology |
12:30
 13:00 |
Dave Baron, Director of Technology
Strategy and Strategic Marketing, Atotech Germany GmbH, Atotech Japan K.K.
A revolutionary production process for ultra
high density IC Substrates-Plating, circuitization and final product electrical
performance is the focus.
there is no necessity for prior reservation. |
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| Japanese |
"Sterling" immesion silver plating process for PWB final finish |
13:10
 13:40 |
Noritoshi Ikeda, R&D TEAM, NIPPON MACDERMID CO.,LTD.
We
introduce Sterling process of immersion silver plating as PWB final finish,
which has the excellent solderability.
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| Japanese |
Through Hole Filling technology with Uniplate System |
13:50
 14:20 |
Toshiya Fujiwara, Chief, Product Marketing Department, Electronics
Business Division,
Atotech Japan K.K.
This paper presents through hole filling technology
with Uniplate system. This technology enables to reduce process cost and
steps significantly.
there is no necessity for prior reservation. |
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| Japanese |
Electroless Ni-P/Pd/Au plating process。クTOP
NPG PROCESS。ケ |
14:30
 15:00 |
Yasuhiro Tanabe, R&D Laboratory,Metal Finishing,OKUNO CHEMICAL
INDUSTRIES CO.,LTD.,
OKUNO CHEMICAL INDUSTRIES CO.,LTD. We wish to
introduce electroless Ni-P/Pd/Au plating process "Top NPG Process" which
gives excellent solder bonding effect and Au wire bonding reliability at
Au plating technology on packaging board.
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| Japanese |
New generation Lead free final finish (Melplate Ni/Pd/Au process) |
15:10
 15:40 |
Kazutaka Tajima, Research & Development 1st. LAB., 」ヘ」ナ」フ」ヤ」ナ」リ
」ノ」ホ」テ」ョ
Regulation is enforced by the environmental issue
such lead. We developed new completely lead-free final finish that can give
many advantages.
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| Latest Trend for Reliability Evaluation Technology |
| Japanese |
Updated UL requirements for PWBs and reliability evaluation techique and failure analysis of PCBs. |
15:50
 16:20 |
Tamae Takahashi / Saburo Osawa, Director / SMT Evaluation Group
Manager,
Director / SMT Evaluation Group Manager,
Chemitox, Inc.
Updated UL requirement, reliability evaluation
technique and failure analysis for PCBs and SMT.
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| Japanese |
Reliability Testing Technique of Printed-circuit-board |
16:30
 17:00 |
Hirokazu Tanaka, Thechnical DevelopmentH eadquarters, ESPEC CORP.
We report reliability test technology for the
problem of the PCB. As the reported test case, it is a connection and insulation
reliability test.
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| Challenge toward Fine -Imaging Process Technology Trend Part 1- |
| Japanese |
DryFilm for Laser Direct Imaging 。コRiston® LUV
series。サ |
10:30
 11:00 |
Amane Aoyagi, Senior Research Chemist, Product Development Group,
DuPont MRC DryFilm Ltd.
。コRiston® LUV series。サ are LDI
DryFilms with high sensitivity and resolution. Their properties and applications
will be introduced
in this presentation.
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| Japanese |
Recent action of direct imaging Dry Film Resist. |
11:10
 11:40 |
Youichiroh IDE, Electronics Interconnecting Materials Technology & Development
Dept. Manager,
ASAHI KASEI EMD CORPORATION
Introducing our developmental status and our future vision.
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| Japanese |
Photosensitive Dry Film Resists for Direct Imaging |
11:50
 12:20 |
Masahiro Miyasaka, Electronic Materials R&D Center, Resercher,
Hitachi Chemical Co., Ltd.
Photosensitive dry film resists for direct imaging
will be introduced. Dry film for fine package will be focused on.
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| Japanese |
Development of Dry Film Solder Mask |
12:30
 13:00 |
yoshiaki honma, Sales and Marketing Department, Nichigo-Morton
Co., Ltd.
Introduction of Dry Film Solder Resist instead of conventional liquid type for response to the trend of thinner PWB.
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| Challenge toward Fine -Imaging Process Technology Trend Part 2- |
| Japanese |
Technology for Enhanced Etching |
13:10
 13:40 |
Tadashi Hirakawa, Currentec Inc., Currentec Inc.
Impulse Etching technology combined with additives drastically enhances etch factor in fine features. Vacuum etching technology improves uniformity.
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| English |
Technology for Enhanced Etching |
13:50
 14:20 |
Marcus Lang, Managing Director,
LP Chemie, LP Chemie GmbH & Co., KG
Impulse Etching technology combined with additives drastically enhances etch
factor in fine features. Vacuum etching techonlogy improves uniformity.
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| Japanese |
Intelligent Etching compensation system "DynaFLEX" |
14:30
 15:00 |
Rikio Nagai, Technical Manager, Dynatron Co.,Ltd
DyanaFLEX compensates design data atutomatically
for Copper Etching process with Line, Pads, Gold finger and other attribute.
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| Japanese |
Surface treatment agent and the technology for high-end interconnection. |
15:10
 15:40 |
Akihiro Aiba,
Electronic Materials Company Isohara Works Innovative
Materials Development Center Senior Engineer, NIPPON MINING & METAL CO.,
LTD.
We introduce surface treatment agent and the technology for various metals for high-end interconnection.
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| Japanese |
Possibility of the high efficiency and long life light source "Milti Lamp System(MLS)" |
15:50
 16:20 |
Hiroyuki Imai, General Manager of Engineering Division, ADTEC
Engineering Co., Ltd.
Introduction of the possibility of Multi Lamp
System(MLS) with high efficiency and long life features for exposing of printed
circuit board.
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| Japanese |
State-of-the-art Solder Resist Exposure |
16:30
 17:00 |
Kenichi Sudo, Group Leader, Equipment Desining Department, Equipment
Company,
ORC MANUFACTURING CO., LTD.
By the new model of Direct Imaging System, "Di
IMPACT", we offer the solution to solder resit exposure for higher density & finner
electric circuits.
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| Surface Finishing and Mechanical Process Technology to realize High Density and High Definision |
| Japanese |
Plasma Surface Treatment System "TAIKAI" and Examples of Its Use |
10:30
 11:00 |
Hiroyuki Ueyama, Manager. 2nd Engineerring Section
Research & Development Headquarters,
EBARA-UDYLITE CO., LTD.
Presentation of the examples of surface treatment
in the use of our Plasma System "TAIKAI" and suggestions in light
of reducing environmental burden.
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| Japanese |
HOLE PLUGGING INK REMOVAL |
11:10
 11:40 |
JUNICHI?KOTANI, MACHINERY DIVISION ,TOKYOB RANCH , SECTION HEAD,
ISHIIHYOKI CO., LTD.
Recently, hole plugging ink removal is important
process for reliability improvement of materials. So, we will introduce about
this process.
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| Japanese |
Analysis of Drilling Mechanism and Development in Micro-Mechanical Drilling |
11:50
 12:20 |
Hidehito Watanabe, Engineering R&D Depatment Drilling Tool
Development Section,
」ユ」ホ」ノ」マ」ホ。。」ヤ」マ」マ」フ。。」テ」マ」ョ
Analysis of micro
drills' drilling mechanism and effects on hole quality. Focusing on breakage,
examination of new product development is presented.
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English/ Japanese |
Flexible drilling and routing solutions |
12:30
 13:00 |
Martin Hillenbrand /Ryo Akutsu, Marketing and Sales Manger Asia,
Schmoll
Maschinen GmbH/ Sanko Giken Kogyo
Introduction of a new machine series which
is customized for flexible production requirements like different drill
bit diameters (flexible spindles), small and large lot sizes, short set
up time, automation concepts。ヲ
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| NPI ヌチキケチィナラタフシヌ。。エツ JPCAShow2007/2007 Microelectronics show /JISSO PROTEC 2007 テ簑タレソ。 タヌヌム
スナチヲヌー。、 スナア箴 PRシシケフウェタヤエマエル.
3 シシシヌ オソステ チヌ狢フ オヌー タヨア カァケョソ。, スナテサ ステソ。エツ チヨタヌヌリ チヨシシソ.オ。コルソゥ テサーュタサ ネクチヌマステエツ ー豼エツ,
ー「 テサーュ スナテサ タ蠑メ(ソャチヲヌマタヌ サ。ーュ ケョタレキホ ウェナクウサ コクタフエツ TEL, FAX, E-mail, URLオ )ソ。 チチ「 ケョタヌヌリ チヨシシソ |
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