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ネクア筌コ6ソ 11タマ (シ)-6ソ 13タマ (アン) テサーュ ケォキ
ネクタ螢コTOKYO BIG。。SIGHT オソツハ タステオソ」アF A-Cネクタ( ー「 ネクタ 80ク チ、ソ)
テサーュタサ ネクチヌマステエツ ー豼エツ ー「 ーュソャ クカエルタヌ スナテサタフ オヒエマエル.
ー「 ソャチヲヌマタヌ サ。ーュ ケョタレ(TEL, FAX, E-mail, URLオ ) ソャカテウソ。 チチ「 ケョタヌヌリ チヨシシソ.
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| Latest Designe Solution Technology for Next Generation |
| Japanese |
New floorplanning and design tool - CR-5000 Lightning |
12:30
 13:00 |
Hirohiko Matsuzawa,R&D Division / Thunder Project / Project Leader,Zuken
Inc.
CR-5000 Lightning provides the software prototype environment with strong SI/EMI analysis, sophisticated placement tool and new strategic routing technology "Dragon Router".
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| Japanese |
A high value-added board design used Allegro
and DEMITASNX |
13:10
 13:40 |
Toshiya Saito,Senior Sales Representative PCB Solution Dept.
Applied Systems Second Div.,
CYBERNET SYSTEMS CO.,LTD.
To compete foreign design houses, we have to
design more value-added boards. We introduce PCB design techniques utilized
EDA tools.
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| Japanese |
Virtual PCB Stack Up Layout Simulation Technique
and Loss and Lossless calculation for PCB Transmission Line |
13:50
 14:20 |
Terumistu Tsuji,Country Manager,Polar Instruments Japan Branch
Present how to build virtual PCB Stack up layout
and its Lossless, Loss simulation for Transmission line of PCB.
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| Japanese |
Optical Solutions for Electronics engineers |
14:30
 15:00 |
Junko Yamashita,Optical Solution Department,CYBERNET SYSTEMS
CO.,LTD.
Recently, Electronics engineers are needed to
have basic knowledge in other technical areas. We introduce optical solutions
engineers want to know.
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| Packaging Manufacturing Technology for the Next |
| Japanese |
New Low-CTE material MCL-E-679GT for thin package
substrate |
15:10
 15:40 |
Takanezawa Shin,Electronic Materials R&D Center,Senior Reseacher,Hitachi
Chemical Co.,Ltd
Hitachi Chemical has developed MCL-E-679GT of
low-CTE and high modulus. We will introduce package substrate warpage and
properties of MCL-E-679GT.
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| Japanese |
Introduction of next generation's packaging
technology |
15:50
 16:20 |
Takehiko Murakami,PRESIDENT,MINAMI CO., LTD
Recently BGA and WL-CSP applying to IC and LSI
etc is increasing . Minami introduces our solder bump technology by screen
printing and ball placement.
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| Japanese |
Toray Engineering recommend Vacuum Printing System. |
16:30
 17:00 |
Shunichi Okamoto,Fine Process Sales Dept. Fine Process Business
Unit, Electronics Div.,
Toray Engineering suggests Vacuum Printing System
for LED,MCM and Viafilling.
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| Latest Technology Trend of Test/Evaluation to realize high reliability |
| Japanese |
Auto Drill Inspection II Optical Inspection
System for small size drill, to be essential for drilling of PWB. |
10:30
 11:00 |
Saburo Maruchi,President,FA Vision Corp.
New system: Auto-drill Inspection II for both
new and re-sharpen drill, to the requirement such as ,2・,3・,with ring, without
ring and multiple casses.
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| Japanese |
The new application of the evaluation / examination
with using X-ray fluorescence spectrometer in the electronic circuit board. |
11:10
 11:40 |
Katsumi Natsui,Assistant manager, Analytycal Application engineering
Section,SII NanoTechnology Inc.
I introduce examples by the latest machinery
such as the measurement of the thin plating or the hazardous substance on
an electronic circuit board.
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| Japanese |
The latest X-ray inspection technology |
11:50
 12:20 |
Mr. Masayuki Kamegawa,General Manager of Non-Destructive Inspection
Business Unit, Shimadzu Corp.,SHIMADZU CORPORATION
The latest application of the non-destructive
inspection will be introduced with novel X-ray Fluoroscopic and CT system.
there is no necessity for prior reservation. |
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| Japanese |
Measurement of Copper Oxide Film by SERA Method |
12:30
 13:00 |
Mr.Masatsune Suzuki,3rd Sales Division SERA Specialist,Cermatronics
Boeki Co., Ltd.
Copper oxide film has been watched as new theme
in complicated and progressed assebly boards. This will be more important
in future.
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| Soldering Technology Front Line for Enviroment and Reliability |
| Japanese |
Solder Joint Reliability of Nickel-based Surface
Finishes - Comparing ENIG with Ni/Pd |
13:10
 13:40 |
Ken Hashimoto,Chief, Product Marketing Department, Electronics
Business Division,
Atotech Japan K.K.
The presentation summarizes the results of recent
investigations on both ENIG and NiPd with respect to Pb-free solder connections.
there is no necessity for prior reservation. |
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| Japanese |
Sn/Bi-based conductive adhesive which enable
eco-friendly, low temperature hardening, excellent reliability by soldering. |
13:50
 14:20 |
Takashi Nakabayashi,R&D Aseembly Materials Business Unit,TAMURA
KAKEN CORPORATION
Lead & VOC free Sn/Bi-based Conductive Adhesive
which enable low temperature reflow at 160。ノ and excellent electrical conductivity
by soldering.
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| Japanese |
Introduction of High Reliability Leadfree Solder
Paste SN100C P500 D4 and Linear Reflow Profile. |
14:30
 15:00 |
Hideki Yamabe,Tokyo Office Domestic Sales Dept. /Assistant Manager,NIHON
SUPERIOR CO., LTD.
We will offer Linear profile and high reliability
SN100C P500 D4 paste that enables reflow soldering at the equivalent peak
temperature to SAC305
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| Japanese |
Solder paste with low flux spitting. |
15:10
 15:40 |
Kazushi Gotoh,ARAKAWA CHEMICAL INDUSTRIES,LTD FUNCTIONAL MATERIALS
DIVISION,ARAKAWA CHEMICALINDUSTRIES,LTD/SOLDER COAT CO,LTD
A new solder paste. Suppression of flux spitting
was achieved by clarifying the relationship between gas generation and flux
spitting during reflow.
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| Latest Technology Trend for Defect Analysis Rework |
| Japanese |
Example of using digital microscope. Analysis
method and defective measures in manufacturing premise. |
15:50
 16:20 |
kawai kazuo,HIROX Co.,Ltd
Site Review of Soldering Failure Mode Analysis
with MICRO SCOPE
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| Japanese |
Revolutionary IR Technology: Setting the New
Rework Standard (ERSA IR Rework system) |
16:30
 17:00 |
Kanemitsu Arai,Electronic Materials Division Manager,
We will show the advantage of revolutionary Safe
IR Technology produced to handle the every toughest rework applications by
ERSA
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| Latest Situation for Utilizing Inkjet |
| Japanese |
The latest technology of precise liquid control
by Inkjet dispenser etc. |
10:30
 11:00 |
Kazuteru Tomiyama,Business planning dept. Manager,MUSASHI ENGINEERING,
INC.
We introduce the latest technological trend of
precise liquid control in mounting by Inkjet dispenser and Jet dispenser.
there is no necessity for prior reservation |
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| Japanese |
New lineup of the high-densityL TCC subustrate
utilized Ink-jet and thin film technology |
11:10
 11:40 |
Tetsuro Tanaka,WAZAZUKURI Center Next Generation Technology Development
Group,
KOA CORPORATION
New lineup of the high-density LTCC subustrate
utilized Ink-jet and thin film technology
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| English |
'LithoJet™ Inkjet Materials for Electronic Fabrication |
11:50

12:20 |
Thomas Sutter,R&D Director,ROHM AND HAAS ELECTRONIC MATERIALS K.K.
LithoJet™ Series Inkjet Etch Resists provide high resolution and adaptable imaging with lower environmental impact than standard resist processes. LithoJet™
there is no necessity for prior
reservation.
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| English |
Features of Intelligent AOI Model AI-328 |
12:30

13:00 |
Gillad Galor,Gillad Galor,OPTIMA Co., Ltd. OPTIMA Co., Ltd. General Managerr Gilad Galor
Introduction of new concept & Formation
AOI Model AI-328, which is extreamly differ from a general AOI in market
up to today.
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| NPI ヌチキケチィナラタフシヌ。。エツ JPCAShow2007/2007 Microelectronics show /JISSO PROTEC 2007 テ簑タレソ。 タヌヌム
スナチヲヌー。、 スナア箴 PRシシケフウェタヤエマエル.
3 シシシヌ オソステ チヌ狢フ オヌー タヨア カァケョソ。, スナテサ ステソ。エツ チヨタヌヌリ チヨシシソ.オ。コルソゥ テサーュタサ ネクチヌマステエツ ー豼エツ,
ー「 テサーュ スナテサ タ蠑メ(ソャチヲヌマタヌ サ。ーュ ケョタレキホ ウェナクウサ コクタフエツ TEL, FAX, E-mail, URLオ )ソ。 チチ「 ケョタヌヌリ チヨシシソ
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