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| Japanese | Excellent heat resistance low Df Multi-layer PCB material¡¸HIPER R-2125¡¹ |
13:10 13:40 |
Tamiya Hiroki,Electronic Material Division Product Development Group,Matsushita Electric Works, Ltd.
We developed "R-2125" with heat resistance for lead free soldering and higher layer-count PCB and dielectric property for high speed and high volume signal.
TEL: 090-6971-7913 / FAX: 06-6906-1858 / E-mail: hiromi.n@mewe1.mewnet.or.jp |
| Japanese | High heat-resistant film for white printed wiring board ¡ºIBUKI-White¡» |
| 13:50 14:20 |
Jun Matsui,R£¦D Center,MITSUBISHI PLASTICS,INC.
This time,we introduce development status of high heat-resistant white insulation material for LED deployment boards.
TEL: 03-3279-3418 / FAX: 03-3279-6706 / E-mail: sasaki.takashi@mg.mpi.co.jp / URL: http://www.mpi.co.jp |
| Japanese | Ultrathin & high heat resistance multilayer material MCF-5000I series |
| 14:30 15:00 |
Yoshitsugu Matsuura,Printed Wiring Board Material R&D Dept. Printed Wiring Board Materials Div. Staff Researcher,Hitachi Chemical Co.,Ltd
We have developed MCF-5000I series. We will introduce properties of new products with ultrathin, high heat resistance and insulation reliability.
|
| Japanese | High Performance base materials made by Innovative Powder Coating Technology |
| 15:10 15:40 |
Toshio Honda,Product Marketing Department,Electronics Business Division,Atotech Japan K.K.
VIALAM TM Series are high performance base materials for the HDI and IC Packaging industries produced using an exclusive manufacturing method.
there is no necessity for prior reservation. |
| Japanese | Insulating Adhesion Film "ADFLEMA" |
| 15:50 16:20 |
Hidenori Iida,GROUP MANAGER R&D DEPT. TECHNICAL R&D DIV.,NAMICS CORPORATION
ADFLEMA is an insulating thermosetting adhesion
film. It is thin(5~30¥ìm) and the cured film is low ¥å& tan¥ä. We explain that
and future development.
TEL: 025-258-5577 / FAX: 025-258-5511 / E-mail: iida@namics.co.jp / URL: http://www.namics.co.jp |
| Japanese | Latest development of treated rolled copper foil for FPCs |
| 10:30 11:00 |
Atsushi Miki,Development Center,NIPPON MINING & METALS CO., LTD.
Super high flex rolled copper foil for smaller size FPC and new developed surface treatment for HDI FPC will be introdued.
TEL: 03-5573-6555 / FAX: 03-5573-6778 / E-mail: t.moriya@nikko-metal.co.jp |
| Japanese | low stiffness halogen free cover lay. |
| 11:10 11:40 |
HISASHI NIIRA,Manager Technical Section Sheet Materials Department,KYOCERA CHEMICAL Corporation
We will introduce Low stiffness Halogenn free Cover lay.
TEL: 048-225-6846/ FAX: 048-225-0085 / E-mail: webmaster.kcc@kyocera.jp |
| Chinese |
Environment-friendly Flexible Copper Clad Laminate |
| 11:50 12:20 |
Liu Sheng Peng,R&D Engineer,GUANGDONG SHENGYI SCI.TECH CO.,LTD.
Environmental FCCL which correspond to RoHS is excel at dimensional stability, electrical performance and folding endurance. It also excellece of peel strength.
TEL: 03-5520-2512 / FAX:03-6234-3481 / E-mail: negami.utako@sojitz-planet.com / URL: http://www.pla-netcorp.co.jp |
| Japanese | Device Embedding Eechnology, Embedding Active Devices (W-CSP) |
| 12:30 13:00 |
Hiroshi Iinaga,General Manager, R&D,Oki Printed Circuit Co.,Ltd.
The latest update on OKI's device embedding technology shall be presented.
TEL: 03-5282-5171 / FAX: 03-3291-6160 |
| Japanese | Wireless microwave circuits embedded in printed circuit board |
| 13:10 13:40 |
Akira Saitou,Development Technology Dept.,YKC Corporation
We demonstrate wireless circuits embedded in the PCB. Features of smallest size, excellent performance, low cost and accurate design are explained.
TEL: 042-480-6376 / FAX: 042-480-6376 / E-mail: ykc-seminar@ykc-j.com |
| Japanese | Any layer IVH structure high density PCB with cavity "ALIVH-3D" |
| 13:50 14:20 |
Hideki Higashitani,Manager Engineering Group Printed Circuit
Board Business Unit,Panasonic Electronic Devices Co.,Ltd Using conductive paste technology and low fluidity composite material, we have developed high density any layer IVH PCB with cavity (ALIVH-3D)
TEL: 06-6907-4711 / FAX: 06-6906-1605 / URL: http://panasonic.co.jp/ped/ |
| Japanese | The Key Points During Design Process Concerning High Speed Circuit and £Å£Í£Ã Solution by Using the Cutting Edge System ¡±EMC Knowledge Based Assist¡± |
| 14:30 15:00 |
Satoshi Inoue / Tadashi Kubodera,YDC Corpration EDS Div / SDL Corpration This paper will introduce the new system which allow engineers to check EMC problems while designing high speed circuit.
TEL: 042-333-6210 / FAX: 042-352-6103 / URL: http://www.ydc.co.jp/ |
| Japanese | Serious misunderstanding for working on SI and EMI. |
| 15:10 15:40 |
Notimasa ISHITOBI,Representative Director,SONNET GIKEN CO., LTD.
This seminar shows design philosophy for SI and EMC. It points misunderstanding about popular design index, usage of simulator and measurements.
TEL: 043-463-6663 / FAX: 043-463-6773 / E-mail: info@sonnetsoftware.co.jp / URL: http://www.sonnetsoftware.co.jp/product/seminar/jpca2008/ |
| Japanese | The EMI analysis from the printed circuit board for high-speed transmission line |
| 15:50 16:20 |
Chihiro Ueda,Engineering Division,AET,Inc.
We will explain EMI analysis of high speed transmission line, and demonstrate how we analyze radiation characteristic by electromagnetic simulator.
|
| Japanese | Proposal On A Technique To Achieve Higher Speed Transmission And Higher Wiring Capacity At The Same Time in Limited Layer Count |
| 16:30 17:00 |
Takahiro Yagi,Design Solution Department,Oki Printed Circuit Co.,Ltd.
This paper poposes a technique to achieve both higher wiring capacity and higher speed
singnal transmission on high layer PWBs.
TEL: 03-5282-5171 / FAX: 03-3291-6160 |
| Japanese | Toray Engineering recommend best Exposure system. |
| 10:30 11:00 |
Yasunobu Murata,Fine Process Sales Dept. Fine Process Business Unit, Electronics Div.,Toray Engineering Co.,Ltd. Toray Engineering will propose a suitable exposure machine for the user with the improvement of productivity in a flexible substrate.
TEL: 03-3241-1541 / FAX: 03-3241-1553 / E-mail: misa_hayashi@toray-eng.co.jp |
| Japanese | Surface treatment technology of copper foil for FPC |
| 11:10 11:40 |
Hisanori Manabe,R&D Dept. EF Group,FUKUDA METAL FOIL & POWDER CO., LTD.
The effect of the laminate side surface treatment based on the results of peel strength test is in detail explained.
TEL: 03-3275-0316 / FAX: 03-3271-4425 / E-mail: info@fukuda-kyoto.co.jp |
| Japanese | What's Poliamide Etching System? |
| 11:50 12:20 |
Ryo Murachi,Fine Process Sales Dept. Fine Process Business Unit, Electronics Div.,Toray Engineering Co.,Ltd. Applications and deatil of Poliamide Etching System.
TEL: 03-3241-1541 / FAX: 03-3241-1553 / E-mail: misa_hayashi@toray-eng.co.jp |
| English | Fastrise27:Advanced PCB Materisl SoC |
| 12:30 13:00 ¡Ø |
Tom McCarthy,Vice President,Korea Taconic Co.LTD
To address the needs of the high speed and high frequency world of electronics, one of the new PCB materials being developed that is of interest for ATE test fixtures is a new Taconic FastRise 27 teflon based prepreg material.
TEL: 82-31-704-1858(307) / FAX: 82-31-7-4-1857
/ E-mail: bhlee@taconic.co.kr / URL: http://www.taconic.co.kr |
