会场:TOKYO BIG SIGHT 东展示栋、东1大厅·D会场
如果被希望听讲成为每各讲演的申请 请直接询问到各演讲题目下的红文字(TEL，FAX，E-mail，URL等)联络处。
| Japanese | 「Two stage film thickness and cavity substrate printing technology」 |
11:00 12:00 |
Takehiko Murakami, President, Minami Co.,Ltd
We introduce two stage film thickness and
cavity substrate printing technology by our screen printer MK888SV
loading Minami's unique technology "Rotary squeegee unit" and "Pressurizing
system"
TEL: +81-42-354-1881 / FAX: +81-42-354-1883
/ E-mail: general@ho-minami.co.jp
|
| Japanese | 「Trend for compact modular mounters that meet this period of widespread use」 |
| 12:30 13:30 |
Sachimaru Takeno, Manager, Marketing Intelligence, Electronics
Assembly Equipment Division, FUJI Machine Mfg. Co., Ltd. Here is an introduction to the new NXT-2
and the trend for compact modular machines that meet this period of widespread
use while demand increases for high area productivity and improvements
in placement density with the addition of variable amount and type production.
|
| Japanese | 「Cutting edge/High quality JISSO solutions.」 |
| 14:00 15:00 |
Yoshinao Usui, Manger, Mechanical Development Group,Chip
Mounter Development Dept., Design Division, Hitchi High-Tech Instruments Co.,Ltd. Presentation of HITACHI's unique triangle
solution to measure PCB hight and component thickness, and to mount
with Soft mount nozzle for the realization of Cutting edge/High quality
mounting.
E-mail: protec@hti.hitachi-hitec.com
|
| Japanese | 「The latest printing technology for SMD super-downsizing.」 |
| 15:30 16:30 |
Noriaki Mukai, Chief Engineer, SMT Design Department, Electronic
Systems Integration Division, Mechatronics Group, Hitachi Plant Technologies, Ltd. The development of minute making electronic
parts has accelerated. For example, there is a plan that 0201 chips
appear in 2016. From such a background,the amount of solder when parts
are mounted will be connected by a slight amount. The thickness of
the mask is also thin. And stencil open caliber advances toward the
direction of making to narrowness. It introduces the latest printing
technologies corresponding to such a background.
TEL: +81-3-3516-7931 / FAX: +81-3-3516-7933
/ E-mail: yuji.ono.tz@hitachi-pt.com
|
| Japanese | 「Fuji mixed loading placement initiative」 |
| 11:00 12:00 |
Hiroyuki Ao, Senior Engineer Leader, Marketing Intelligence,Electronics
Assembly Equipment Division, FUJI Machine Mfg. Co., Ltd. Semi-conductor mixed loading placement
(such as bare die) is becoming widespread, along with a change to high
functionality of compact mobile equipment which began with cellular
phones. Here is an introduction to Fuji's own initiative regarding
this trend.
|
| Japanese | 「Optimization of shop floor by production support system」 |
| 12:30 13:30 |
Takashi NISHIMURA, Manager, Sales Engineering Group, Sales
Dept. Electronic Assembly & Test Systems Div. JUKI CORPORATION The mounter seen as modular unit will be
reviewed as a production facility of the floor, and we propose re-optimization
of the entire factory by the optimization of the whole floor.
Please remind that participans
are limited.
|
| Japanese | 「The SMT Line Aiming Total Productivity」 |
| 14:00 15:00 |
Kouki SUGIUCHI, Electronics Assembly Systems, Siemens K.K. Introducing Siemens approach for high
quality PCB assembly though process of data preparation to managing
equipments coping with faster NPI and high mix low volume production.
TEL: +81-3-5798-2311 / FAX: +81-3-5798-2323
/ E-mail: siplace.jp@siemens.com
|
| Japanese | 「3D solder paste inspection in high density SMT line」 |
| 15:30 16:30 |
Norihiko Masuda, Development Department Project Team, ANRITSU PRECISION CO., LTD. Introduction of MK5420A Sollead Solder
Paste Inspector and its application & functions for quality control
of SMT boards in our some customer's SMT line
TEL : +81-46-296-6715 / FAX: +81-46-296-6777
/ E-mail: Mitsuo.Okuda@anritsu.com
|
| Japanese | 「Next generation Compact High-speed modular 」 |
| 11:00 12:00 |
Naoki Hanamura, Manager, Mounter engineering div. YAMAHA Motor Co., Ltd. Flexible, Agilable, High-productive "YS12/YG12" based
on boosted [Module Concept : Save-space, General-purpose, Line-combination oriented] suggests
evolving"MONO-ZUKURI".
Please remind that participans
are limited.
|
| Japanese | 「Next-generation JISSO System "APC80" 」 |
| 12:30 13:30 |
Masanori Hiyoshi, Electronic Component Mounting Systems & Solution
Business Unit Panasonic Factory Solutions Co., Ltd. JISSO technology trends and explanations
of wireless communication products such as mobile phones as well as
Panasonic Factory Solutions' work
Please remind that participans
are limited.
|
| Japanese | 「High-Speed Operation of Solder Paste Printer」 |
| 14:00 15:00 |
Masaharu Fujii, Chief clerk, Solder Printer Sect. Process
Equipment Dept., Sony Manufacturing Systems Corporation Achievement of high-speed print by high-speed
cleaning
TEL: +81-480-23-1250
|
