Until Jun 11,2008,
it is days more
it is days more
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>>> Outline|Shows Profile|Shows Exhibits Range|2008 Special Exhibition Corner|Schedule at a glance|Floor layout|HOME
| To promote effective exhibition, the show site will be structured by the following 6 Exhibition-classifications. |
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| JPCA Show 2008 Electronic Circuits EXPO 2008 |
| Rigid-type PWBs, Build-up MLBs, Flexible Circuits, Flex-Rigid Circuits, Ceramic PWBs, Metal Core Printed Board, Embeded Passive Substrate, Rigid Module Board, TAB/COF, Ceramic Module Board, TCP, Applications Products used by FPCs (FPD Module, Drive Module, etc.),Base Material for Rigid-type Boards, Film/Tape Materials, Electronic Circuits related Publications, Information, Services, etc. |
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| JPCA Show 2008 Electronic Circuists Process EXPO 2008 |
| PWB Manufacturing Process Materials (Chemicals, Ink, Film, etc.) and Equipment, Fabrication related Equipment and Materials. Flexible Circuit Manufacturing Process Materials and Equipment, Fabrication related Equipment and Materilals, Special Die, Punching/Auto-cutter machines, Electronic Circuits Manufacturing Process Materials and Equipments. |
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| JPCA Show 2008 DES (Design and mfg. Engineering Solutions) EXPO 2008 |
| Application Soft Wear, Electronic Circuits Design, System Consultation Service,
EMS/ODM Business, Communication Network Solution, Internet Solution, Multimedia System Solutions, CAE Tools (CAD/CAM/CIM), Product Design Technology, Hard Wear Design, Model Development System, Molding, Rapid Prototyping System, DES related Publications, Information, Services, etc. |
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| JPCA Show 2008 MicroTEST (Testing/Inspection and Analysis Exhibition) 2008 |
| Electronic Board & Electronic Circuits Testing/Inspection System, Image
Controller/Recognition System, 3-D Measuring Equipment, Analyzers, Special
Tools for Testing and Measuring/Inspection System, Test/Inspection Business, Sensing Imaging Technology, Virtual Reality Technology, etc. |
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| Microelectronics Show 2008 (22nd Advanced Electronics Packaging Exhibition) |
| Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc. |
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| JISSO PROTEC 2008 (10th Jisso Process Technology Exhibition) |
| Application Products with Electronic Components Mounting Machines and Related Equipment/Systems PCB Assembly and Related Equipment/Systems, emiconductor Mounting Equipment/Systems, Inspection and Testing Equipment, Electronic Packaging Design Systems, Electronic Packaging Devices/Components and Related Materials, Electronic Manufacturing Device Packaging Materials, Electronic Packaging/Joint Systems, High Frequency Rces/Components and Materials, Environmental Related Equipment and components and Materials , Publications, etc. |
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