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Outline

Exhibition name

Sponsored by:
JPCA-Japan Electronics Packaging and Circuits Association
▼ will be formed by the following 4 exhibitions
Electronic Circuits EXPO 2008 NEW
Electronic Circuits Process EXPO 2008 NEW
DES (Design and manufacturing Engineering Solution) EXPO 2008
MicroTEST (Testing/Inspection and Analysis Exhibition) 2008

Sponsored by：
Japan Institute of Electronics Packaging
Sponsored by：
Japan Robot Association

Objective

The Triple Collaboration of // is the industry’s own- and only-organized effort to create a reasonable, targeted and fair event with the solution network for electronics manufacturing. The purpose of the events are to be held for the creation of a venue featuring latest Rigid-type PWB Technolo gies, Flexible Circuits, Design and Manufacturing/Engineering Solutions, Testing/Inspection and Analysis, Electronics Packaging (Jisso) and SMT fields in Electronic Circuits industry originating both Japan and
overseas, and to provide valuable information today’s customers require, and create great opportunities for new business. To contribute to the further development of Electronic Circuits industries, academic fields and enhance manufacturing efficiency and maximize profits.

Duration

Wednesday, June 11 - Friday, June 13, 2008

Place

Tokyo Big Sight (Tokyo International Exhibition Center)

Theme


～Electronic Circuits and Packaging Technologies Exhibitions Creating Cutting-Edge Products～

Event Features

*Keynote Address Lectures (June11- June 13, 2008)
*JIEP Advanced Electronics Packaging (Jisso) Technology Symposium
*JIEP R&D Open Seminars
*NPI (New Product Introduction) Presentation (Exhibitors Seminar)
*The 4th JPCA Award
*Open Seminars at Show Floor
*Academic Facilities & Laboratories Poster Program
*Electronics Handicraft Class
*Educational Event
*Electronic Circuits Plaza (Special PR Corner for Electronic Circuits) - JPCA Member Only
*IC Packaging/PWB Road Map Seminar
*International Conference/Meetings···And MORE!!

Overseas Assistance

World Electronic Circuits Council (WECC) Member Associations:CPCA (China Printed Circuit Association),EIPC (European Institute of Printed Circuits), HKPCA (Hong Kong Printed Circuit Association),IPC (IPC-Association Connecting Electronics Industries), IPCA (Indian Printed Circuit Association),KPCA (Korea Printed Circuit Association),TPCA (Taiwan Printed Circuit Association)

Supporting Organizations

Automatic Identification Manufacturer,Camera and Imaging Products Association,Copperfoil Industries Association,Federation of Electro Plating Industry Association,Information Processing Society of Japan,Japan Amusement Machinery Manufacturers Association,Japan Analytical Instruments Manufacturers Association,Japan Association of Medical Equipment Industries,Japan Association of Rapid prototyping Industry,Japan Auto Parts Industries Association,Japan Business Machine and Information System Industries Association,Japan Chemical Industry Association,Japan Die & Mold Industry Association,Japan Electric Measuring Instruments Manufacturers' Association,Japan Electrical Insulating & Advanced Performance Materials Industrial Association, Japan Electrical Safety & Environment Technology Laboratories,Japan Electrical Wiring Devices and Equipment Industries Association,Japan Electronics and Information Technology Industries Association,Japan Fine Ceramics Center,Japan Fire Alarms Manufacturers' Association,Japan Game-Associated Enterprise Corporation,Japan Heat Treatment Trade Association of Japan,Japan Information Technology Services Industry Association,Japan Luminairer Association,Japan Measuring Instruments Federation,Japan Medical Devices Manufacturers' association,Japan Medical-Optical Equipment Industry Association,Japan Optical Measuring Instruments Manufacturers Association,Japan Plating Suppliers Association,Japan Precision Measuring Instruments Association,Japan Solvent Recycling Industry Association,Japan Surfactant Industry Association,Japan Testing Machinery Association,Japan Thermosetting Plastics Industry Association,Japan Vacuum Industry Association, Micromachine Center,National Institute of Advanced Industrial Science and Technology,National small business Information promotion Center,National Space Development of Japan,Nippon Electric Control Equipment Industries Association,Optoelectronic Industry & Technology Development Association,Reliability Center for Electronic Components of Japan,Semiconductor Equipment Association of Japan,Technology Institution of Industrial Safety,The Ceramic Society of Japan,The Industries Association of Radiological Systems,The Institute of Electrical Engineers of Japan, The Institute of Electrical Inatallation Engineers of Japan,The Institute of Electronics,Information and Communication Engineers,The Institute of Image information and television engineers,The Institute of Image Electronics Engineers of Japan,The Japan Bearing Industrial Association,The Japan Electrical Manufacturers' Association,The Japan Machinery Federation,The Japan Society for Analytical Chemistry,The Japan Society of Industrial Machinery Manufacturers,The Japan Welding Engineering Society,The Japanese Electric Wire & Cable Makers' Association,The Photo-Sensitized Materials Manufacturers' Association,The Society of Automotive Engineers of Japan,The Surface Finishing Society of Japan,The Vacuum Society of Japan,Tron association,AEEMA, GFIE, VdL, SMCBA, SMTA(expected)

In Cooperation with

The Chemical Daily Co., Ltd.,CircuiTree, Kogyo Chosakai Publishing Co.,Ltd., Sangyo Times, Inc., Electronic Journal, Dempa Publications, Inc., The Nikkan Kogyo Shimbun Ltd., Nikkei Business Publications, Inc., The Nikkan kogyo Shimbun, Inc., The Japan Industrial Journal, Inc., Printed Circuit Journal Co., Ltd., DM Card Japan Co., Ltd., DigiTimes, Electronique International, Emerald Group Publishing, PCB 007,PC FAB, Printed Circuit News (expected)

Managed by

JPCA-Japan Electronics Packaging and Circuits Association

Admission

1,000 Yen (Tax included. A bearer of the invitation card is not charged)