Place : East Hall 1F,Room D
And, ask directly in each attendance application point (in such cases as URL that it sends FAX and E-mails it) when it hopes for the attendance.
| Japanese | [Two stage film thickness and cavity substrate printing technology] |
11:00 12:00 |
Takehiko Murakami, President, Minami Co.,Ltd.
We introduce two stage film thickness and cavity substrate printing technology by our screen printer MK888SV loading Minami's unique technology "Rotary squeegee unit" and "Pressurizing system"
TEL: +81-42-354-1881 / FAX: +81-42-354-1883
/ E-mail: general@ho-minami.co.jp |
| Japanese | [Trend for compact modular mounters that meet this period of widespread use] |
| 12:30 13:30 |
Sachimaru Takeno, Manager, Marketing Intelligence, Electronics
Assembly Equipment Division, FUJI Machine Mfg. Co., Ltd. Here is an introduction to the new NXT-2 and the trend for compact modular machines that meet this period of widespread use while demand increases for high area productivity and improvements in placement density with the addition of variable amount and type production.
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| Japanese | [Cutting edge/High quality JISSO solutions.] |
| 14:00 15:00 |
Yoshinao Usui, Manger, Mechanical Development Group,Chip Mounter
Development Dept., Design Division, Hitchi High-Tech Instruments Co.,Ltd. Presentation of HITACHI's unique triangle solution to measure PCB hight and component thickness, and to mount with Soft mount nozzle for the realization of Cutting edge/High quality mounting.
E-mail: protec@hti.hitachi-hitec.com |
| Japanese | [The latest printing technology for SMD super-downsizing.] |
| 15:30 16:30 |
Noriaki Mukai, Chief Engineer, SMT Design Department, Electronic
Systems Integration Division, Mechatronics Group, Hitachi Plant Technologies, Ltd. The development of minute making electronic parts
has accelerated. For example, there is a plan that 0201 chips appear in 2016.
From such a background,the amount of solder when parts are mounted will be
connected by a slight amount. The thickness of the mask is also thin. And stencil
open caliber advances toward
the direction of making to narrowness. It introduces the latest printing technologies
corresponding to such a background.
TEL: +81-3-3516-7931 / FAX: +81-3-3516-7933
/ E-mail: yuji.ono.tz@hitachi-pt.com |
| Japanese | [Fuji mixed loading placement initiative] |
| 11:00 12:00 |
Hiroyuki Ao, Senior Engineer Leader, Marketing Intelligence,Electronics
Assembly Equipment Division, FUJI Machine Mfg. Co., Ltd. Semi-conductor mixed loading placement (such as bare die) is becoming widespread, along with a change to high functionality of compact mobile equipment which began with cellular phones. Here is an introduction to Fuji's own initiative regarding this trend.
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| Japanese | [Optimization of shop floor by production support system] |
| 12:30 13:30 |
Takashi NISHIMURA, Manager, Sales Engineering Group, Sales Dept.
Electronic Assembly & Test
Systems Div. JUKI CORPORATION The mounter seen as modular unit will be reviewed as a production facility of the floor, and we propose re-optimization of the entire factory by the optimization of the whole floor.
Please remind that participans are limited. |
| Japanese | [The SMT Line Aiming Total Productivity] |
| 14:00 15:00 |
Kouki SUGIUCHI, Electronics Assembly Systems, Siemens K.K. Introducing Siemens approach for high quality
PCB assembly though process of data preparation to managing equipments coping
with faster NPI and high mix low volume production.
TEL: +81-3-5798-2311 / FAX: 03-5798-2323
/ E-mail: siplace.jp@siemens.com |
| Japanese | [3D solder paste inspection in high density SMT line] |
| 15:30 16:30 |
Norihiko Masuda, Development Department Project Team, ANRITSU PRECISION CO., LTD. Introduction of MK5420A Sollead Solder Paste Inspector and its application & functions for quality control of SMT boards in our some customer's SMT line
TEL :046-296-6715 / FAX: 046-296-6777
/ E-mail: Mitsuo.Okuda@anritsu.com |
| Japanese | [Next generation Compact High-speed modular ] |
| 11:00 12:00 |
Naoki Hanamura, Manager, Mounter engineering div. YAMAHA Motor Co., Ltd. Flexible, Agilable, High-productive "YS12/YG12" based on boosted [Module Concept : Save-space, General-purpose, Line-combination oriented] suggests evolving "MONO-ZUKURI".
Please remind that participans are limited. |
| Japanese | [Next-generation JISSO System "APC80" ] |
| 12:30 13:30 |
Masanori Hiyoshi, Electronic Component Mounting Systems & Solution Business Unit Panasonic Factory Solutions Co., Ltd. JISSO technology trends and explanations of wireless communication products such as mobile phones as well as Panasonic Factory Solutions' work
Please remind that participans are limited. |
| Japanese | [High-Speed Operation of Solder Paste Printer] |
| 14:00 15:00 |
Masaharu Fujii, Chief clerk, Solder Printer Sect. Process Equipment
Dept., Sony Manufacturing Systems Corporation Achievement of high-speed print by high-speed cleaning
TEL: +81-480-23-1250 |
