Place : NPI Presentation Room A.B.C , East Hall 1F,TOKYO BIG SIGHT( 80 seats capacity per Room).
When you attend a presentation, you confirm a timetable, and ask for a way to confirm about each presentation application. And, ask directly in each attendance application point (in such cases as URL that it sends FAX and E-mails it) when it hopes for the attendance.
| English (Japanese interpretation) |
Via2 - Laser Embedded Conductor technology |
12:30 13:00 |
Dave Baron, Director of Technology
Strategy and Strategic Marketing, Atotech Germany GmbH, Atotech Japan K.K.
A revolutionary production process for ultra high density IC Substrates-Plating, circuitization and final product electrical performance is the focus. there is no necessity for prior reservation. |
| Japanese | "Sterling" immesion silver plating process for PWB final finish |
| 13:10 13:40 |
Noritoshi Ikeda, R&D TEAM, NIPPON MACDERMID CO.,LTD. We
introduce Sterling process of immersion silver plating as PWB final finish,
which has the excellent solderability.
TEL: 044-820-1180 / FAX: 044-812-4485 / E-mail: nishukeisuke@macd.co.jp |
| Japanese | Through Hole Filling technology with Uniplate System |
| 13:50 14:20 |
Toshiya Fujiwara, Chief, Product Marketing Department, Electronics
Business Division, Atotech Japan K.K. This paper presents through hole filling technology
with Uniplate system. This technology enables to reduce process cost and
steps significantly.
there is no necessity for prior reservation. |
| Japanese | Electroless Ni-P/Pd/Au plating process[TOP NPG PROCESS] |
| 14:30 15:00 |
Yasuhiro Tanabe, R&D Laboratory,Metal Finishing,OKUNO CHEMICAL
INDUSTRIES CO.,LTD., OKUNO CHEMICAL INDUSTRIES CO.,LTD. We wish to
introduce electroless Ni-P/Pd/Au plating process "Top NPG Process" which
gives excellent solder bonding effect and Au wire bonding reliability at
Au plating technology on packaging board.
TEL: 06-6965-4111 / FAX: 06-6963-0740 / E-mail: y-tanabe01@okuno.co.jp / URL: http://www.okuno.co.jp/ |
| Japanese | New generation Lead free final finish (Melplate Ni/Pd/Au process) |
| 15:10 15:40 |
Kazutaka Tajima, Research & Development 1st. LAB., MELTEX
INC.
Regulation is enforced by the environmental issue
such lead. We developed new completely lead-free final finish that can give
many advantages.
|
| Japanese | Updated UL requirements for PWBs and reliability evaluation techique and failure analysis of PCBs. |
| 15:50 16:20 |
Tamae Takahashi / Saburo Osawa, Director / SMT Evaluation Group
Manager, Director / SMT Evaluation Group Manager, Chemitox, Inc. Updated UL requirement, reliability evaluation
technique and failure analysis for PCBs and SMT.
TEL: 03-3727-7111 / FAX: 03-3728-1710 / E-mail: hi-yamaguchi@chemitox.co.jp / URL: http://www.chemitox.co.jp |
| Japanese | Reliability Testing Technique of Printed-circuit-board |
| 16:30 17:00 |
Hirokazu Tanaka, Thechnical Development Headquarters, ESPEC CORP.
We report reliability test technology for the
problem of the PCB. As the reported test case, it is a connection and insulation
reliability test.
TEL: 06-6358-4751 / FAX: 06-6358-5176 / E-mail: k-gotou-c@espec.co.jp |
| Japanese | DryFilm for Laser Direct Imaging [Riston® LUV series] |
| 10:30 11:00 |
Amane Aoyagi, Senior Research Chemist, Product Development Group,
DuPont MRC DryFilm Ltd.
[Riston® LUV series] are LDI
DryFilms with high sensitivity and resolution. Their properties and applications
will be introduced
in this presentation.
TEL: 03-5521-2400 / FAX: 03-5521-2401 / E-mail: toiawase.dmdf@mrg.mrc.co.jp / URL: http://www.dmdf.jp/ |
| Japanese | Recent action of direct imaging Dry Film Resist. |
| 11:10 11:40 |
Youichiroh IDE, Electronics Interconnecting Materials Technology & Development
Dept. Manager, ASAHI KASEI EMD CORPORATION Introducing our developmental status and our future vision.
TEL: 03-6911-2875 / FAX: 03-6911-2748 / E-mail: yamaguchi.tcg@om.asahi-kasei.co.jp |
| Japanese | Photosensitive Dry Film Resists for Direct Imaging |
| 11:50 12:20 |
Masahiro Miyasaka, Electronic Materials R&D Center, Resercher,
Hitachi Chemical Co., Ltd.
Photosensitive dry film resists for direct imaging
will be introduced. Dry film for fine package will be focused on.
|
| Japanese | Development of Dry Film Solder Mask |
| 12:30 13:00 |
yoshiaki honma, Sales and Marketing Department, Nichigo-Morton
Co., Ltd.
Introduction of Dry Film Solder Resist instead of conventional liquid type for response to the trend of thinner PWB.
TEL: 0495-77-4496 / FAX: 0495-77-0434 / E-mail: yhonma@nichigo-morton.co.jp |
| Japanese | Technology for Enhanced Etching |
| 13:10 13:40 |
Tadashi Hirakawa, Currentec Inc., Currentec Inc.
Impulse Etching technology combined with additives drastically enhances etch factor in fine features. Vacuum etching technology improves uniformity.
TEL: 03-3728-9298 / FAX: 03-3728-9287 / E-mail: contact@currentec.co.jp / URL: http://www.currentec.co.jp |
| English | Technology for Enhanced Etching |
| 13:50 14:20 |
Marcus Lang, Managing Director,
LP Chemie, LP Chemie GmbH & Co., KG
Impulse Etching technology combined with additives drastically enhances etch factor in fine features. Vacuum etching techonlogy improves uniformity. TEL: 03-3728-9298 / FAX: 03-3728-9287 / E-mail: contact@currentec.co.jp / URL: http://www.currentec.co.jp |
| Japanese | Intelligent Etching compensation system "DynaFLEX" |
| 14:30 15:00 |
Rikio Nagai, Technical Manager, Dynatron Co.,Ltd
DyanaFLEX compensates design data atutomatically
for Copper Etching process with Line, Pads, Gold finger and other attribute.
TEL: 03-3940-9081 / FAX: 03-3940-9080 / E-mail: support@dynatron.co.jp / URL: http://www.dynatron.co.jp |
| Japanese | Surface treatment agent and the technology for high-end interconnection. |
| 15:10 15:40 |
Akihiro Aiba,
Electronic Materials Company Isohara Works Innovative
Materials Development Center Senior Engineer, NIPPON MINING & METAL CO.,
LTD.
We introduce surface treatment agent and the technology for various metals for high-end interconnection.
TEL: 03-5573-6584 / FAX: 03-5573-6778 / E-mail: I.chizak@nikko-metal.co.jp |
| Japanese | Possibility of the high efficiency and long life light source "Milti Lamp System(MLS)" |
| 15:50 16:20 |
Hiroyuki Imai, General Manager of Engineering Division, ADTEC
Engineering Co., Ltd.
Introduction of the possibility of Multi Lamp
System(MLS) with high efficiency and long life features for exposing of printed
circuit board.
TEL: 03-3433-4466 / FAX: 03-3433-4330 / E-mail: sales@adtec-eng.co.jp |
| Japanese | State-of-the-art Solder Resist Exposure |
| 16:30 17:00 |
Kenichi Sudo, Group Leader, Equipment Desining Department, Equipment
Company, ORC MANUFACTURING CO., LTD. By the new model of Direct Imaging System, "Di
IMPACT", we offer the solution to solder resit exposure for higher density & finner
electric circuits.
E-mail: npi-jpca2008@orc.co.jp |
| Japanese | Plasma Surface Treatment System "TAIKAI" and Examples of Its Use |
| 10:30 11:00 |
Hiroyuki Ueyama, Manager. 2nd Engineerring Section
Research & Development Headquarters, EBARA-UDYLITE CO., LTD. Presentation of the examples of surface treatment
in the use of our Plasma System "TAIKAI" and suggestions in light
of reducing environmental burden.
TEL: 03-3835-2951 / FAX: 03-3836-9264 / E-mail: hamachi.yuma@eu.ebara.com |
| Japanese | HOLE PLUGGING INK REMOVAL |
| 11:10 11:40 |
JUNICHI KOTANI, MACHINERY DIVISION ,TOKYO BRANCH , SECTION HEAD, ISHIIHYOKI CO., LTD. Recently, hole plugging ink removal is important
process for reliability improvement of materials. So, we will introduce about
this process.
TEL: 03-3939-6845 / FAX: 03-5383-7231 / E-mail: machinery@ishiihyoki.co.jp |
| Japanese | Analysis of Drilling Mechanism and Development in Micro-Mechanical Drilling |
| 11:50 12:20 |
Hidehito Watanabe, Engineering R&D Depatment Drilling Tool
Development Section, UNION TOOL CO, Analysis of micro
drills' drilling mechanism and effects on hole quality. Focusing on breakage,
examination of new product development is presented.
TEL: 0258-22-2620 / FAX: 0258-22-0246 / E-mail: watnabeh@uniontool.co.jp / URL: http://www.uniontool.co.jp |
| English/ Japanese |
Flexible drilling and routing solutions |
| 12:30 13:00 |
Martin Hillenbrand /Ryo Akutsu, Marketing and Sales Manger Asia, Schmoll Maschinen GmbH/ Sanko Giken Kogyo Introduction of a new machine series which
is customized for flexible production requirements like different drill
bit diameters (flexible spindles), small and large lot sizes, short set
up time, automation conceptsc
E-mail: NPI@sgk-sanko.co.jp |
