We developed "R-2125" with heat resistance for lead free soldering and higher layer-count PCB and dielectric property for high speed and high volume signal.

TEL: 090-6971-7913 / FAX: 06-6906-1858 / E-mail: hiromi.n@mewe1.mewnet.or.jp

This time,we introduce development status of high heat-resistant white insulation material for LED deployment boards.

TEL: 03-3279-3418 / FAX: 03-3279-6706 / E-mail: sasaki.takashi@mg.mpi.co.jp /
URL: http://www.mpi.co.jp

We have developed MCF-5000I series. We will introduce properties of new products with ultrathin, high heat resistance and insulation reliability.

URL: http://www.hitachi-chem.co.jp

VIALAM TM Series are high performance base materials for the HDI and IC Packaging industries produced using an exclusive manufacturing method.

there is no necessity for prior reservation.

ADFLEMA is an insulating thermosetting adhesion film. It is thin(5~30μm) and the cured film is low ε& tanδ. We explain that and future development.

TEL: 025-258-5577 / FAX: 025-258-5511 / E-mail: iida@namics.co.jp / URL: http://www.namics.co.jp

Super high flex rolled copper foil for smaller size FPC and new developed surface treatment for HDI FPC will be introdued.

TEL: 03-5573-6555 / FAX: 03-5573-6778 / E-mail: t.moriya@nikko-metal.co.jp

We will introduce Low stiffness Halogenn free Cover lay.

TEL: 048-225-6846/ FAX: 048-225-0085 / E-mail: webmaster.kcc@kyocera.jp

Environmental FCCL which correspond to RoHS is excel at dimensional stability, electrical performance and folding endurance. It also excellece of peel strength.

TEL: 03-5520-2512 / FAX:03-6234-3481 /
E-mail: negami.utako@sojitz-planet.com / URL: http://www.pla-netcorp.co.jp

The latest update on OKI's device embedding technology shall be presented.

TEL: 03-5282-5171 / FAX: 03-3291-6160

We demonstrate wireless circuits embedded in the PCB. Features of smallest size, excellent performance, low cost and accurate design are explained.

TEL: 042-480-6376 / FAX: 042-480-6376 / E-mail: ykc-seminar@ykc-j.com

Using conductive paste technology and low fluidity composite material, we have developed high density any layer IVH PCB with cavity (ALIVH-3D)

TEL: 06-6907-4711 / FAX: 06-6906-1605 / URL: http://panasonic.co.jp/ped/

This paper will introduce the new system which allow engineers to check EMC problems while designing high speed circuit.

TEL: 042-333-6210 / FAX: 042-352-6103 / URL: http://www.ydc.co.jp/

This seminar shows design philosophy for SI and EMC. It points misunderstanding about popular design index, usage of simulator and measurements.

TEL: 043-463-6663 / FAX: 043-463-6773 / E-mail: info@sonnetsoftware.co.jp /
URL: http://www.sonnetsoftware.co.jp/product/seminar/jpca2008/

We will explain EMI analysis of high speed transmission line, and demonstrate how we analyze radiation characteristic by electromagnetic simulator.

TEL: 044-980-0505 / FAX: 044-980-1515 / E-mail: info@aetjapan.com /
URL: http://www.aetjapan.com

This paper poposes a technique to achieve both higher wiring capacity and higher speed singnal transmission on high layer PWBs.

TEL: 03-5282-5171 / FAX: 03-3291-6160

Toray Engineering will propose a suitable exposure machine for the user with the improvement of productivity in a flexible substrate.

TEL: 03-3241-1541 / FAX: 03-3241-1553 / E-mail: misa_hayashi@toray-eng.co.jp

The effect of the laminate side surface treatment based on the results of peel strength test is in detail explained.

TEL: 03-3275-0316 / FAX: 03-3271-4425 / E-mail: info@fukuda-kyoto.co.jp

Applications and deatil of Poliamide Etching System.

TEL: 03-3241-1541 / FAX: 03-3241-1553 / E-mail: misa_hayashi@toray-eng.co.jp

To address the needs of the high speed and high frequency world of electronics, one of the new PCB materials being developed that is of interest for ATE test fixtures is a new Taconic FastRise 27 teflon based prepreg material.

TEL: 82-31-704-1858(307) / FAX: 82-31-7-4-1857 /
E-mail: bhlee@taconic.co.kr / URL: http://www.taconic.co.kr