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| 보다 효과적인 전시를 촉진하기 위하여 전시회장은 다음의 6가지 분류로 구성됩니다. |
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| Rigid-type PWBs, Build-up MLBs, Flex-Rigid Circuits, Base Materials for Rigid-type Boards, PWB Manufacturing Process Materials (Chemicals, Ink, Film, etc.) and Equipment, Fabrication related Equipment and Materials, PWB Technology related Publications, Information, Services, etc. |
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| Flexible Circuits, Multi-layered FPC, TAB, COF, TCP, Applications Products used by FPCs (FPD Module, Drive Module, etc.), Film/Tape Materials, Flexible Circuit Manufacturing Process Materials and Equipment, Fabrication related Equipment and Materials, Special Die, Punching/Auto-cutter machines, FPC related Publications, Information, Services, etc. |
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| Application Soft Wear, Electronic Circuits Design, System Consultation Service, EMS/ODM Business, Communication Network Solution, Internet Solution, Multimedia System Solutions, CAE Tools (CAD/CAM/CIM), Product Design Technology, Hard Wear Design, Model Development System, Molding, Rapid Prototyping System, DES related Publications, Information, Services, etc. |
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Electronic Board & Electronic Circuits Testing/Inspection System, Image Controller/Recognition System, 3-D Measuring Equipment, Analyzers, Special Tools for Testing and Measuring/Inspection System, Test/Inspection Business, Sensing Imaging Technology, Virtual Reality Technology, etc. |
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| Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc. |
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| Application Products with Electronic Components Mounting Machines and Related Equipment/Systems, PCB Assembly and Related Equipment/Systems, Semiconductor Mounting Equipment/Systems, Inspection and Testing Equipment, Electronic Packaging Design Systems, Electronic Packaging Devices/Components and Related Materials, Electronic Manufacturing Device Packaging Materials, Electronic Packaging/Joint Systems, High Frequency Responding Devices/Components and Materials, Environmental Related Equipment and Components and Materials, Publications, etc. |
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입장자님에게의 안내
