E-mails it) when it hopes for the attendance.
|
| Place:NPI Presentation Room A·B·C , East Hall 1F , TOKYO BIG SIGHT( 80 seats capacity per Room). |
| When you attend a presentation, you confirm a timetable,
and ask for a way to confirm about each presentation application. And,
ask directly in each attendance application point (in such cases as URL
that it sends FAX and E-mails it) when it hopes for the attendance. |
|
|
|
Wed., May 30
|
| The Latest Technology Trend for Testing, Inspecting and Analysys |
|
|
|
Japanese
|
Measurement of Copper Oxide Film by SERA Method |
|
12:30
 13:00 |
Masatsune Suzuki,3rd Sales Division SERA Specialist,Cermatronics Boeki Co., Ltd. |
| Copper oxide film has been watched as new theme in complicated and progressed assebly boards. This will be more important in future. | |
TEL:03-3863-6812 FAX:03-3863-6815E-mail:hiroseino@cerma.co.jp http://www.cerma.co.jp |
|
|
Japanese
|
Update information regarding reliability evaluation technique and UL related with PCBs |
|
13:10
 13:40 |
Osawa Saburo,SMT Evaluation Group Manager,Chemitox, Inc. |
| Update information will be presented related with PCBs such as reliability, environmental requirement and UL to comply with various needs. | |
| TEL:03-3727-7111FAX:03-3728-1710E-mail:s-osawa@chemitox.co.jp URL://www.chemitox.co.jp |
|
|
|
Japanese
|
Potentiality for image processing in 64 bit environment on PC |
|
13:50
14:20 |
Takeaki Higashida,Planning Department Inspection & Innovation Division,HiNSTEC Co.,Ltd |
| The potentiality and primacy of the final visual inspection system with 64 bit environment and actual examples of comparison with 32 bit | |
| TEL:03-3537-1901FAX:03-3537-1902E-mail:higashida@hinstec.co.jp |
|
|
|
Japanese
|
The latest application of X-ray imaging technology to highly packed PWB. |
|
14:30
15:00 |
Akira Hirakimoto,Ph.D., Patent Attorney General Manager of Non-Destructive Inspection Business Unit, Shimadzu Corp.,SHIMADZU CORPORATION |
| The latest application of the non-destructive inspection for highly packed PWB will be introduced with novel X-ray Fluoroscopic and CT system | |
| Please come to the Presentation Room. |
| The Latest Technology trend for Design and mfg.. Engineering Solution |
|
|
|
Japanese
|
Introduction of workflow system in the printed circuit board manufacturing process |
|
15:10
15:40 |
Kimitishi Yoshino,Software Ten-nines Company, Image Processing, Inspection and Measurement Software Development Department ,DAINIPPON SCREEN MFG. CO., LTD. |
| Introduction of the workflow that achieves an improvement of quality, productivity, and cost reduction by information management and feedback. | |
| TEL:075-934-8103FAX:075-931-1285E-mail:pwbinfo@screen.co.jp |
|
|
|
Japanese
|
Introducing New Solution for Board Manufacturing Design -- DFM Center is the ideal and the most suitable solution which can be adopted for any kinds of board technology and a whole processes of board manufacturing. -- |
|
15:50
16:20 |
Koji Yamamoto,R&D Division / DFM Section Manager / SENIOR PARTNER,ZUKEN Inc. |
| Latest solution for board manufacturing design for better QCDE in diverse manufacturing processes. Experience our innovative environment, solve all issues in board manufacturing processes. | |
| TEL:045-942-1912FAX:045-942-7350E-mail:zuken-eda@zuken.co.jp http://www.zuken.co.jp |
|
|
|
Japanese
|
Business Process Innovation of PCB Design Verification by PollEX |
|
16:30
17:00 |
Tetsuya Goto,Sun Hue Huh,Group Leader of NSSolutions Industrial
System Solution I , CEO of Polliwog,NS Solutions Corp. Polliwog Corporation |
| Innovative work process of PCB design review utilizing "PollEx",design verification system adapted to mutli CAD data. | |
| TEL:03-5117-6028FAX:03-5117-7014 https://www.ns-sol.co.jp/form/product/index.html |
|
Thur., May 31
|
| The Latest Inspection
and Measurement Technology Trend for High Reliability |
|
|
|
Japanese
|
The latest X-ray inspection technology |
|
10:30
11:00 |
Akira Hirakimoto,Ph.D., Patent Attorney General Manager of Non-Destructive Inspection Business Unit, Shimadzu Corp.,SHIMADZU CORPORATION |
| The latest application of the non-destructive inspection will be introduced with novel X-ray Fluoroscopic and CT system. | |
| Please come to the Presentation Room. |
|
|
|
English
|
Fast Moire Interferometry™ Technology for FC-Substrate Roadmap |
| 11:10
11:40 |
Jean-Levy Beaudoin,Product Manager - Substrate Inspection,SolVision |
| SolVision will present the mechanics of FMI technology's 3D data acquisition and explain how it can be applied to current & future flip-chip inspection requirements. | |
| TEL:+1-514-575-6910FAX:+1-450-679-9477E-mail:jean-levy.beaudoin@solvision.net |
|
|
|
English
|
OSPREY800The revolution in OSP thickness
measurement |
|
11:50
12:20 |
Sean O'flaherty,OXFORD INSTRUMENTS,FLEX-SERVICE CO.,LTD. |
| OSPREY 800 provides spectroscopic non-destructive optical metrology of OSP coatings using reflectometry. | |
| TEL:047-487-0552FAX:047-487-0558E-mail:cmijapan@db3.so-net.ne.jp http://www.flex-service.com |
| The Front
Technology of Design and Analysis Solution for Next Generation |
|
|
|
Japanese
|
Power Integrity design for DDR memory system |
|
12:30
13:00 |
Mikio Kiyono,Director Engineering Division,AET, Inc. |
| We will introduce 3D Electromagnetic-Field Simulator "MW STUDIO 2006B" in terms of the power integrity analysis of DDR memory and EMI analysis. | |
| TEL:044-980-0505FAX:044-980-1515E-mail:info@aetjapan.com |
|
|
|
Japanese
|
The simulation techniques to reduce the total cost of PCB design |
|
13:10
13:40 |
Toshiya Saito,Sinior Sales Representative, PCB Group, EDA Solution Department, Applied Systems Second Division,Cybernet Systems Co., Ltd. |
| Recently, the simulation is necessary to design PCB. We introduce the way of cost reduction for PCB design using the simulation techniques and tools. | |
| TEL:03-5978-5696FAX:03-5978-6081E-mail:allegro@cybernet.co.jp http://www.cybernet.co.jp/eda/apd/event |
|
|
|
Japanese
|
Thermal management design of printed circuit boards with the high power devices |
|
13:50
14:20 |
Hideki Mizushina,Satoru Haga,Design Solution
Department, Engineer, General Manager, Oki Printed Circuits Co.,Ltd. |
| Effective thermal management design methods especially for PCBs including the high power devices are presented. | |
| TEL:03-3526-3701FAX:03-3526-0550E-mail:opc-sales@oki.com |
|
|
|
Japanese
|
Introducing Concurrent PCB Design |
|
14:30
15:00 |
Naoki Hata,R&D Division / EL Section Manager,ZUKEN Inc. |
| Concurrent PCB Design allows two or more designers to edit one PCB data at the same time. Thereby, it enriches the design environment with increased efficiency, and enables to shorten the delivery date. | |
| TEL:045-942-1912FAX:045-942-7350E-mail:zuken-eda@zuken.co.jp http://www.zuken.co.jp |
| The Latest FPC Manufacturing Technology Trend |
|
|
|
Japanese
|
Developement of Photoimageable Coverlay Film |
|
15:10
15:40 |
Shuji Tahara,Electronic & Engineered Materials Group, Circuit Materials Group,Mitsui Chemicals, Inc. |
| Mitsui Chemicals has newly developed a high quality flexible photoimageable coverlay film, which features are halogen-free and non-flammable. | |
| TEL:0438-64-2327FAX:0428-64-2355E-mail:Syuji.Tahara@mitsui-chem.co.jp |
|
|
|
Japanese
|
The recent trend of treated rolled copper foil for the advanced FPCs |
|
15:50
16:20 |
Atsushi Miki,Development Center,NIPPON MINING & METALS CO., LTD. |
| Super high flex rolled copper foil for the smaller size and lower stiff FPC will be introduced. The new developed copper foil and surface treatment for HDI FPC will be reported. | |
| TEL:03-5573-6555FAX:03-5573-6778E-mail:t.moriya@nikko-metal.co.jp |
|
|
|
Japanese
|
Development of Proximity Exposure |
|
16:30
17:00 |
Nobuaki Tauchi,Fine Process Sales Dept. Fine Process Business
Unit, Electronics Div., Toray Engineering Co. Ltd. |
| The latest situation and an action of a proximity exposure | |
| TEL:03-3241-1541FAX:03-3241-1553E-mail:misa_hayashi@toray-eng.co.jp |
|
Fri., June 1
|
| The Latst Technology Trend for FPC Materials |
|
|
|
Japanese
|
Apprication for PI etchant |
| 10:30
11:00 |
Takashi Oguni,Engineer Customer Support Dept. Fine Process Business
Unit, Electronics Div., Toray Engineering Co. Ltd. |
| A characteristic of PI etching method of construction and the latest situation and an action | |
| TEL:03-3241-1541FAX:03-3241-1553E-mail:misa_hayashi@toray-eng.co.jp |
|
|
|
Japanese
|
Halogen-Free and Dust-Free Bonding Sheet with the glass fabric reinforcement "R-B755" |
| 11:10
11:40 |
IKatsuhiko Ito,Flexible Circuit Material Business Group, New Business
Promotion Division, Electronic & Plastic Materials Business Unit,Matsushita Electric Works, Ltd. |
| We introduce halogen-free Bonding Sheet with the glass fabric "R-B755" for FPC. It reduces a quantity of dust generated by the external form process. | |
| TEL:06-6908-8132FAX:06-6908-1858E-mail:hiromi.n@mewe1.mewnet.or.jp |
|
|
|
Japanese
|
Halogen Free Liquid Photosensitive Coverlay |
| 11:50
12:20 |
Masakazu Fujiwara,Research & Development Division Assistant
Manager, KYOCERA CHEMICAL Corporation |
| We explain the characteristic and the usage of Halogen Free Liquid Photosensitive Coverlay. It has excellent ion migration resistance and combustibility. | |
| TEL:048-225-6846FAX:048-225-0085E-mail:webmaster.kcc@kyocera.jp |
| "NPI
Presentation" is a new product, new technological public relations
seminar by the JPCAShow2007/2007 |
| Microelectronics
show /JISSOPROTEC2007 exhibitior's. Be careful in the case of the application
because |
| 3
session is simultaneous progress. |
| And,
ask directly in each attendance application point (in such cases as
URL that it sends FAX and E-mails it) |
| when
it hopes for the attendance. |
 |