청강을 희망하시는 경우는 각 강연 마다의 신청이 됩니다.
각 연제하의 빨강 문자(TEL, FAX, E-mail, URL등 ) 연락처에 직접 문의해 주세요.
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| 회장：TOKYO BIG SIGHT 동쪽 전시동１F A?C회장( 각 회장 80명 정원) |
청강을 희망하시는 경우는 각 강연 마다의 신청이 됩니다. |
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Wed., May 30
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| The Latest Trend for Embedded Technology |
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Japanese
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Current attainment point of our embbeded
technology (W-CSP,resistor,capacitor available) |
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12:30
 13:00 |
Hiroshi Iinaga,R&D General Manager,Oki Printed Circuits Co.,Ltd. |
| To correspond to the high density, the embedded technology is developed. Our technology can embed W-CSP and the passive .We will explain the latest trend of our technology. | |
TEL:03-3526-3701 FAX:03-3526-0550 E-mail:opc-sales@oki.com |
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Japanese
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Power Integrity and EMI design solution using very thin Buried Capacitor |
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13:10
13:40 |
Yoshi Fukawa,West Coast operations, Representative,OAK-Mitsui Technologies, LLC. |
| Will be presenting a reduction of a power plane impedance, resonance and EMI by utilizing thinner CCL core (less than 24 um) for the power and ground layer of the PCB inner layer with showing the simulation results and the measurement results. | |
| TEL:048-777-2702 E-mail:tseiki@mitsui-kinzoku.co.jp Toshiyuki
Seiki |
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Japanese
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Wireless Microwave Circuits Embedded in Printed Circuit Boards |
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13:50
14:20 |
Akira Saitou,Department manager, Technoligy Development Department,YKC Corporation |
| Integrated microwave circuits embedded in PCBs are demonstrated. The circuits are distinguished for high performance, size, design accuracy and cost. | |
| TEL:042-560-3511FAX:042-560-3516 E-mail:ykc-seminar@ykc-j.com http://www.ykc-j.com |
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Japanese
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Functional precious metal materials for inner conductor |
| 14:30
15:00 |
KOICHI AZEGAMI,ENGINEERING DPARTMENT TEAM LEADER,NORITAKE CO.,LIMITED |
| The multilayer chips well-known for MLCC are making rapid technical progress in downsizing, multilaying, high-functionalizing and so on. We introduce our most advanced technology of precious metal materials for conductor which has higher funcitions and efficiencies. | |
| TEL:0561-34-1272FAX:0561-34-4903 E-mail:emsd@n.noritake.co.jp http://www.noritake.co.jp/ |
| The Latest Trend
for High density Plating and Surface Finishing Process |
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Japanese
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Technology of through hole filling process |
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15:10
15:40 |
Hiroshi Ishizuka,Reserch & Development Center 1st Development Office,EBARA-UDYLITE CO., LTD |
| The cost reduction become possible by use through hole filling process(TF2).In this presentation, I report it mainly on performance of TF2. | |
TEL:03-3835-2951 |
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Japanese
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HIGH PERFORMANCE FINAL FINISHING PROCESS "PAUROBOND™" |
| 15:50
16:20 |
Rikiya Shimizu,CIRCUIT BOARD TECHNOLOSIES MARKETING DIRECTOR,ROHM AND HAAS ELECTRONIC MATERIALS K.K. |
| PAUROBOND™ is 3-layer Metaliization Process of Erectroless Ni/Pd-P/Immersion Au Plating. Especially the formation of Pd layer enables final finishing to be uniformed and no defective. | |
| Please come to the Presentation Room. |
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Japanese
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SMC's Equipment for HDI Production |
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16:30
17:00 |
Tadashi Hirakawa,Managing Director,SMC Japan Co., Ltd. |
| SMC's advanced equipment for HDI is described esp. on horizontal Cu plating equipment and Vacuum Etching machine, incl. Reel-to-reel for COF and BOC. | |
TEL:03-6717-6058 |
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Thur., May 31
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| The Latest Trend for Inkjet Technologies |
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Japanese
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The latest technology of precise liquid control by Inkjet dispenser etc. |
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10:30
11:00 |
Kazuteru Tomiyama,Business planning dept. Manager,MUSASHI ENGINEERING, INC. |
| We introduce the latest technological trend of precise liquid control in mounting by Inkjet dispenser and Jet dispenser. | |
| Please come to the Presentation Room. |
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Japanese
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Revolution of Printable Electronics by Ink Jet Technologies |
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11:10
11:40 |
Shinichi Nishi,R&D Division General Manager,KonicaMinolta IJ Technologies Inc., |
| "Printable Electronics" by ink jet technologies makes big
benefits 1)direct paterning on a large substrate, 2)maskless manufacturing 3)small loss of coated materials. |
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| TEL:042-589-3701FAX:042-598-3865 E-mail:fu.kuwata@konicaminolta.jp |
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Japanese
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LTCC Multi-Layer Substrates with Fine and High Density Wiring Pattern |
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11:50
12:20 |
Masayuki Fudo,Product Management Group Sales Strategy Center / Line Leader ,KOA CORPORATION |
| LTCC multi layer substrate with fine-line wiring pattern were realized with ink-jet printing technology or thin-film production process technology. | |
| TEL:0265-77-3515FAX:0265-78-4637E-mail:Itcc@koanet.co.jp http://www.koaproducts.com |
| The Latest Trend of High Density JISSO(Packaging) Technology |
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Japanese
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Assembly data generation system "PC-MountCAM" |
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12:30
13:00 |
Rikio Nagai,Software Engineering,Dynatron Co.,Ltd. |
| PC-MountCAM supports the assembly drawing and specification generation to reduce processing times for preparation of assembly process. | |
| TEL:03-3940-9081FAX:03-3940-9080E-mail:support@dynatron.co.jp |
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Japanese
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Development trend of electrically conductive adhesive "DOTITE" brand. |
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13:10
13:40 |
Fujikura Kasei Co., Ltd.Erectronics
Materials Div. Technical Sec. 1Takeshi Kan |
| The conductive adhesives applicable for Sn plating electrode in surface mount devices are introduced. | |
| TEL:03-3436-1100FAX:03-3436-5416E-mail:t-shinjo@fkkasei.co.jp http://www.fkkasei.co.jp/ |
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Japanese
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Reliability of Lead-free Solder that is also Silver-free |
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13:50
14:20 |
Meguru Hamaguchi,Overseas Business Development Department,NIHON SUPERIOR CO., LTD. |
| The rise in the silver price has prompted demand for silver-free solder. We will compare the reliability of silver-containing and silver-free solders. | |
| http://www.nihonsuperior.co.jp/dm/NPI_070530.html |
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Japanese
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Pb-free Soldering of Immersion Tin using Air Atmosphere |
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14:30
15:00 |
Ken Hashimoto,Chief, Product Marketing Department, Electronics Business Division,Atotech Japan K.K. |
| This paper summarizes in-depth investigations of the wettability of I-Sn surfaces for Pb-free assembly, conducting reflow in air and nitrogen. | |
| TEL:045-937-6146FAX:045-937-6134 E-mail:Kiyoe.Ishizuka@atotech.com |
| The Latest Technology
Trend of Surface Finishing and Mechanical Driling |
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Japanese
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Evolving buff grinding |
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15:10
15:40 |
MUNEAKI GOYA,Sales Department,JABURO INDUSTRY CO.,LTD |
| We annouce the improvement results of the theme annouced with JPCA2004-2006. Example;Buff grinding for improving the rate of good products of JPCA2004. | |
| TEL:045-939-3351FAX:045-938-5751E-mail:info@jaburo.co.jp http://www.jaburo.co.jp/ |
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Japanese
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Development of Micro-Mechanical Drilling with high speed and high efficiency |
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15:50
16:20 |
Hidehito Watanabe,Tool Engineering Section Eng Department,UNION TOOL CO. |
| As mechanical drilling become smaller, drilling technique to reduce a cost is required. We introduce a technique corresponding to high productivity. | |
TEL:0258-22-2620 |
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German/ |
Technology Update of the European PCB Market |
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16:30
17:00 |
Thomas Kunz,President,Schmoll Maschinen GmbH |
| The presentation gives an overview of the latest challenges and requirements for PCB drilling and routing applications including CCD Technology in Europe. | |
| TEL:06-6531-2127FAX:06-6534-1660E-mail:k-tanaka@sgk-sanko.co.jp http://www.sgk-sanko.co.jp/ |
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Fri., June 1
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| The Latest Trend of Ultra High Density Plating Technology |
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Japanese
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Direct Plating Process "PDMT" |
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10:30 |
Tetsuji Ishida,Technical Development Dept. A, Central Research Laboratory,C.UYEMURA&CO., LTD |
| PDMT forms conductive thin films only at resin parts and directly does copper sulfate. Stable plating deposition and connection reliability expect to be achieved. | |
| TEL:06-6202-8532FAX:06-6202-8533E-mail:cpd@uyemura.co.jp |
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Japanese
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Special Additive for Acid Copper Plating "TOP LUCINA HG" |
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11:10
11:40 |
Takeaki Maeda,R&D Laboratory, Metal Finishing,OKUNO CHEMICAL INDUSTRIES CO., LTD. |
| TOP Lucina HG controls decrease of filling ratio under prolonged continuous usage and decreases formation of anode sludge. It improves productivity. | |
| TEL:06-6965-4112FAX:06-6963-0740E-mail:t-maeda01@okuno.co.jp |
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Japanese
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Increased Miniaturization With Trench Filling Technology |
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11:50
12:20 |
Toshiya Fujiwara,Chief, Product Marketing Department, Electronics
Business Division, Atotech Japan K.K. |
| This paper presents a system for the production of structures based on the trench filling with copper metallization using an insoluble anode module. | |
| TEL:045-937-6146FAX:045-937-6134E-mail:Kiyoe.Ishizuka@atotech.com |
| NPI
프레젠테이션 는 JPCAShow2007/2007 Microelectronics show /JISSO PROTEC 2007
출전자에 의한 |
| 신제품· 신기술 PR세미나입니다. |
| 3
세션 동시 진행이 되고 있기 때문에, 신청 시에는 주의해 주세요.덧붙여
청강을 희망하시는 경우는, |
| 각
청강 신청 장소(연제하의 빨강 문자로 나타내 보이는 TEL, FAX, E-mail, URL등 )에 직접 문의해 주세요 |
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