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Keynote Address JIEP Advanced Electronics Packaging (Jisso) Technology Symposium

The keynote speakers will present the state-of-the-art market trends, theme of future management trend and guide of future technology trend for Electronic Circuit and Advanced Electronics Packaging in conjunction with JPCA Show 2007/2007 Microelectronics Show/JISSO PROTEC 2007.

Ten sessions for Chip Stacked, PoP (Package on Package),High Frequency Packaging Design/Manufacture, FPC, Embedded Packaging Board, MEMS, Opto-electronics Packaging, Thermal Management and Nano Technology Ink Jet will be presented at JIEP Advanced Electronics Packaging Technology Symposium by charge.
A session of “JISSO Innovation in Japan” will present the most advanced packaging technology (Jisso) in Japan in English for all the participants from overseas.
JIEP Tutorials/Workshops NPI (New Product Introduction) Presentation (Exhibitors Seminar)

There are more than 18 Tutorials/Workshops in JIEP to exchange new technologies information and to promote cooperative technology development through own activities. Latest technological presentation will be presented during the show period.

This will provide a forum for presentation by the JPCA Show 2007/2007 Microelectronics show Exhibitors and discussion of the topics on exhibitors’ new products, advanced technologies, progressive business models with the participants. If you like to attend this technical forum, you are requested to ask about the application to each of lectures in the timetable at the JPCA Show 2007/2007 Microelectronics Show/JISSO PROTEC 2007 Official Web-site.
Open Seminar at JPCA Show 2007 Academic Facilities
& Laboratories Poster Program

You will be able receive several up-to-date technological information such as JPCA Standards, Beginners Sessions, Plating Technologies, etc. on the show floor.

Display of technical posters and discuss on the latest research programs by Universities, Research Institutes, and public laboratories during the show period.

Electronic Circuits Plaza Electronics Handicraft Class
JPCA Electronic Circuit Board Maker and JPCA Plating Process Maker have gathered at Electronic Circuit Plaza during the show period to introduce their technologies in electronics from very basic to sophisticated ones such as Printed Wiring Board, Plating, also included are Circuitry Technology, Technical Support, so-called Total Service and others. This class will be opened for younger generations and those people who are not familiar with electronic board and electronics packaging so that they will be able to easily understand the essence of “Electronic Circuits Technology and the pleasure of Electronic Circuits Manufacturing” through this event.
 
   

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Managed by: JPCA-Japan Electronics Packaging and Circuits Association KairoKaikan 2F., 3-12-2, NishiogiKita, Suginami-ku, Tokyo 167-0042 Japan
Phone:81-3-5310-2020/Fax:81-3-5310-2021
e-mail:show@jpca.org http://www.jpca.org/
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