E-mails it) when it hopes for the attendance.
|
| Place:NPI Presentation Room A·B·C , East Hall 1F , TOKYO BIG SIGHT( 80 seats capacity per Room). |
| When you attend a presentation, you confirm a timetable,
and ask for a way to confirm about each presentation application. And,
ask directly in each attendance application point (in such cases as URL
that it sends FAX and E-mails it) when it hopes for the attendance. |
|
|
|
Wed., May 30
|
| The Latest Trend for Package Substrate |
|
|
|
Japanese
|
Base material with inner layer VIA hole for ultra thin & high density printed wiring board "Zxy Lami" |
|
12:30
 13:00 |
IKUO SUGAWARA,Printed Wiring Board Material R&D Dept. Printed
Wiring Board Material Div. Staff Researcher,Hitachi Chemical Co., Ltd. |
| We have developed "Zxy Lami" collaborated with green high Tg material "MCL-E-679FG" and "ALIVH" interconnection technology using conductive paste. | |
| http://www.hitachi-chem.co.jp/ |
|
|
Japanese
|
Halogen Free & Narrow-Pitch IC-Substrate Materiais MEGTRON GX "R-1515S" |
|
13:10
13:40 |
Abe Tomoyuki,Product Development Group, Electronic Materials Division, Electronic & Plastic Materials Business Unit,Matsushita Electric Works, Ltd. |
| We introduce the halogen-free CCL "R-1515S" for narrow-pitch IC-substrate withThermal-resistant, high-Tg and high insulation reliability. | |
TEL:06-6908-8132 FAX:06-6908-1858E-mail:hiromi.n@mewe1.mewnet.or.jp |
|
|
|
Japanese
|
CatalystBond the novel pre-treatment process for E-less Cu plating for PKG Board |
|
13:50
14:20 |
Toshifumi Kawamura,Innovative Materials Development Center,
Isohara Plant, Nippon Mining & Metals Co., Ltd. |
| CatalystBondhas a good performance on the peel strength for PKG boards, which can get it on the low profile of special materials for PKG. | |
| TEL:03-5573-6577FAX:03-5573-6778E-mail:nakazato@nikko-metal.co.jp |
|
|
|
Japanese
|
The latest trend concerning about highly functional copper foil |
|
14:30
15:00 |
Hisanori Manabe,R&D Dept. EF Group Assistant Supervisor, FUKUDA METAL FOIL & POWDER CO., LTD. |
| We present the latest technical trend of ED and RA. Special type ED "SV" and High Bendability RA "RCFD" will be introduced. | |
| TTEL:03-3275-0316FAX:03-3271-4425E-mail:n-nakaya@fukuda-kyoto.co.jp http://www.fukuda-kyoto.co.jp |
| The Lates Trend of evolving Lazer Direct Imaging |
|
|
|
Japanese
|
DryFilm for Laser Direct Imaging "Riston® LUV series" |
|
15:10
15:40 |
Kenji Yagi,Research Chemist, R&D,DuPont MRC DryFilm Ltd. |
| "Riston® LUV series" are LDI DryFilms with high sensitivity and resolution. Their properties and applications will be introduced in this presentation. | |
TEL:03-5521-2400 |
|
|
|
Japanese
|
ORC's New Direct Imaging System |
|
15:50
16:20 |
Akira Samaki, Sales Group, DI Department,ORC MANUFACTURING CO., LTD. |
| We introduce our high-productivity New Direct Imager, integrating technologies of Data Process acquired from PENTAX and of our Auto Exposure Machine. | |
| E-mail:npi-jpca2007@orc.co.jp |
|
|
|
English
|
Build-up Embedded Actives |
|
16:30
17:00 |
Yung-Hui Wu,President,Career Technology (Mfg.) Co., Ltd. |
| An active-chip embedded technology based-on build-up processes will be demonstrated here. Key technical issues including die attachment, via formation, build-up on active chips, and interface compatibility will be addressed both in simulation studies and experimental results. It is noted not only static stress analysis after packaging but also the stress variation between-process with different materials are explored to help audience understand more the key concerns about structure design, material evaluation, and failure mode analysis. | |
| TEL:886-2-2202-3232FAX:886-2-2202-3000E-mail:michelle.chou@careergroups.com |
|
Thur., May 31
|
| The Latest Trend for Next Generation of IC Package Substrate |
|
|
|
Japanese
|
ADTEC's projection lens development roadmap for imaging of the next generation of IC package substrates. |
|
10:30
11:00 |
Takumi TANAKA,Director, General Manager, R&D Division,ADTEC Engineering Co., Ltd. |
| Introduction of ADTEC's latest projection lens for imaging the next generation of IC package substrates including its lens development roadmap. | |
| TEL:03-3433-4466FAX:03-3433-4330E-mail:sales@adtec-eng.co.jp http://www.adtec.com |
|
|
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Japanese
|
New application by vacuum printing method |
|
11:10
11:40 |
Yasunobu Murata,Fine Process Sales Dept. Fine Process Business
Unit, Electronics Div., Toray Engineering Co. Ltd. |
| The latest situation and an action of vacuum printing method of construction | |
| TEL:03-3241-1541FAX:03-3241-1553E-mail:misa_hayashi@toray-eng.co.jp |
|
|
|
Japanese
|
A novel approach for a Non-Etching Adhesion Promoter |
|
11:50
12:20 |
Shingo Kumashiro,Business Development Engineer,Atotech Japan K.K. |
| The presentation will explain the SecureTM HFz process for meeting the requirements of advanced IC manufactures for a "Non-etching" adhesion promoter. | |
| TEL:045-937-6146FAX:045-937-6134 E-mail:Kiyoe.Ishizuka@atotech.com |
| The current Trends of Imaging Process to realize fine patterns |
|
|
|
Japanese
|
Development of Dry Film Solder Mask |
|
12:30
13:00 |
Yoshiaki Homma,Sales & Marketing Department,Nichigo-Morton Co., Ltd. |
| Introduction of Dry Film Solder Resist instead of conventional liquid type for response to the trend of thinner PWB. | |
| TEL:0495-77-4581FAX:0495-77-0434E-mail:yhonma@nichigo-morton.co.jp |
|
|
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Japanese
|
Performance and future prospect for new-type vertical projection exposure system [EXP-2431] |
|
13:10
13:40 |
DUK LEE,EXPOSURE SYSTEMS DEPARTMENT DESIGNING GROUP OPTICAL/SOFTWARE, LEADER,ORC MANUFACTURING CO., LTD. |
| Introduction & prospect of vertical projection exposure system EXP-2431with 3-kinds wavelength, vertical exposure, XY individual scaling function. | |
| E-mail:npi-jpca2007@orc.co.jp |
|
|
|
Japanese
|
The recent trends in the Super Etching Process ( vacuum system) technology. |
|
13:50
14:20 |
Eishirou Kawana,The engineering and research staff.,CHEMITRON INC. |
| Introduction of a proprietary technology for fine and high definition etching and thick-layered copper foil upon integration of vacuum and conveyance system | |
| TEL:03-5324-6041FAX:03-5324-6040 E-mail:chemi02@olive.ocn.ne.jp |
|
|
|
Japanese
|
Photosensitive film for semi-additive
process with 20 µm pitch "RY-3500 series" |
|
14:30
15:00 |
Masao Kubota,Researcher, Photosensitive Film R&D Dept.,
Photosensitive Film Div., Hitachi Chemical Co., Ltd. |
| We introduce characteristics and technologies of the newly developed film, which has higher adhesion, higher resolution, shorter resist foot and etc. | |
| http://www.hitachi-chem.co.jp/ |
| The High Tg Materials and Surface Finishing Technology Trend |
|
|
|
Japanese
|
Flexible High Tg and Halogen Free Dielectric Materials (Resin Film or RCC) |
|
15:10
15:40 |
NAOYA KAKIUCHI,LEADER PWB MATERIALS R&D,TAMURA KAKEN CORPORATION |
| We developed flexible high Tg and halogen free dielectric materials for flexible multilayer and flex-rigid. The product styles are Resin Film and RCC etc. | |
| TEL:04-2934-4062FAX:04-2934-2997
E-mail:naoya.kakiuchi@tamura-ss.co.jp |
|
|
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Japanese
|
Blister Free PTH Processes for High Tg and Exotic Base Materials |
|
15:50
16:20 |
Koji Semba,Chief, Product Marketing Department, Electronics Business Division,Atotech Japan K.K. |
| How to modify the desmear & metallization processes in order to satisfy the dual needs of highest reliability & lead free soldering will be presented. | |
| TEL:045-937-6146FAX:045-937-6134 E-mail:Kiyoe.Ishizuka@atotech.com |
|
|
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Japanese
|
Developer Filtration |
|
16:30
17:00 |
Kiyokazu Kurosawa,CUNO Division Fluid Processing Market Dept.,SUMITOMO 3M LIMITED |
| In developing process, the filtration life seems common issue as the amount of impurities contains quite a lot. We introduce an innovative new filter with its long life. | |
TEL:03-3709-9235 |
|
Fri., June 1
|
| The Testing and Evaluation Technology Trend |
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|
|
Japanese
|
Revolutionary non-destructive OSP thickness instrument for Glicoat-SMD |
|
10:30
11:00 |
Yousuke Kurita,Fine Chemicals Sales Dept.,Shikoku Chemicals Corporation |
| Accurate, fast and non-destructive thickness instrument for World No.1 OSP "Glicoat-SMD" helps quality control for PWB and Assembling manufacturers. | |
| TEL:043-296-4104FAX:043-350-3580E-mail:kuritay@shikoku.co.jp |
|
|
|
Japanese
|
Testing High Density Printed Circuit Board to Enhance Productivity |
|
11:10
11:40 |
HIOKI E..E. CORPORATION Engineering Division 7, ATE Engineering Department Manager Hidehiko
MITSUGI |
| Hidehiko MITSUGI,Manager, Engineering Division 7, ATE Engineering
Department, HIOKI E..E.. CORPORATION |
|
| Importance of electrical tests is on the rise. We introduce our latest electrical test technologies for state-of-the-art printed circuit board. | |
| TEL:0268-28-0560FAX:0268-28-0569 E-mail:nfo@hioki.co.jp |
|
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Japanese
|
Introduction of estimation survices for reliability |
|
11:50
12:20 |
Hiroyuki Morimoto,Technology Dept.,Electronics Div. Dupty Manager, KOBELCO RESEARCH INSTITUTE,INC. |
| Introduce estimation survices including ,fairure analysis of bonding parts, evaluation@of corrosive resistance, strength, durability test for electric parts. | |
| TEL:078-272-5695FAX:078-265-3622E-mail:info_it@kobelcokaken.co.jp http://www.kobelcokaken.co.jp |
| "NPI
Presentation" is a new product, new technological public relations
seminar by the JPCAShow2007/2007 |
| Microelectronics
show /JISSOPROTEC2007 exhibitior's. Be careful in the case of the application
because |
| 3
session is simultaneous progress. |
| If,
ask directly in each attendance application point (in such cases
as URL that it sends FAX and E-mails it) |
| when
you hope for the attendance. |
 |