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| 会期:5月30日(星期三)～6月1日(星期五) |
| 会场:TOKYO BIG SIGHT 东展示栋、东1大厅·D会场 |
| 听讲:免费(定员80名) |
| 如果被希望听讲成为每各讲演的申请 |
| 请直接询问到各演讲题目下的红文字(TEL，FAX，E-mail，URL等)联络处。 |
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5月30日(星期三)
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Japanese
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Stabilizing print quality |
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11:00
 12:00 |
Manabu Mizuno,VST Project,FUJI Machine Mfg. Co,. Ltd. |
| A presentation on how Fuji plans to address the issue of stable print quality when solder printing on ever-increasingly thin, high-density panels. | |
E-mail:entrymm@fuji.co.jp  FAX:0566-81-2121URL:http://www.fuji.co.jp |
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Japanese
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Inspection in diversifing era |
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13:00
14:00 |
Masayuki Ohta,Senior Manager, Inspection Instruments Business Sect.,Peripherals
Business Dept.,Manufacturing Equipment Div.,Sony Manufacturing Systems
Corporation |
| The investment of equipment is migrating from high density to application of FPD and car electronics. It proposes the inspection machine in such an age. | |
| 0480-23-2641/1425xYukino.Tobari@jp.sony.com |
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Japanese
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Challenge for defect "0" production |
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14:30
15:30 |
Kouki Sugiuchi,Automation and Drives Division Electronics Assembly
Systems Dept. |
| We explain to the audience how Siemens placement machine and system can cope for defect "0" production? | |
TEL:03-5798-2311 |
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Japanese
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Future Trend for Bulk Mounting Technology and 4mm width 1mm pitch Embossed Carrier Tape |
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16:00
17:00 |
George Kobayashi,SMT & Package Engineering Section, JISSO Engineering
Department, R&D Group, Components Business Unit,Murata Mfg. Co.,Ltd. |
| We present a trend of Bulk Mounting and W4P1 embossed carrier tape packaging Technology. They provide several advantages such as environmentally friendly, space efficiency, clean mounting process and mounting stability. | |
| Registration was finished.Confirm it in the day Presentation Room |
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5月31日(星期四)
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Japanese
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Fine Pitch Flip Chip Technology Development using SMT Process - New Proposal for Advansed SiP/PoP Packaging - | |
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10:00
10:30 |
TORIYAMA KAZUSHIGE,Manager,IBM Japan,Ltd. High Density Packaging Technology Deivision | |
| PoP(Package on Package) is the emerging technology for the digital consumer electronics products such as mobile phone, however the disadvantage of PoP is that the final stack up height from the top package to bottom package is higher than that of the current stacked die packages. To resolve this height issue, FC(flip chip) technologies must be introduced. Since less than 80um pad pitch in logic chip is widely used for mobile application area, the ultra fine pitch FC interconnection technique is required. Although the interconnection between Au stud bump (Chip) and Sn/Ag pre-solder (carrier) was developed and used in industry,there are some issues such as material costup and long tact time. To resolve these issues, C4 interconnection technique with Cu post and Sn/Ag solder bump, which is formed on Al pad for wirebonding, was developed and it is realized by Mount & Reflow process which is the standard SMT process. |
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| TEL:077-587-7191FAX丗077-587-8484E-mail:ktoh@ibm.com |
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Japanese
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Suggestions for advanced equipment to support new technology |
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11:00
12:00 |
Tomohiko Hattori,Marketing Intelligence Manager,FUJI Machine Mfg. Co,. Ltd. |
| A talk on compact modular mounters that support upcoming new technology, various production patterns and are also flexible with a high operation rate. | |
| E-mail:entryth@fuji.co.jp |
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Japanese
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New AOI/AXI with high inspection quality |
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13:00
14:00 |
Kakuda Yoshihisa,Group Leader of Engineering Group 3,YAMAHA Motor
Co.,Ltd. I-PULSE Co.,Ltd. |
| Introduction of inspection machine that has further high quality and high price performance, and enables simultaneous X-ray check with in-line. | |
| Please remind you that applicants are limited. |
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Japanese
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YG300 with ultra-high volume and high placement quality |
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14:30
15:30 |
Takagi Hiroyuki,Manager,IM Company,SMT engieering group,YAMAHA Motor Co.,Ltd. |
| A further high quality and productivity are demanded by upgrading mobile etc. It introduces development process and key technology of YG300 with case. | |
Please remind you that applicants are limited. |
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Japanese
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Approach to the solution of the mounting system |
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16:00
17:00 |
Shigeo Katsuta,Manager, Application Software Development
Group, Application Software Development Group, Chip Mounter Development
Dept.,Design Division,Hitachi High-Tech Instruments Co., Ltd. |
| GXH series Hitachi modular mounter: Approach to the solution of the production support and expansion toward the future. | |
| TEL:0276-61-9741FAX:0276-61-8709E-mail:morita-kenichi@hitachi-hitec-hti.com |
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6月1日(星期五)
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Japanese
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Further developments of modular pick & place |
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11:00
12:00 |
Kazuya Mitsumori,Electronic Assembly & Test Systems Div.,JUKI CORPORATION |
| Pick & placers are getting modular. Juki, as pioneer proposing its modular-concept first in midium-sized machines, further grows to meet market needs. | |
| Please remind you that applicants are limited. |
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Japanese
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SMT Trend for Movile Devices and Solution |
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13:00
14:00 |
MORITA Takeshi,Electronic Component Mounting Systems & Solution
Business Unit, Staff Engineer,Panasonic Factory Solutions Co., Ltd. |
| Explanation of SMT trend for movile devises and Introduction of Panasonic's solutions for the technorogy trend. | |
| Please remind you that applicants are limited. |
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Japanese
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The latest printing technology for devices without connection leads |
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14:30
15:30 |
Noriaki Mukai,Chief Engineer, SMT Design Department, Electronic Systems Integration Division, Mechatronics Group ,Hitachi Plant Technologies, Ltd. |
| Introduction of latest printing technology for bump forming to meet remarkable change from lead connection to bump connection in accordance with the trend of smaller, lighter and multi-functional electronic devices. | |
| TEL:03-3516-7931FAX:03-3516-7933E-mail:yuji.ono.tz@hitachi-pt.com |
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