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| Scope of PWB Technology Expo 2006 Exhibits |
| Rigid-type PWBs, Build-up MLBs, Flex-Rigid Circuits, Base
Materials for Rigid-type Boards, PWB Manufacturing Process
Materials (Chemicals, Ink, Film,
etc.) and Equipment, Fabrication related Equipment and Materials,
PWB Technology related Publications, Information, Services,
etc. |
| Exhibition Layout |
| The layout of the PWB Technology Expo 2006 is allocated with
several areas of the products/technology fields among PWB, Base
Material, Mechanical Process, Imaging Process, Surface Finishing,
and Process Materials such as inks, films, and related materials
for the visitors easily to find their targets. The expo has
two special zones which the many of visitors are interested
in as named of "Laser Writing Zone" and "Plating
Process Zone" as well. Since those zones are independently
allocated from other areas, exhibitions of any laser technologies
which are applying to several products development and the plating
technologies not only for electronic board manufacturing process
but also semiconductor plating, various devices/components/lead-flames
plating, plating technologies for automobile/industrial equipment
are suggested. |
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| Scope of FPC Expo 2006 Exhibits |
| Flexible Circuits, Multi-layered FPC, TAB, COF, TCP, Applications
Products used by FPCs (FPD Module, Drive Module, etc.), Film/Tape
Materials, Flexible
Circuit Manufacturing Process Materials and Equipment, Fabrication
related Equipment and Materials, Special Die, Punching/Auto-cutter
machines, FPC
related Publications, Information, Services, etc.. |
| Exhibition
Layout |
| In FPC Expo 2006, the COF Area and Display Module Area will
be set as special technology fields to satisfy the visitors
interests. Since those areas are allocated independently from
the other exhibition spaces, the exhibition of COF technology
for bare-chip packaging module and exhibiting not only finished-product
of display module such as PDP, EL, LCD, FED/SED, electronics
papers, and so on but its process machine, devices, related-materials,
and repair equipment are also suggested. |
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| Scope of DES Expo 2006 Exhibits |
| Application Soft Wear, Electronic Circuits Design, System
Consultation Service, EMS/ODM Business, Communication Network
Solution, Internet Solution,
Multimedia System Solutions, CAE Tools (CAD/CAM/CIM), Product
Design Technology, Hard Wear Design, Model Development System,
Molding, Rapid
Prototyping System, DES related Publications, Information,
Services, etc. |
| Exhibition Layout |
| In DES (Design and manufacturing Engineering Solutions) Expo
2006, RP (Rapid Prototyping) System Area will be specially set.
RP system tools, such as optical molding equipment, 3-D high
speed simulator, and so on, which can provide a solution for
reduction of the production time from developing to shipping,
for enrichment of the cost performance, for any requirements
of customers are suggested exhibition. Since those exhibition
field is independently allocated from other exhibiting categories,
Exhibition of RP systems for not only design of consumer hardware
and industrial equipment but RP Technologies for automotive,
biological/medical equipment, security system, educational products,
amusement, services are also recommended. |
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| Scope of MicroTEST 2006 Exhibits |
| Electronic Board & Electronic Circuits Testing/Inspection
System, Image Controller/Recognition System, 3-D Measuring
Equipment, Analyzers, Special Tools
for Testing and Measuring/Inspection System, Test/Inspection
Business, Sensing Imaging Technology, Virtual Reality Technology,
etc. |
| Exhibition Layout |
| In MicroTEST 2006, Sensing via Image Area will be set separately
from general exhibition category. Sensing via Imaging technology
is necessary for testing equipment, inspection machines and
analyzing hardware, and watched with keen interest. Exhibition
of image processing system as manufacturing process, assembly,
inspection and control tools is not only suggested, but the
systems for several applications such as space/earth study,
biological/medical equipment, educations, amusement, services
and so on are also recommended exhibition. |
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| Scope of 2006 Microelectronics Show Exhibits |
| Application Products with High-density/High-frequency electronics
packaging technologies, High-density Substrates/Interporzers,
IC Packages, Electronic
Components, Embedded Packaging Board, System-in-a-Package,
Display Device/Optical Device, Materials related to Electronics
Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste
Printing Machines, Equipment for manufacturing, Environmental
Consideration
technologies, Recycle System, Electronics Packaging (Jisso)
related Publication, Information, Services, etc. |
| Exhibition Layout |
| The Microelectronics Show exhibition space will proved two
areas such as "Dispensers/Mounting/Bonding Area" for
exhibition of high-density electronics packaging process and
"Soldering Area" for lead-free soldering process exhibition
in this time. |
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