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| In aiming for the realization of a Ubiquitous Society, JPCA Show has just launched its three-year strategy, designating 2005 as "the beginning", 2006 as "the development", and 2007 as "the expansion" stage of its strategy. This year's theme is... |
| "The Challenge, Starting for the Next Evolution" |
| At JPCA Show 2005 and 2005 Microelectronics Show, the industry will come together to present a strong message with a significant impact on IT, electronics, and relevant user industries throughout the world! |
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| Name: JPCA Show 2005 The 35th International Electronic Circuits Expo | ||
| JPCA Show 2005 will be formed by the following 4 exhibitions: | ||
| PWB Technology Expo 2005 | ||
| FPC Expo 2005 | ||
| DES (Design and manufacturing Engineering Solutions) Expo 2005 | ||
| MicroTEST (Testing/Inspection and Analysis Exhibition) 2005 | ||
| Sponsored by: JPCA-Japan Electronics Packaging and Circuits Association | ||
| In Conjunction with: | ||
| 2005 Microelectronics Show (19th Advanced Electronics Packaging Exhibition) | ||
| Sponsored by: JIEP-Japan Institute of Electronics Packaging | ||
| Managed by: JPCA-Japan Printed Circuit Association | ||
| Theme: "The Challenge, Starting for the Next Evolution" | ||
| Opening Dates: June 1 to 3, 2005 | ||
| Opening Hours: 10:00 to 17:00 (till 16:00 on June 3) | ||
| Place: TOKYO BIG SIGHT | ||
| Overseas Assistance: | ||
| World Electronic Circuits Council (WECC) Member Associations | ||
| CPCA China Printed Circuit Association |
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| EIPC European Institute of Printed Circuits | ||
| HKPCA Hong Kong Printed Circuit Association | ||
| IPC Association Connecting Electronics Industries | ||
| IPCA Indian Printed Circuit Association | ||
| KPCA Korea Printed Circuit Association | ||
| TPCA Taiwan Printed Circuit Association | ||
| Managed by: JPCA Show Steering Committee | ||
| Admission: 1,000 Yen (including consumption tax) | ||
| Scale: 35,000m2 | ||
| Number of Exhibitors: 500 companies | ||
| Number of Visitors: 100,000 persons | ||
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| Automatic Identification Manufacturer, Camera and Imaging Products Association,COPPERFOIL INDUSTRIES ASSOCIATION, Electronic Materials Manufacturers Association of Japan, Federation of Electro Plating Industry Association, Japan Analytical Instruments Manufacturers Association, Japan Association of Medical Equipment Industries, Japan Association of Rapid prototyping Industry, Japan Auto Parts Industries Association, Japan Business Machine and Information System Industries Association, JAPAN CHEMICAL INDUSTRY ASSOCIATION, Japan Die&Mold Industry Association, Japan Electric Measuring Instruments Manufacturers' Association, JAPAN ELECTRICAL INSULATING and ADVANCED PERFORMANCE MATERIALS INDUSTRIAL ASSOCIATION, Japan Electronics and Information Technology Industries Association, Japan Game-Associated Enterprise Corporation, Japan Heat Treatment Trade Association of Japan, Japan Information Technology Services Industry Association, Japan Measuring Instruments Federation, Japan Medical Devices Manufacturers' association, Japan Medical-Optical Equipment Industry Association, Japan Plating Suppliers Association, Japan Precision Measuring Instruments Association, Japan Robot Association, Japan Solvent Recycling Industry Association, JAPAN SURFACTANT INDUSTRY ASSOCIATION, Japan Testing Machinery Association, Japan Thermosetting Plastics Industry Association, Japan Vacuum Industry Association, Micromachine Center, National small business Information promotion Center, National Space Development of Japan, Nippon Electric Control Equipment Industries Association, Semiconductor Equipment Association of Japan, The Industries Association of Radiological Systems, The Institute of Electrical Engineers of Japan, The Institute of Image information and television engineers, The Insutitute of Image Electronics Engineers of Japan, THE JAPAN BEARING INDUSTRIAL ASSOCIATION, The Japan Electrical Manufacturers' Association, The Japan Society for Analytical Chemistry, The Japan Welding Engineering Society, The Japanese Electric Wire & Cable Makers' Association, The Photo-Sensitized Materials Manufacturers' Association, The Vacuum Society of Japan, Tron association, AEEMA, CEMA, GFIE, PCIF, VdL, SMCBA (expected) | |
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| To promote effective exhibition, the show site will be structured by the following 4 Exhibition-classifications: |
| PWB Technology Expo 2005 |
| Rigid-type PWBs, Build-up MLBs, Flex-Rigid Circuits, Base Materials for Rigid-type Boards, PWB Manufacturing Process Materials (Chemicals, Ink, Film, etc.) and Equipment, Fabrication related Equipment and Materials, PWB Technology related Publications, Information, Services, etc. |
| FPC (Flexible Circuits) Expo 2005 |
| Flexible Circuits, Multi-layered FPC, TAB, COF, TCP, Applications Products used by FPCs (FPD Module, Drive Module, etc.), Film/Tape Materials, Flexible Circuit Manufacturing Process Materials and Equipment, Fabrication related Equipment and Materials, Special Die, Punching/Auto-cutter machines, FPC related Publications, Information, Services, etc. |
| DES (Design and mfg. Engineering Solutions) Expo 2005 |
| Application Soft Wear, Electronic Circuits Design, System Consultation Service, EMS/ODM Business, Communication Network Solution, Internet Solution, Multimedia System Solutions, CAE Tools (CAD/CAM/CIM), Product Design Technology, Hard Wear Design, Model Development System, Molding, Rapid Prototyping System, DES related |
| Publications, Information, Services, etc. |
| MicroTEST (Testing/Inspection and Analysis Exhibition) 2005 |
| Electronic Board & Electronic Circuits Testing/Inspection System, Image Controller/Recognition System, 3-D Measuring Equipment, Analyzers, Special Tools for Testing and Measuring/Inspection System, Test/Inspection Business, Sensing Imaging Technology, Virtual Reality Technology, etc. |
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| The Microelectronics Show was operated by Japan Institute of Electronics Packaging(JIEP)in April every year. In 2005, this show is sponsored by JIEP and is managed by JPCA in conjunction with JPCA Show 2005 at Tokyo Big Sight. The Microelectronics Show is held for the top engineers who are specialized in research, design and development of substrates, materials and components, related to advanced electronics packaging technologies which are supporting the realization of high end information equipments and mobile devices. JIEP is continuously working for supplying the state-of-arts information to electronics industries and to the JIEP members. | |
| Scope of Microelectronics Show Exhibits | |
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Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc. |
| Name: | 2005 Microelectronics show |
| 19th ADVANCED ELECTRONICS PACKAGING EXHIBITION | |
| Theme: "Discover the Next Generation Technologies on Electronics Packaging!" | |
| Opening Dates: June 1 to 3, 2005 | |
| Opening Hours: 10:00 to 17:00 (till 16:00 on June 3) | |
| Place: TOKYO BIG SIGHT | |
| Sponsoring Organization: Japan Institute of Electronics Packaging (JIEP) | |
| Show Managing Organization: Japan Printed Circuit Association(JPCA) | |
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| Keynote Address/Special Lecturers sponsored by JPCA & JIEP | |
| Wednesday, June 1 to Friday, June 3, 2005 |  |
| The keynote speakers will present the state-of-the-art market trends, theme of future management trend and guide of future technology trend for Electronic Circuit and Advanced Electronics Packaging in conjunction with JPCA Show 2005 and 2005 | |
| JIEP Advanced Electronics Packaging (Jisso) Technology Symposium | |
| Ten sessions for System-in-a-Package/Multi Chip Package, Nano-technology, New Function Electric Adhesive, Lead-free Solder, ThinWafer/Chip-Packaging, High Frequency Packaging/New Substrate Materials, Flexible Printed Circuits, MEMS, Embedded Packaging Board and Opto-electronics Packaging will be presented at JIEP Advanced Electronics Packaging Technology Symposium by charge. |  |
| JIEP Tutorials/Workshops | |
| There are more than 20 Tutorials/Workshops in JIEP to exchange new technologies information and to promote cooperative technology development through own activities. Latest technological presentation by Reliability Analysis Technology Committee, Optical Packaging Technology Committee, Electronic Circuit Design Technology Committee, etc. will be presented during the show period. |  |
| Electronic Circuits Plaza | |
| JPCA Electronic Circuit Board Maker and JPCA Plating Process Maker have gathered at Electronic Circuit Plaza during the show period to introduce their technologies in electronics from very basic to sophisticated ones such as Printed Wiring Board, Plating, also included are Circuitry Technology, Technical Support, so-called Total |  |
| Academic Facilities & Laboratories Poster Program | |
| Display of technical posters and discuss on the latest research programs by Universities, Research Institutes, and public laboratories during the show period. |  |
| NPI (New Product Introduction) Presentation (Exhibitors Seminar) | |
| This will provide a forum for presentation by the JPCA Show 2005 Exhibitors and discussion of the topics on exhibitors' new products, advanced technologies, progressive business models with the participants. If you like to attend this technical forum, you are requested to ask about the application to each of lectures in the timetable at the JPCA Show 2005 Official Web-site. |  |
| Electronics Handicraft Class | |
| This class will be opened for younger generations and those people who are not familiar with electronic board and electronics packaging so that they will be able to easily understand the essence of "Electronic Circuits Technology and the pleasure of Electronic Circuits Manufacturing" through this event. |  |
| Open Seminar at JPCA Show 2005 | |
| You will be able receive several up-to-date technological information such as JPCA Standards, Beginners Sessions, Plating Technologies, etc. on the show floor |  |
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| Official URL SITE: http://www.jpcashow.com/ | |
| Please visit Official Web Site before participating at JPCA
Show 2005 and 2005 Microelectronics Show. You can find the latest information! |
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